JPS6287478U - - Google Patents
Info
- Publication number
- JPS6287478U JPS6287478U JP17855085U JP17855085U JPS6287478U JP S6287478 U JPS6287478 U JP S6287478U JP 17855085 U JP17855085 U JP 17855085U JP 17855085 U JP17855085 U JP 17855085U JP S6287478 U JPS6287478 U JP S6287478U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- holes
- sides
- conductor patterns
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の回路基板の一部を示す断面図
、第２図は本考案の回路基板を使用した集積回路
装置を概略的に示す断面図、第３図は従来の回路
基板の一部を示す断面図である。
１……絶縁体ベース基板、２，３……導体パタ
ーン、４……スルーホール、５……導体層、６…
…半田、７……金属製キヤツプ。
Fig. 1 is a cross-sectional view showing a part of the circuit board of the present invention, Fig. 2 is a cross-sectional view schematically showing an integrated circuit device using the circuit board of the present invention, and Fig. 3 is a cross-sectional view of a conventional circuit board. FIG. DESCRIPTION OF SYMBOLS 1... Insulator base board, 2, 3... Conductor pattern, 4... Through hole, 5... Conductor layer, 6...
...Solder, 7...Metal cap.
Claims (1)
され、かつこれら両面の導体パターンを接続する
ためのスルーホールが形成された回路基板におい
て、前記スルーホールが半田で充填されているこ
とを特徴とする集積回路装置用回路基板。 An integrated circuit board in which conductor patterns are formed on both sides of an insulator base board and through holes are formed to connect the conductor patterns on both sides, the through holes being filled with solder. Circuit board for circuit devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17855085U JPS6287478U (en) | 1985-11-20 | 1985-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17855085U JPS6287478U (en) | 1985-11-20 | 1985-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6287478U true JPS6287478U (en) | 1987-06-04 |
Family
ID=31120785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17855085U Pending JPS6287478U (en) | 1985-11-20 | 1985-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6287478U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6489547A (en) * | 1987-09-30 | 1989-04-04 | Ibiden Co Ltd | Board for mounting semiconductor element |
-
1985
- 1985-11-20 JP JP17855085U patent/JPS6287478U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6489547A (en) * | 1987-09-30 | 1989-04-04 | Ibiden Co Ltd | Board for mounting semiconductor element |