JPS5899841U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5899841U JPS5899841U JP19648381U JP19648381U JPS5899841U JP S5899841 U JPS5899841 U JP S5899841U JP 19648381 U JP19648381 U JP 19648381U JP 19648381 U JP19648381 U JP 19648381U JP S5899841 U JPS5899841 U JP S5899841U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- fixed
- semiconductor equipment
- insulating
- external connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来の半導体装置の構造を示す平面図及び断
面図、第２図は、本考案による半導体装置の構成を示す
平面図及び断面図である。
図において、１１．２１・・・・・・金属基体、１２゜
２２・・・・・・絶縁基板、１３．２３・・・・・・絶
縁物枠、１４．２４・・・・・・半導体素子、１５．１
５’、２５゜２５′・・・・・・外部接続端子、１６．
１６’、２６゜２６’、 ２７． ２７’・・・・・
・金属化層。FIG. 1 is a plan view and a sectional view showing the structure of a conventional semiconductor device, and FIG. 2 is a plan view and a sectional view showing the structure of a semiconductor device according to the present invention. In the figure, 11.21...Metal base, 12°22...Insulating substrate, 13.23...Insulator frame, 14.24...Semiconductor element, 15.1
5', 25°25'... External connection terminal, 16.
16', 26°26', 27. 27'...
- Metallized layer.
Claims (1)
体素子の電極が接続され他端に外部接続端子が固着され
る金属化層と、前記絶縁基板上に配設されて前記半導体
素子を囲む絶縁物枠とを有する半導体装置において、前
記外部接続リードの被固着部は略し字状とされて前記絶
縁基板表面と絶縁物枠とにおいて固着されてなることを
特徴とする半導体装置。an insulating substrate, a metallized layer formed on the surface of the insulating substrate, to which an electrode of a semiconductor element is connected to one end and an external connection terminal is fixed to the other end; and a metallized layer disposed on the insulating substrate and surrounding the semiconductor element. 1. A semiconductor device having an insulating frame, wherein a fixed portion of the external connection lead has an oval shape and is fixed between the surface of the insulating substrate and the insulating frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19648381U JPS5899841U (en) | 1981-12-26 | 1981-12-26 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19648381U JPS5899841U (en) | 1981-12-26 | 1981-12-26 | semiconductor equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5899841U true JPS5899841U (en) | 1983-07-07 |
| JPS6236290Y2 JPS6236290Y2 (en) | 1987-09-16 |
Family
ID=30109723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19648381U Granted JPS5899841U (en) | 1981-12-26 | 1981-12-26 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5899841U (en) |
-
1981
- 1981-12-26 JP JP19648381U patent/JPS5899841U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6236290Y2 (en) | 1987-09-16 |
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