JPS6192079U - - Google Patents
Info
- Publication number
- JPS6192079U JPS6192079U JP17709384U JP17709384U JPS6192079U JP S6192079 U JPS6192079 U JP S6192079U JP 17709384 U JP17709384 U JP 17709384U JP 17709384 U JP17709384 U JP 17709384U JP S6192079 U JPS6192079 U JP S6192079U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- connection
- view
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 2
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は従来のプリント基板接続機構の側面図
、第２図は本考案の一例を示すプリント基板接続
機構の側面図、第３図は各プリント基板の構造を
示す斜視図、第４図は各基板の嵌合状態を示す底
面図、第５図を本考案の他の例を示す斜視図であ
る。
５…第１のプリント基板、６…第２のプリント
基板、７…半田付け部、５１…溝、５２…第１の
プリント基板の導体パターン部、６１…第２のプ
リント基板の導体パターン部。
Fig. 1 is a side view of a conventional printed circuit board connection mechanism, Fig. 2 is a side view of a printed circuit board connection mechanism showing an example of the present invention, Fig. 3 is a perspective view showing the structure of each printed circuit board, and Fig. 4 is a side view of a conventional printed circuit board connection mechanism. FIG. 5 is a bottom view showing a fitted state of each board, and FIG. 5 is a perspective view showing another example of the present invention. 5...First printed circuit board, 6...Second printed circuit board, 7...Soldering portion, 51...Groove, 52...Conductor pattern portion of first printed circuit board, 61...Conductor pattern portion of second printed circuit board.
Claims (1)
基板を嵌合する際に、第２のプリント基板の嵌合
部を介して結合し半田付けにて接続することを特
徴とするプリント基板の接続機構。 Connection of a printed circuit board characterized in that when the second printed circuit board is fitted to the first printed circuit board while standing upright, the connection is made through the fitting portion of the second printed circuit board and by soldering. mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17709384U JPS6192079U (en) | 1984-11-21 | 1984-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17709384U JPS6192079U (en) | 1984-11-21 | 1984-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6192079U true JPS6192079U (en) | 1986-06-14 |
Family
ID=30734669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17709384U Pending JPS6192079U (en) | 1984-11-21 | 1984-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6192079U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006269550A (en) * | 2005-03-22 | 2006-10-05 | Sharp Corp | Printed wiring board and its installation structure |
-
1984
- 1984-11-21 JP JP17709384U patent/JPS6192079U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006269550A (en) * | 2005-03-22 | 2006-10-05 | Sharp Corp | Printed wiring board and its installation structure |