JPH0160571U - - Google Patents
Info
- Publication number
- JPH0160571U JPH0160571U JP15570287U JP15570287U JPH0160571U JP H0160571 U JPH0160571 U JP H0160571U JP 15570287 U JP15570287 U JP 15570287U JP 15570287 U JP15570287 U JP 15570287U JP H0160571 U JPH0160571 U JP H0160571U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- buyer
- holes
- service mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図はこの考案の一実施例によるプリント配
線板の断面図、第２図は電子部品搭載前のプリン
ト配線板の平面図、第３図はサービスマークの他
の印刷例を示すプリント配線板の平面図、第４図
は従来のプリント配線板の断面図、第５図は電子
部品搭載前のプリント配線板の平面図である。
１…プリント基板、２…導電体パターン、３…
ハンダ、４…ハンダ抵抗層、５…サービスマーク
、６…バイヤーホール、７…電子部品。なお、図
中同一符号は同一又は相当部分を示す。
Figure 1 is a sectional view of a printed wiring board according to an embodiment of this invention, Figure 2 is a plan view of the printed wiring board before electronic components are mounted, and Figure 3 is a printed wiring board showing another example of printing a service mark. FIG. 4 is a sectional view of a conventional printed wiring board, and FIG. 5 is a plan view of the printed wiring board before electronic components are mounted. 1... Printed circuit board, 2... Conductor pattern, 3...
Solder, 4...Solder resistance layer, 5...Service mark, 6...Buyer hole, 7...Electronic component. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
に接続するバイヤーホールを設けたプリント配線
板において、上記バイヤーホールをハンダ抵抗層
またはサービスマークあるいはその双方で、塞い
だことを特徴とするプリント配線板。 1. A printed wiring board provided with buyer holes for electrically connecting conductor patterns on both sides of a printed circuit board, characterized in that the buyer holes are covered with a solder resistance layer, a service mark, or both.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15570287U JPH0160571U (en) | 1987-10-12 | 1987-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15570287U JPH0160571U (en) | 1987-10-12 | 1987-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0160571U true JPH0160571U (en) | 1989-04-17 |
Family
ID=31433567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15570287U Pending JPH0160571U (en) | 1987-10-12 | 1987-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0160571U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017163390A1 (en) * | 2016-03-25 | 2017-09-28 | 株式会社日立産機システム | Printed board and printed board manufacturing method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61234595A (en) * | 1985-04-10 | 1986-10-18 | 三菱電機株式会社 | Printed wiring board |
-
1987
- 1987-10-12 JP JP15570287U patent/JPH0160571U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61234595A (en) * | 1985-04-10 | 1986-10-18 | 三菱電機株式会社 | Printed wiring board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017163390A1 (en) * | 2016-03-25 | 2017-09-28 | 株式会社日立産機システム | Printed board and printed board manufacturing method |
| JPWO2017163390A1 (en) * | 2016-03-25 | 2018-09-13 | 株式会社日立産機システム | Printed circuit board and printed circuit board manufacturing method |