JPS6389297U - - Google Patents

Info

Publication number
JPS6389297U
JPS6389297U JP18280386U JP18280386U JPS6389297U JP S6389297 U JPS6389297 U JP S6389297U JP 18280386 U JP18280386 U JP 18280386U JP 18280386 U JP18280386 U JP 18280386U JP S6389297 U JPS6389297 U JP S6389297U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
shield case
region
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18280386U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18280386U priority Critical patent/JPS6389297U/ja
Publication of JPS6389297U publication Critical patent/JPS6389297U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図は本考案の一実施例の断面図である。 1……印刷配線板、2……シールドケース、3
……絶縁性基板、4……スルーホール、5……銅
めつき、6……半田コート、7……ソルダーレジ
スト、8……埋設したソルダーレジスト(文字印
刷インク)。
The figure is a sectional view of one embodiment of the present invention. 1...Printed wiring board, 2...Shield case, 3
... Insulating substrate, 4 ... Through hole, 5 ... Copper plating, 6 ... Solder coat, 7 ... Solder resist, 8 ... Embedded solder resist (character printing ink).

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 少なくともその表面一部にシールドケースを密
着配置する印刷配線板において、印刷配線板は、
前記シールドケースが密着される領域の表面を半
田コートにより仕上げるとともに、この半田コー
ト領域内に存在するスルーホール内にはソルダー
レジスト等の充填材を埋設したことを特徴とする
印刷配線板。
In a printed wiring board in which a shield case is closely disposed on at least a part of its surface, the printed wiring board is
A printed wiring board characterized in that the surface of the region to which the shield case is closely attached is finished with a solder coat, and a filler such as a solder resist is buried in the through holes existing in the solder coat region.
JP18280386U 1986-11-29 1986-11-29 Pending JPS6389297U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18280386U JPS6389297U (en) 1986-11-29 1986-11-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18280386U JPS6389297U (en) 1986-11-29 1986-11-29

Publications (1)

Publication Number Publication Date
JPS6389297U true JPS6389297U (en) 1988-06-10

Family

ID=31128942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18280386U Pending JPS6389297U (en) 1986-11-29 1986-11-29

Country Status (1)

Country Link
JP (1) JPS6389297U (en)

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