JPH01107165U - - Google Patents
Info
- Publication number
- JPH01107165U JPH01107165U JP101788U JP101788U JPH01107165U JP H01107165 U JPH01107165 U JP H01107165U JP 101788 U JP101788 U JP 101788U JP 101788 U JP101788 U JP 101788U JP H01107165 U JPH01107165 U JP H01107165U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- solder resist
- letter
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
Description
第１図および第２図は本考案の第１および第２
の実施例による印刷配線板の断面図である。第３
図は従来の印刷配線板の断面図を示す。
１１，２１，３１……ソルダーレジスト、１２
，２２，３２……ランド、回路、１３，２３，３
３……Ｖ字型溝、１４，２４，３４……印刷配線
板。
Figures 1 and 2 are the first and second figures of the present invention.
FIG. 2 is a cross-sectional view of a printed wiring board according to an embodiment of the present invention. Third
The figure shows a cross-sectional view of a conventional printed wiring board. 11, 21, 31...Solder resist, 12
, 22, 32... land, circuit, 13, 23, 3
3...V-shaped groove, 14, 24, 34...Printed wiring board.
Claims (1)
字型溝部にソルダーレジストを塗布したことを特
徴とする印刷配線板。 In a printed wiring board having a V-shaped groove, the V
A printed wiring board characterized by having solder resist applied to the letter-shaped grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP101788U JPH01107165U (en) | 1988-01-08 | 1988-01-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP101788U JPH01107165U (en) | 1988-01-08 | 1988-01-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01107165U true JPH01107165U (en) | 1989-07-19 |
Family
ID=31200536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP101788U Pending JPH01107165U (en) | 1988-01-08 | 1988-01-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01107165U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006060189A (en) * | 2005-02-03 | 2006-03-02 | Taihei Denshi Kogyo Kk | Method of manufacturing processing board |
-
1988
- 1988-01-08 JP JP101788U patent/JPH01107165U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006060189A (en) * | 2005-02-03 | 2006-03-02 | Taihei Denshi Kogyo Kk | Method of manufacturing processing board |