JPS6142861U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS6142861U JPS6142861U JP1984126031U JP12603184U JPS6142861U JP S6142861 U JPS6142861 U JP S6142861U JP 1984126031 U JP1984126031 U JP 1984126031U JP 12603184 U JP12603184 U JP 12603184U JP S6142861 U JPS6142861 U JP S6142861U
- Authority
- JP
- Japan
- Prior art keywords
- metal electrode
- semiconductor equipment
- oxide film
- semiconductor device
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案を説明する断面図で、第２図は従来例を
説明する横面図である。
主な図番の説明、１は半導体チップ、３は金属電極、６
はチップ部品である。FIG. 1 is a sectional view illustrating the present invention, and FIG. 2 is a lateral view illustrating a conventional example. Explanation of main figure numbers, 1 is semiconductor chip, 3 is metal electrode, 6
is a chip component.
Claims (1)
板表面を被覆する酸化膜と該酸化膜の一部に付着した金
属電極と該金属電極と前記回路束子とを接続する導体パ
ターンと前記金属電極に固着したチップ部品とを具備す
ることを特徴とす８半導体装置。A semiconductor substrate, a circuit element formed on the semiconductor substrate, an oxide film covering the surface of the substrate, a metal electrode attached to a part of the oxide film, a conductor pattern connecting the metal electrode and the circuit bundler, and the metal electrode. 8. A semiconductor device comprising: a chip component fixed to the semiconductor device;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984126031U JPS6142861U (en) | 1984-08-20 | 1984-08-20 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984126031U JPS6142861U (en) | 1984-08-20 | 1984-08-20 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6142861U true JPS6142861U (en) | 1986-03-19 |
Family
ID=30684717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984126031U Pending JPS6142861U (en) | 1984-08-20 | 1984-08-20 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6142861U (en) |
-
1984
- 1984-08-20 JP JP1984126031U patent/JPS6142861U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6142861U (en) | semiconductor equipment | |
| JPS5858342U (en) | hybrid integrated circuit | |
| JPS6117751U (en) | Tape carrier semiconductor device | |
| JPS58120662U (en) | Chippukiyariya | |
| JPS6094836U (en) | semiconductor equipment | |
| JPS5863703U (en) | chip resistor | |
| JPS5996851U (en) | semiconductor equipment | |
| JPS5899841U (en) | semiconductor equipment | |
| JPS5931266U (en) | Connection terminal of printed wiring board | |
| JPS60153544U (en) | Hybrid integrated circuit device incorporating a switching circuit | |
| JPS6094835U (en) | semiconductor equipment | |
| JPS58147278U (en) | Hybrid integrated circuit device | |
| JPS58182438U (en) | semiconductor equipment | |
| JPS60163744U (en) | Semiconductor integrated circuit device | |
| JPS59176154U (en) | Hybrid integrated circuit device | |
| JPS59112955U (en) | semiconductor element | |
| JPS58160431U (en) | Switch electrode pattern | |
| JPS594636U (en) | semiconductor equipment | |
| JPS6144835U (en) | semiconductor equipment | |
| JPS60169860U (en) | hybrid integrated circuit | |
| JPS5812942U (en) | Thin film integrated circuit device | |
| JPS5844844U (en) | semiconductor equipment | |
| JPS5911442U (en) | Semiconductor integrated circuit device | |
| JPS59131158U (en) | Chippukiyariya | |
| JPS6037240U (en) | hybrid integrated circuit |