JPH0360U - - Google Patents
Info
- Publication number
- JPH0360U JPH0360U JP5748689U JP5748689U JPH0360U JP H0360 U JPH0360 U JP H0360U JP 5748689 U JP5748689 U JP 5748689U JP 5748689 U JP5748689 U JP 5748689U JP H0360 U JPH0360 U JP H0360U
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- printed resistor
- multilayer resin
- thickness
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Description
第１図は本考案による実施例の斜視図、第２図
、第３図は従来の回路パターンと印刷抵抗との接
続構造を示す断面図である。
１……樹脂基板、２……印刷抵抗、３ａ，３ｂ
，４ａ，４ｂ……回路パターン、５ａ，５ｂ……
電極用導体、６ａ，６ｂ……櫛形部を有する回路
パターン。
FIG. 1 is a perspective view of an embodiment of the present invention, and FIGS. 2 and 3 are cross-sectional views showing a conventional connection structure between a circuit pattern and a printed resistor. 1...Resin substrate, 2...Printed resistor, 3a, 3b
, 4a, 4b... circuit pattern, 5a, 5b...
Electrode conductor, 6a, 6b...Circuit pattern having a comb-shaped part.
Claims (1)
抵抗と回路パターンとの接続において、前記回路
パターンの前記印刷抵抗との接続部分を櫛形とし
たことを特徴とする多層樹脂基板。 (2) 実用新案登録請求の範囲第(1)項記載の印刷
抵抗の厚さを、回路パターンの厚さと同等か、そ
れより薄くしたことを特徴とする多層樹脂基板。[Claims for Utility Model Registration] (1) In the connection between a printed resistor formed on a multilayer resin substrate or an internal layer and a circuit pattern, the connecting portion of the circuit pattern to the printed resistor is comb-shaped. Multilayer resin substrate. (2) A multilayer resin board characterized in that the thickness of the printed resistor described in claim (1) of the utility model registration is equal to or thinner than the thickness of the circuit pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5748689U JPH0360U (en) | 1989-05-18 | 1989-05-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5748689U JPH0360U (en) | 1989-05-18 | 1989-05-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0360U true JPH0360U (en) | 1991-01-07 |
Family
ID=31582236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5748689U Pending JPH0360U (en) | 1989-05-18 | 1989-05-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0360U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006108163A (en) * | 2004-09-30 | 2006-04-20 | Toppan Printing Co Ltd | Printed wiring board |
-
1989
- 1989-05-18 JP JP5748689U patent/JPH0360U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006108163A (en) * | 2004-09-30 | 2006-04-20 | Toppan Printing Co Ltd | Printed wiring board |
| JP4639733B2 (en) * | 2004-09-30 | 2011-02-23 | 凸版印刷株式会社 | Method for manufacturing printed wiring board |