JPS58120662U - Chippukiyariya - Google Patents
ChippukiyariyaInfo
- Publication number
- JPS58120662U JPS58120662U JP1715882U JP1715882U JPS58120662U JP S58120662 U JPS58120662 U JP S58120662U JP 1715882 U JP1715882 U JP 1715882U JP 1715882 U JP1715882 U JP 1715882U JP S58120662 U JPS58120662 U JP S58120662U
- Authority
- JP
- Japan
- Prior art keywords
- chippukiyariya
- chip carrier
- electrode
- substrate
- convex portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は、従来公知例の断面図、第2図、第3図は本考
案の1実施例を示す断面図、第4図、第5図は同じく斜
視図、第6図は同じく横断面図で、 ある。
11.211,311,411・・・・・・チップキャ
リヤー、13・・・・・・側面メタライズパターン、1
4゜214.314・・・・・・裏面メタライズパター
ン、15・・・・・・段差、16・・・・・・第1のセ
ラミックシート、17・・・・・・第2のセラミックシ
ート、18・・間第3のセラミックシート、19.20
・・・・・・メソライズパターン、21・・・・・・チ
ップ、22・・・・・・ワイヤー、23・・・・・・封
止キャップ、24・・・・・・配線基板、25・・・・
・・配線パターン、26・・・・・・はんだ接続、27
・・・・・・絶縁層、216,316,416・・・・
・・凸状部。FIG. 1 is a cross-sectional view of a conventionally known example, FIGS. 2 and 3 are cross-sectional views showing one embodiment of the present invention, FIGS. 4 and 5 are perspective views, and FIG. 6 is a cross-sectional view. In the figure, there is. 11.211,311,411... Chip carrier, 13... Side metallization pattern, 1
4゜214.314...Back side metallized pattern, 15...Step, 16...First ceramic sheet, 17...Second ceramic sheet, 18...Third ceramic sheet, 19.20
... Mesolized pattern, 21 ... Chip, 22 ... Wire, 23 ... Sealing cap, 24 ... Wiring board, 25・・・・・・
...Wiring pattern, 26...Solder connection, 27
...Insulating layer, 216, 316, 416...
・Convex part.
Claims (1)
するチップキャリヤーにおいて、該電極−形成面に凸状
部を設けたことを特徴とするチップキャリヤー。A chip carrier having external connection electrodes that are easily wetted by solder around the back surface of a substrate, characterized in that a convex portion is provided on the electrode-forming surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1715882U JPS58120662U (en) | 1982-02-12 | 1982-02-12 | Chippukiyariya |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1715882U JPS58120662U (en) | 1982-02-12 | 1982-02-12 | Chippukiyariya |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58120662U true JPS58120662U (en) | 1983-08-17 |
Family
ID=30029488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1715882U Pending JPS58120662U (en) | 1982-02-12 | 1982-02-12 | Chippukiyariya |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58120662U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61145893A (en) * | 1984-12-20 | 1986-07-03 | 松下電器産業株式会社 | Substrate for electronic component carrier |
JPH0191320U (en) * | 1987-12-09 | 1989-06-15 | ||
JP2006186668A (en) * | 2004-12-27 | 2006-07-13 | Kyocera Kinseki Corp | Piezoelectric vibrator |
-
1982
- 1982-02-12 JP JP1715882U patent/JPS58120662U/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61145893A (en) * | 1984-12-20 | 1986-07-03 | 松下電器産業株式会社 | Substrate for electronic component carrier |
JPH0191320U (en) * | 1987-12-09 | 1989-06-15 | ||
JP2006186668A (en) * | 2004-12-27 | 2006-07-13 | Kyocera Kinseki Corp | Piezoelectric vibrator |
JP4559211B2 (en) * | 2004-12-27 | 2010-10-06 | 京セラキンセキ株式会社 | Piezoelectric vibrator |
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