JPS5872869U - electronic circuit equipment - Google Patents
electronic circuit equipmentInfo
- Publication number
- JPS5872869U JPS5872869U JP16675281U JP16675281U JPS5872869U JP S5872869 U JPS5872869 U JP S5872869U JP 16675281 U JP16675281 U JP 16675281U JP 16675281 U JP16675281 U JP 16675281U JP S5872869 U JPS5872869 U JP S5872869U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- circuit board
- electronic
- recess
- circuit equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図乃至第6図は従来の電子回路図装置の一例及びそ
の問題点を説明するための断面図、第7図乃至第9図は
本考案装置の一実施例を示す要部断面図である。
−
1・・・回路基板、la、 la’・・・凹部、2・
・・配線層、3・・・絶縁層、4. 4A、 4B・
・・電子部品、4a・・・導体層、5・・・半田層。Figures 1 to 6 are cross-sectional views for explaining an example of a conventional electronic circuit diagram device and its problems, and Figures 7 to 9 are cross-sectional views of essential parts showing an embodiment of the device of the present invention. be.
- 1...Circuit board, la, la'...recess, 2.
... Wiring layer, 3... Insulating layer, 4. 4A, 4B・
...Electronic component, 4a...Conductor layer, 5...Solder layer.
Claims (3)
おいて、回路基板に形成された凹部内に電子部品が挿置
され、該電子部品の導体層と前記回路基板上に形成され
た導体層とが電気的に接続されていることを特徴とする
電子回路装置。(1) In an electronic circuit device in which an electronic component is incorporated into a circuit board, the electronic component is inserted into a recess formed in the circuit board, and a conductor layer of the electronic component and a conductor layer formed on the circuit board An electronic circuit device characterized in that the two are electrically connected to each other.
抜き加工によって形成されていることを特徴とする実用
新案登録請求の範囲第1項記載の電子回路装置。(2) The electronic circuit device according to claim 1, wherein the circuit board is made of an insulating material, and the recess is formed by half punching.
からなり、前記凹部が絞り加工によって形成されている
ことを特徴とする実用新案登録請求の範囲第1項記載の
電子回路装置。(3) The electronic circuit device according to claim 1, wherein the circuit board is made of a metal plate with an insulating layer formed on its surface, and the recess is formed by drawing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16675281U JPS5872869U (en) | 1981-11-09 | 1981-11-09 | electronic circuit equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16675281U JPS5872869U (en) | 1981-11-09 | 1981-11-09 | electronic circuit equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5872869U true JPS5872869U (en) | 1983-05-17 |
Family
ID=29958891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16675281U Pending JPS5872869U (en) | 1981-11-09 | 1981-11-09 | electronic circuit equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5872869U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011228485A (en) * | 2010-04-20 | 2011-11-10 | Stanley Electric Co Ltd | Electronic component mounting method |
-
1981
- 1981-11-09 JP JP16675281U patent/JPS5872869U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011228485A (en) * | 2010-04-20 | 2011-11-10 | Stanley Electric Co Ltd | Electronic component mounting method |
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