JPS6135316U - conductive bottle material - Google Patents

conductive bottle material

Info

Publication number
JPS6135316U
JPS6135316U JP11935484U JP11935484U JPS6135316U JP S6135316 U JPS6135316 U JP S6135316U JP 11935484 U JP11935484 U JP 11935484U JP 11935484 U JP11935484 U JP 11935484U JP S6135316 U JPS6135316 U JP S6135316U
Authority
JP
Japan
Prior art keywords
bottle material
conductive
coating layer
conductive bottle
copper coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11935484U
Other languages
Japanese (ja)
Inventor
秀明 白井
博 石橋
修次 足立
弘久 大野
Original Assignee
三菱電線工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電線工業株式会社 filed Critical 三菱電線工業株式会社
Priority to JP11935484U priority Critical patent/JPS6135316U/en
Publication of JPS6135316U publication Critical patent/JPS6135316U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係る導電性ピン材を示す断面説明図、
第２図Ａは従来のピンへのワインデングを示す上面説明
図、第２図Ｂは同上ワインデイグを示す側面説明図であ
る。 図において、１は鉄鋼芯材、２は銅被覆層、３はハンダ
被覆層である。FIG. 1 is a cross-sectional explanatory diagram showing a conductive pin material according to the present invention,
FIG. 2A is an explanatory top view showing conventional winding to a pin, and FIG. 2B is an explanatory side view showing the same winding. In the figure, 1 is a steel core material, 2 is a copper coating layer, and 3 is a solder coating layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 鉄または鋼の芯材上に銅被覆層を設け、該銅被覆層上に
ハンダ層を設けてなり、しかも断面が角形であることを
特徴とする導電性ピン材。A conductive pin material comprising a copper coating layer provided on a core material of iron or steel, and a solder layer provided on the copper coating layer, and having a rectangular cross section.
JP11935484U 1984-07-31 1984-07-31 conductive bottle material Pending JPS6135316U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11935484U JPS6135316U (en) 1984-07-31 1984-07-31 conductive bottle material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11935484U JPS6135316U (en) 1984-07-31 1984-07-31 conductive bottle material

Publications (1)

Publication Number Publication Date
JPS6135316U true JPS6135316U (en) 1986-03-04

Family

ID=30678231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11935484U Pending JPS6135316U (en) 1984-07-31 1984-07-31 conductive bottle material

Country Status (1)

Country Link
JP (1) JPS6135316U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020137127A1 (en) * 2018-12-27 2020-07-02 パナソニックＩｐマネジメント株式会社 Terminal

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437064A (en) * 1977-08-30 1979-03-19 Sato Hideo Method of making hollow sphere
JPS5784512A (en) * 1980-11-14 1982-05-26 Matsushita Electric Ind Co Ltd Lead wire and method of producing same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437064A (en) * 1977-08-30 1979-03-19 Sato Hideo Method of making hollow sphere
JPS5784512A (en) * 1980-11-14 1982-05-26 Matsushita Electric Ind Co Ltd Lead wire and method of producing same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020137127A1 (en) * 2018-12-27 2020-07-02 パナソニックＩｐマネジメント株式会社 Terminal
JPWO2020137127A1 (en) * 2018-12-27 2021-09-09 パナソニックＩｐマネジメント株式会社 Terminal

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