JPS62204368U - - Google Patents
Info
- Publication number
- JPS62204368U JPS62204368U JP9307386U JP9307386U JPS62204368U JP S62204368 U JPS62204368 U JP S62204368U JP 9307386 U JP9307386 U JP 9307386U JP 9307386 U JP9307386 U JP 9307386U JP S62204368 U JPS62204368 U JP S62204368U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- multilayer wiring
- map
- conductive foil
- connection map
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の実施例における多層配線板の
銅箔側平面図、第２図及び第３図は、各々従来の
多層配線板の銅箔側平面図及び部品側側面図であ
る。
１……基材、２……導体箔、３……ダブルレジ
スト、４……スルーホール、５……ランド、６…
…接続マツプ。
FIG. 1 is a copper foil side plan view of a multilayer wiring board according to an embodiment of the present invention, and FIGS. 2 and 3 are a copper foil side plan view and a component side side view of a conventional multilayer wiring board, respectively. 1...Base material, 2...Conductor foil, 3...Double resist, 4...Through hole, 5...Land, 6...
...connection map.
Claims (1)
を有する多層配線板の少なくとも一方の片面に、
その面の導体箔とスルーホールを介して電気的に
接続された他の面の導体箔のパターンを表示した
接続マツプを有する多層配線板。 (2) 接続マツプは、その片面に塗布されるソル
ダーレジストとは別の色のソルダーレジストによ
り形成されている事を特徴とする実用新案登録請
求の範囲第１項記載の多層配線板。 (3) 接続マツプは、その片面に形成されたサー
ビスマツプとは別の色のサービスマツプ用インク
により形成されている事を特徴とする実用新案登
録請求の範囲第１項記載の多層配線板。[Claims for Utility Model Registration] (1) On at least one side of a multilayer wiring board having conductive foil with a predetermined pattern on each of multiple sides,
A multilayer wiring board having a connection map displaying a pattern of conductive foil on one side and conductive foil on another side that are electrically connected via through holes. (2) The multilayer wiring board according to claim 1, wherein the connection map is formed of a solder resist of a different color from the solder resist coated on one side of the connection map. (3) The multilayer wiring board according to claim 1, wherein the connection map is formed with a service map ink of a different color from that of the service map formed on one side of the multilayer wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9307386U JPS62204368U (en) | 1986-06-18 | 1986-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9307386U JPS62204368U (en) | 1986-06-18 | 1986-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62204368U true JPS62204368U (en) | 1987-12-26 |
Family
ID=30955341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9307386U Pending JPS62204368U (en) | 1986-06-18 | 1986-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62204368U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50160772A (en) * | 1974-06-17 | 1975-12-26 |
-
1986
- 1986-06-18 JP JP9307386U patent/JPS62204368U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50160772A (en) * | 1974-06-17 | 1975-12-26 |
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