JPS6149468U - - Google Patents
Info
- Publication number
- JPS6149468U JPS6149468U JP13276084U JP13276084U JPS6149468U JP S6149468 U JPS6149468 U JP S6149468U JP 13276084 U JP13276084 U JP 13276084U JP 13276084 U JP13276084 U JP 13276084U JP S6149468 U JPS6149468 U JP S6149468U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- resist layer
- printed
- copper foil
- printing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 2
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は、銅箔パターン上に絶縁管付で実装し
ている従来例を示す部分断面図、第２図は本考案
の一実施例であるプリント配線基板の部分平面図
、第３図は第２図と同一部分の部分断面図を示す
。
１，１ａ…対をなす２箇所の穴、２，３…銅箔
パターン、４…基板、５…レジスト層、６…シル
ク印刷のベタ層、９…ジヤンパー線、１１…絶縁
管。
Fig. 1 is a partial cross-sectional view showing a conventional example in which an insulating tube is mounted on a copper foil pattern, Fig. 2 is a partial plan view of a printed wiring board which is an embodiment of the present invention, and Fig. 3 is a partial cross-sectional view showing a conventional example of mounting an insulating tube on a copper foil pattern. A partial sectional view of the same part as FIG. 2 is shown. DESCRIPTION OF SYMBOLS 1, 1a... Two holes forming a pair, 2, 3... Copper foil pattern, 4... Substrate, 5... Resist layer, 6... Solid layer of silk printing, 9... Jumper wire, 11... Insulating tube.
Claims (1)
ジスト層５を形成するとともに、このレジスト層
５上に、前記基板４の部品実装側に印刷される部
品種別等と同一印刷版によりベタ部６を形成した
ことを特徴とするプリント配線基板。 A resist layer 5 is formed on the copper foil patterns 2 and 3 formed on the substrate 4, and a solid portion is printed on the resist layer 5 using the same printing plate as the component type printed on the component mounting side of the substrate 4. 6 is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13276084U JPS6149468U (en) | 1984-09-03 | 1984-09-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13276084U JPS6149468U (en) | 1984-09-03 | 1984-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6149468U true JPS6149468U (en) | 1986-04-03 |
Family
ID=30691320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13276084U Pending JPS6149468U (en) | 1984-09-03 | 1984-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6149468U (en) |
-
1984
- 1984-09-03 JP JP13276084U patent/JPS6149468U/ja active Pending