JPS6382964U - - Google Patents
Info
- Publication number
- JPS6382964U JPS6382964U JP17869986U JP17869986U JPS6382964U JP S6382964 U JPS6382964 U JP S6382964U JP 17869986 U JP17869986 U JP 17869986U JP 17869986 U JP17869986 U JP 17869986U JP S6382964 U JPS6382964 U JP S6382964U
- Authority
- JP
- Japan
- Prior art keywords
- land
- hole
- circuit pattern
- insulating substrate
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000005259 measurement Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第1図は本考案の一実施例の平面図、第2図は
第1図の実施例のA―A′線断面図、第3図は従
来の印刷配線板の一例の平面図である。
1,1′……絶縁基板、2,2′……回路パタ
ーン、3……スルーホール、4……ランド、5…
…ソルダレジスト被膜、6……導通穴、7……測
定治具の端子、21……端部。
FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a sectional view taken along line A--A' of the embodiment of FIG. 1, and FIG. 3 is a plan view of an example of a conventional printed wiring board. 1, 1'... Insulating board, 2, 2'... Circuit pattern, 3... Through hole, 4... Land, 5...
...Solder resist film, 6...Conducting hole, 7...Terminal of measurement jig, 21...End portion.
Claims (1)
て設けられるランドと、該ランドと接続する回路
パターンのうち一方の端部が前記ランドに接続さ
れない前記回路パターンの前記端部に付設する非
貫通の導通穴と、前記ランド及び非貫通の導通穴
を除いて前記絶縁基板表面を覆つて形成される絶
縁性の被膜とを含むことを特徴とする印刷配線板
。 A land is provided on the surface of the insulating substrate to be connected to the through-hole conductive layer, and a non-through hole is provided at the end of the circuit pattern that is connected to the land and one end of the circuit pattern is not connected to the land. A printed wiring board comprising a conductive hole and an insulating coating formed to cover the surface of the insulating substrate except for the land and the non-penetrating conductive hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17869986U JPS6382964U (en) | 1986-11-19 | 1986-11-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17869986U JPS6382964U (en) | 1986-11-19 | 1986-11-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6382964U true JPS6382964U (en) | 1988-05-31 |
Family
ID=31121078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17869986U Pending JPS6382964U (en) | 1986-11-19 | 1986-11-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6382964U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012174494A (en) * | 2011-02-22 | 2012-09-10 | Shin Etsu Polymer Co Ltd | Electrostatic sensor sheet and manufacturing method thereof |
-
1986
- 1986-11-19 JP JP17869986U patent/JPS6382964U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012174494A (en) * | 2011-02-22 | 2012-09-10 | Shin Etsu Polymer Co Ltd | Electrostatic sensor sheet and manufacturing method thereof |