JPS6274335U - - Google Patents
Info
- Publication number
- JPS6274335U JPS6274335U JP16613685U JP16613685U JPS6274335U JP S6274335 U JPS6274335 U JP S6274335U JP 16613685 U JP16613685 U JP 16613685U JP 16613685 U JP16613685 U JP 16613685U JP S6274335 U JPS6274335 U JP S6274335U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- electrodes
- substrate
- jetty
- pairs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案のハイブリツドＩＣ用基板の一
実施例を示す要部断面図、第２図はそのハイブリ
ツドＩＣ用基板に受動部品を実装した状態を示す
要部断面図、第３図および第４図はそれぞれ本考
案の第２および第３の実施例を示す要部断面図、
第５図は従来のハイブリツドＩＣ用基板に受動部
品を実装した状態を示す要部断面図である。
１，５……配線基板、２，６……電極、３，９
……受動部品、４，８……導電性接着剤、７……
凹溝、１０……突堤。
FIG. 1 is a cross-sectional view of a main part showing an embodiment of a hybrid IC board of the present invention, FIG. 2 is a cross-sectional view of a main part showing a state in which passive components are mounted on the hybrid IC board, and FIGS. Figure 4 is a sectional view of main parts showing the second and third embodiments of the present invention, respectively;
FIG. 5 is a sectional view of a main part showing a state in which passive components are mounted on a conventional hybrid IC board. 1, 5... Wiring board, 2, 6... Electrode, 3, 9
... Passive components, 4, 8 ... Conductive adhesive, 7 ...
Groove, 10... jetty.
Claims (1)
にチツプ状の受動部品の電極部を搭載するための
複数対の電極を設けてなるハイブリツドＩＣ用基
板において、前記各対の電極間に導電性接着剤の
流延を阻止する突堤または凹溝を設けて成ること
を特徴とするハイブリツドＩＣ用基板。 In a hybrid IC substrate having a conductive pattern formed inside or on the surface and provided with a plurality of pairs of electrodes for mounting an electrode part of a chip-shaped passive component on the surface, a conductive adhesive is used between each pair of electrodes. 1. A substrate for a hybrid IC, characterized in that it is provided with a jetty or a concave groove for preventing the flow of the hybrid IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16613685U JPS6274335U (en) | 1985-10-29 | 1985-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16613685U JPS6274335U (en) | 1985-10-29 | 1985-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6274335U true JPS6274335U (en) | 1987-05-13 |
Family
ID=31096817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16613685U Pending JPS6274335U (en) | 1985-10-29 | 1985-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6274335U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012070381A1 (en) * | 2010-11-22 | 2012-05-31 | 日本電気株式会社 | Mounting structure and mounting method |
-
1985
- 1985-10-29 JP JP16613685U patent/JPS6274335U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012070381A1 (en) * | 2010-11-22 | 2012-05-31 | 日本電気株式会社 | Mounting structure and mounting method |
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