JPH0224596U - - Google Patents
Info
- Publication number
- JPH0224596U JPH0224596U JP10215288U JP10215288U JPH0224596U JP H0224596 U JPH0224596 U JP H0224596U JP 10215288 U JP10215288 U JP 10215288U JP 10215288 U JP10215288 U JP 10215288U JP H0224596 U JPH0224596 U JP H0224596U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- substrates
- substrate
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 9
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Description
第1図は実施例に係る印刷配線板の断面図、第
2図A,Cはシールド部材を設けた基板を示す断
面図、第2図Bは回路部品を設けた基板を示す断
面図、第3図は従来の印刷配線板の断面図である
。
32……印刷配線板、50……第1の基板、5
2……第2の基板、54……第3の基板、38,
40,42……導電ランド、44……印刷抵抗体
(回路部品)、56,58……シールド部材。
FIG. 1 is a cross-sectional view of a printed wiring board according to an embodiment, FIGS. 2A and C are cross-sectional views showing a board provided with a shield member, FIG. 2B is a cross-sectional view showing a board provided with circuit components, and FIG. FIG. 3 is a sectional view of a conventional printed wiring board. 32...Printed wiring board, 50...First substrate, 5
2... second substrate, 54... third substrate, 38,
40, 42... Conductive land, 44... Printed resistor (circuit component), 56, 58... Shield member.
Claims (1)
した第1、第2の基板と、 少なくとも一方の面に導電ランドを有し、この
導電ランドの所定の位置に回路部品を設けた第3
の基板とを具備し、 前記第3の基板を前記第1および第2の基板間
に積層させたことを特徴とする印刷配線板。 (2) 前記第1および第2の基板のシールド部材
を第3の基板側になるように積層したことを特徴
とする請求項1記載の印刷配線板。 (3) 前記回路部品は、印刷回路素子であること
を特徴とする請求項1記載の印刷配線板。[Claims for Utility Model Registration] (1) First and second substrates having a shield member formed on at least one surface, a conductive land on at least one surface, and a circuit at a predetermined position of the conductive land. 3rd part with parts
A printed wiring board, comprising: a substrate, wherein the third substrate is laminated between the first and second substrates. (2) The printed wiring board according to claim 1, wherein the shield members of the first and second substrates are stacked on the third substrate side. (3) The printed wiring board according to claim 1, wherein the circuit component is a printed circuit element.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10215288U JPH0224596U (en) | 1988-08-01 | 1988-08-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10215288U JPH0224596U (en) | 1988-08-01 | 1988-08-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0224596U true JPH0224596U (en) | 1990-02-19 |
Family
ID=31331796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10215288U Pending JPH0224596U (en) | 1988-08-01 | 1988-08-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0224596U (en) |
-
1988
- 1988-08-01 JP JP10215288U patent/JPH0224596U/ja active Pending