JPS62193758U - - Google Patents
Info
- Publication number
- JPS62193758U JPS62193758U JP8270486U JP8270486U JPS62193758U JP S62193758 U JPS62193758 U JP S62193758U JP 8270486 U JP8270486 U JP 8270486U JP 8270486 U JP8270486 U JP 8270486U JP S62193758 U JPS62193758 U JP S62193758U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- foil pattern
- circuit board
- printed circuit
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 4
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Description
第１図はこの考案の実施例に係るプリント基板
の切欠斜視図、第２図は従来のプリント基板を示
す切欠斜視図である。
１……プリント基板のベース、２，３……銅箔
パターン、２０，３０……積層銅箔。
FIG. 1 is a cutaway perspective view of a printed circuit board according to an embodiment of this invention, and FIG. 2 is a cutaway perspective view of a conventional printed circuit board. 1... Base of printed circuit board, 2, 3... Copper foil pattern, 20, 30... Laminated copper foil.
Claims (1)
たプリント基板において、前記銅箔パターン上に
形状を同じくして銅箔を積層させてなることを特
徴とするプリント基板。 1. A printed circuit board having a copper foil pattern formed on at least one surface, characterized in that a copper foil having the same shape is laminated on the copper foil pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8270486U JPS62193758U (en) | 1986-05-30 | 1986-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8270486U JPS62193758U (en) | 1986-05-30 | 1986-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62193758U true JPS62193758U (en) | 1987-12-09 |
Family
ID=30935599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8270486U Pending JPS62193758U (en) | 1986-05-30 | 1986-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62193758U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52143483A (en) * | 1976-05-25 | 1977-11-30 | Nippon Electric Co | Method of forming circuit pattern |
| JPS5247762B2 (en) * | 1973-11-07 | 1977-12-05 | ||
| JPS53146173A (en) * | 1977-05-25 | 1978-12-19 | Hitachi Ltd | Power module circuit board and method of producing same |
-
1986
- 1986-05-30 JP JP8270486U patent/JPS62193758U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5247762B2 (en) * | 1973-11-07 | 1977-12-05 | ||
| JPS52143483A (en) * | 1976-05-25 | 1977-11-30 | Nippon Electric Co | Method of forming circuit pattern |
| JPS53146173A (en) * | 1977-05-25 | 1978-12-19 | Hitachi Ltd | Power module circuit board and method of producing same |