JPS60153544U - Hybrid integrated circuit device incorporating a switching circuit - Google Patents

Hybrid integrated circuit device incorporating a switching circuit

Info

Publication number
JPS60153544U
JPS60153544U JP4252884U JP4252884U JPS60153544U JP S60153544 U JPS60153544 U JP S60153544U JP 4252884 U JP4252884 U JP 4252884U JP 4252884 U JP4252884 U JP 4252884U JP S60153544 U JPS60153544 U JP S60153544U
Authority
JP
Japan
Prior art keywords
hybrid integrated
integrated circuit
device incorporating
circuit device
switching circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4252884U
Other languages
Japanese (ja)
Other versions
JPH058682Y2 (en
Inventor
幸夫 岡田
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP4252884U priority Critical patent/JPS60153544U/en
Publication of JPS60153544U publication Critical patent/JPS60153544U/en
Application granted granted Critical
Publication of JPH058682Y2 publication Critical patent/JPH058682Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Electronic Switches (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の混成集積回路装置を説明する断面図、
第２図は本考案の混成集積回路装置の電子機器への取り
付は構造を説明する側面図、第３図Ａ１第３図Ｂ１第４
図Ａ、第４図Ｂ、第５図Ａ１第６図Ａおよび第６図Ｂは
本考案の混成集積回路装置のコアを説明する側面図およ
び断面図である。 主な図番の説明、１は金属基板、６は外部リード、７は
コアである。FIG. 1 is a sectional view illustrating the hybrid integrated circuit device of the present invention;
Figure 2 is a side view illustrating the structure of the hybrid integrated circuit device of the present invention when installed in electronic equipment; Figure 3 A1 Figure 3 B1 Figure 4
Figures A, 4B, 5A, 6A and 6B are a side view and a sectional view illustrating the core of the hybrid integrated circuit device of the present invention. Explanation of main figure numbers: 1 is a metal substrate, 6 is an external lead, and 7 is a core.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面を絶縁処理した良熱伝導性金属基板と該基板上に形
成した所望のスイッチング回路と該回路と外部回路との
接続をする外部リードとを具備する混成集積回路装置に
於いて、前記外部リードの少くなくともスイッチング周
波数の印加される外部リードに磁性体より成るコアを取
付けたことを特徴とするスイッチング回路を組込んだ混
成集積回路装置。In a hybrid integrated circuit device comprising a highly thermally conductive metal substrate whose surface is insulated, a desired switching circuit formed on the substrate, and an external lead for connecting the circuit to an external circuit, the external lead 1. A hybrid integrated circuit device incorporating a switching circuit, characterized in that a core made of a magnetic material is attached to an external lead to which at least a switching frequency is applied.
JP4252884U 1984-03-24 1984-03-24 Hybrid integrated circuit device incorporating a switching circuit Granted JPS60153544U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4252884U JPS60153544U (en) 1984-03-24 1984-03-24 Hybrid integrated circuit device incorporating a switching circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4252884U JPS60153544U (en) 1984-03-24 1984-03-24 Hybrid integrated circuit device incorporating a switching circuit

Publications (2)

Publication Number Publication Date
JPS60153544U true JPS60153544U (en) 1985-10-12
JPH058682Y2 JPH058682Y2 (en) 1993-03-04

Family

ID=30553365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4252884U Granted JPS60153544U (en) 1984-03-24 1984-03-24 Hybrid integrated circuit device incorporating a switching circuit

Country Status (1)

Country Link
JP (1) JPS60153544U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015023086A (en) * 2013-07-17 2015-02-02 住友電気工業株式会社 Semiconductor module

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5415663A (en) * 1974-01-10 1979-02-05 Nec Corp Semiconductor device
JPS5532024U (en) * 1978-08-21 1980-03-01

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5532024B2 (en) * 1974-12-27 1980-08-22

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5415663A (en) * 1974-01-10 1979-02-05 Nec Corp Semiconductor device
JPS5532024U (en) * 1978-08-21 1980-03-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015023086A (en) * 2013-07-17 2015-02-02 住友電気工業株式会社 Semiconductor module

Also Published As

Publication number Publication date
JPH058682Y2 (en) 1993-03-04

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