JPS5822749U - Package for semiconductor devices - Google Patents
Package for semiconductor devicesInfo
- Publication number
- JPS5822749U JPS5822749U JP11693781U JP11693781U JPS5822749U JP S5822749 U JPS5822749 U JP S5822749U JP 11693781 U JP11693781 U JP 11693781U JP 11693781 U JP11693781 U JP 11693781U JP S5822749 U JPS5822749 U JP S5822749U
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor devices
- container
- ceramic
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａ、 ｂは従来の半導体素子用パッケージの一
例の側面図および断面図、第２図は本考案の第１の実施
例の外部リード近傍の断面図、第３図は本考案の第２の
実施例の外部リード近傍の断面図である。
１１・・・・・・セラミック製容器、１２・・回外部リ
ード、１３・・・・・・メタライズ層、１４・・・・・
・Ｎｉめっき層、１５・・・・・・ろう材、１８．１８
’・・・・・・セラミック膜。1A and 1B are a side view and a cross-sectional view of an example of a conventional semiconductor device package, FIG. 2 is a cross-sectional view of the vicinity of the external lead of the first embodiment of the present invention, and FIG. FIG. 2 is a cross-sectional view of the vicinity of an external lead in Example 2; 11...Ceramic container, 12...Supination outer lead, 13...Metallized layer, 14...
・Ni plating layer, 15... Brazing metal, 18.18
'... Ceramic membrane.
Claims (1)
ック製容器に設けられたイタライズ層と、前記メタライ
ズ層にろう材により固着された外部リードと、前記メタ
ライズ層の端部周縁とその近傍の前記セラミック製容器
の表面を覆うセラミック膜とを含むことを特徴とする半
導体素子用パッケージ。a ceramic container for housing a semiconductor element; an italization layer provided on the ceramic container; an external lead fixed to the metallization layer with a brazing material; A package for a semiconductor device, comprising: a ceramic film covering the surface of the container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11693781U JPS5822749U (en) | 1981-08-05 | 1981-08-05 | Package for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11693781U JPS5822749U (en) | 1981-08-05 | 1981-08-05 | Package for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5822749U true JPS5822749U (en) | 1983-02-12 |
Family
ID=29911145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11693781U Pending JPS5822749U (en) | 1981-08-05 | 1981-08-05 | Package for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5822749U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01189152A (en) * | 1988-01-25 | 1989-07-28 | Hitachi Ltd | Electronic circuit device |
-
1981
- 1981-08-05 JP JP11693781U patent/JPS5822749U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01189152A (en) * | 1988-01-25 | 1989-07-28 | Hitachi Ltd | Electronic circuit device |
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