JPS5812942U - Thin film integrated circuit device - Google Patents
Thin film integrated circuit deviceInfo
- Publication number
- JPS5812942U JPS5812942U JP10597181U JP10597181U JPS5812942U JP S5812942 U JPS5812942 U JP S5812942U JP 10597181 U JP10597181 U JP 10597181U JP 10597181 U JP10597181 U JP 10597181U JP S5812942 U JPS5812942 U JP S5812942U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- thin film
- circuit device
- film integrated
- abstract
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の薄膜集積回路装置の一実施例の部分平
面図、第２図は第１図のＡ−Ａ’での断面図である。
なお図において、１・・・導体膜、２・・・タンタル膜
、３・・・セラミック基板、である。FIG. 1 is a partial plan view of an embodiment of the thin film integrated circuit device of the present invention, and FIG. 2 is a sectional view taken along line AA' in FIG. In the figure, 1... conductor film, 2... tantalum film, 3... ceramic substrate.
Claims (1)
ペレットのマウントランドを、導通に使用する一部を除
き、全以外の金属で形成することを特徴とする薄膜集積
回路装置。1. A thin film integrated circuit device characterized in that a pellet mounting land formed of a conductive film containing gold as an upper layer on a ceramic substrate is formed entirely of metal except for a part used for conduction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10597181U JPS5812942U (en) | 1981-07-16 | 1981-07-16 | Thin film integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10597181U JPS5812942U (en) | 1981-07-16 | 1981-07-16 | Thin film integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5812942U true JPS5812942U (en) | 1983-01-27 |
| JPH0331076Y2 JPH0331076Y2 (en) | 1991-07-01 |
Family
ID=29900488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10597181U Granted JPS5812942U (en) | 1981-07-16 | 1981-07-16 | Thin film integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5812942U (en) |
-
1981
- 1981-07-16 JP JP10597181U patent/JPS5812942U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0331076Y2 (en) | 1991-07-01 |
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