JPS63124773U - - Google Patents
Info
- Publication number
- JPS63124773U JPS63124773U JP1574887U JP1574887U JPS63124773U JP S63124773 U JPS63124773 U JP S63124773U JP 1574887 U JP1574887 U JP 1574887U JP 1574887 U JP1574887 U JP 1574887U JP S63124773 U JPS63124773 U JP S63124773U
- Authority
- JP
- Japan
- Prior art keywords
- predetermined
- conductor
- substrate body
- hole
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は、本考案の一実施例の概略構成を示す
説明図、第２図は、本考案の要部である導電体上
に形成するレジスト膜パターンの例を示す説明図
、第３図は、従来のプリント基板の概略構成を示
す説明図である。
１０……基板本体、１１……回路パターン、１
２……貫通孔、１３……導電体、１４……レジス
ト筋、１５……半田層、２０……プリント基板。
FIG. 1 is an explanatory diagram showing a schematic configuration of an embodiment of the present invention, FIG. 2 is an explanatory diagram showing an example of a resist film pattern formed on a conductor, which is the main part of the present invention, and FIG. FIG. 1 is an explanatory diagram showing a schematic configuration of a conventional printed circuit board. 10... Board body, 11... Circuit pattern, 1
2...Through hole, 13...Conductor, 14...Resist line, 15...Solder layer, 20...Printed board.
Claims (1)
該基板本体の所定領域に穿設された貫通孔と、該
貫通孔を囲むようにして前記基板本体上に貼着さ
れた導電体と、該導電体上に所定のパターンで形
成されたレジスト筋とを具備することを特徴とす
るプリント基板。 a board body on which a predetermined circuit pattern is formed;
A through hole drilled in a predetermined area of the substrate body, a conductor attached to the substrate body so as to surround the through hole, and resist stripes formed in a predetermined pattern on the conductor. A printed circuit board comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1574887U JPS63124773U (en) | 1987-02-05 | 1987-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1574887U JPS63124773U (en) | 1987-02-05 | 1987-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63124773U true JPS63124773U (en) | 1988-08-15 |
Family
ID=30806968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1574887U Pending JPS63124773U (en) | 1987-02-05 | 1987-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63124773U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0275775U (en) * | 1988-11-30 | 1990-06-11 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5420592U (en) * | 1977-07-13 | 1979-02-09 |
-
1987
- 1987-02-05 JP JP1574887U patent/JPS63124773U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5420592U (en) * | 1977-07-13 | 1979-02-09 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0275775U (en) * | 1988-11-30 | 1990-06-11 |