JPS6371572U - - Google Patents

Info

Publication number
JPS6371572U
JPS6371572U JP16730386U JP16730386U JPS6371572U JP S6371572 U JPS6371572 U JP S6371572U JP 16730386 U JP16730386 U JP 16730386U JP 16730386 U JP16730386 U JP 16730386U JP S6371572 U JPS6371572 U JP S6371572U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
insulating layer
hole
covered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16730386U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16730386U priority Critical patent/JPS6371572U/ja
Publication of JPS6371572U publication Critical patent/JPS6371572U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例の断面図、第2図は本
考案の他の実施例の断面図を示す。 1,12……プリント配線板、2……絶縁基板
、3,8……プリント配線、4,14……孔、5
,15……電子部品、7,13……絶縁層、11
……多層配線板。
FIG. 1 shows a sectional view of an embodiment of the present invention, and FIG. 2 shows a sectional view of another embodiment of the invention. 1, 12... Printed wiring board, 2... Insulating board, 3, 8... Printed wiring, 4, 14... Hole, 5
, 15... Electronic component, 7, 13... Insulating layer, 11
...Multilayer wiring board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント配線板の少なくとも片側が絶縁層で被
覆され、該絶縁層の表面にプリント配線が形成さ
れた多層配線板において、プリント配線板に形成
され絶縁層で蓋われた孔と、該孔内に配置され端
子が前記プリント配線板に形成されたプリント配
線に接続されている電子部品とを有することを特
徴とする多層配線板。
In a multilayer wiring board in which at least one side of the printed wiring board is covered with an insulating layer and printed wiring is formed on the surface of the insulating layer, a hole formed in the printed wiring board and covered with an insulating layer, and a hole disposed within the hole and an electronic component whose terminals are connected to printed wiring formed on the printed wiring board.
JP16730386U 1986-10-30 1986-10-30 Pending JPS6371572U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16730386U JPS6371572U (en) 1986-10-30 1986-10-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16730386U JPS6371572U (en) 1986-10-30 1986-10-30

Publications (1)

Publication Number Publication Date
JPS6371572U true JPS6371572U (en) 1988-05-13

Family

ID=31099109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16730386U Pending JPS6371572U (en) 1986-10-30 1986-10-30

Country Status (1)

Country Link
JP (1) JPS6371572U (en)

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