JPS62182574U - - Google Patents
Info
- Publication number
- JPS62182574U JPS62182574U JP7138186U JP7138186U JPS62182574U JP S62182574 U JPS62182574 U JP S62182574U JP 7138186 U JP7138186 U JP 7138186U JP 7138186 U JP7138186 U JP 7138186U JP S62182574 U JPS62182574 U JP S62182574U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- conductor foils
- hole
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 3
- 239000011888 foil Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案のプリント配線基板の平面図、
第２図は本考案のプリント配線基板の断面図、第
３図は従来のプリント配線基板の平面図、第４図
は従来のプリント配線基板の断面図である。
１：絶縁基板、２ａ，２ｂ：銅箔、３：ソルダ
ーレジスト層、４：透孔。
Figure 1 is a plan view of the printed wiring board of the present invention.
FIG. 2 is a sectional view of a printed wiring board of the present invention, FIG. 3 is a plan view of a conventional printed wiring board, and FIG. 4 is a sectional view of a conventional printed wiring board. 1: Insulating substrate, 2a, 2b: Copper foil, 3: Solder resist layer, 4: Through hole.
Claims (1)
接させて設け、前記第１及び第２の導体箔間の絶
縁基板に透孔を設け、かつ前記第１及び第２の導
体箔の上面にソルダーレジスト層を設けてなるプ
リント配線基板。 Tips of first and second conductor foils are provided on an insulating substrate in close proximity to each other, a through hole is provided in the insulating substrate between the first and second conductor foils, and a through hole is provided in the insulating substrate between the first and second conductor foils; A printed wiring board with a solder resist layer on the top surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7138186U JPS62182574U (en) | 1986-05-12 | 1986-05-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7138186U JPS62182574U (en) | 1986-05-12 | 1986-05-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62182574U true JPS62182574U (en) | 1987-11-19 |
Family
ID=30913880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7138186U Pending JPS62182574U (en) | 1986-05-12 | 1986-05-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62182574U (en) |
-
1986
- 1986-05-12 JP JP7138186U patent/JPS62182574U/ja active Pending