JPS5920637U - Semiconductor device container cap - Google Patents

Semiconductor device container cap

Info

Publication number
JPS5920637U
JPS5920637U JP11605782U JP11605782U JPS5920637U JP S5920637 U JPS5920637 U JP S5920637U JP 11605782 U JP11605782 U JP 11605782U JP 11605782 U JP11605782 U JP 11605782U JP S5920637 U JPS5920637 U JP S5920637U
Authority
JP
Japan
Prior art keywords
semiconductor device
container cap
device container
cap
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11605782U
Other languages
Japanese (ja)
Inventor
高月 邦男
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP11605782U priority Critical patent/JPS5920637U/en
Publication of JPS5920637U publication Critical patent/JPS5920637U/en
Pending legal-status Critical Current

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  • Casings For Electric Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a、  bは従来の半導体装置用容器のキャップ
の断面図、第2図a、  bは本考案の第1の実施例の
平面図及び断面図、第3図a、  bは本考案の第2の
実施例の平面図及び断面図である。 1・・・金属キャップ、2. 2’・・・セラミック板
、3・・・金属板、4・・・セラミックキャップ、5・
・・封着部。
FIGS. 1a and 1b are cross-sectional views of a conventional semiconductor device container cap, FIGS. 2a and 2b are plan views and cross-sectional views of the first embodiment of the present invention, and FIGS. FIG. 2 is a plan view and a sectional view of a second embodiment of the invention. 1...metal cap, 2. 2'...Ceramic plate, 3...Metal plate, 4...Ceramic cap, 5.
・Sealing part.

Claims (1)

【実用新案登録請求の範囲】 ケースに封着される面が金属からなり、ケースとの封着
部に隣接した面の少くとも一部分がセラミックで覆われ
ていることを特徴とする半導体装置用容器のキャップ。   ・
[Claims for Utility Model Registration] A container for a semiconductor device, characterized in that the surface to be sealed to the case is made of metal, and at least a portion of the surface adjacent to the part sealed to the case is covered with ceramic. cap.・
JP11605782U 1982-07-30 1982-07-30 Semiconductor device container cap Pending JPS5920637U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11605782U JPS5920637U (en) 1982-07-30 1982-07-30 Semiconductor device container cap

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11605782U JPS5920637U (en) 1982-07-30 1982-07-30 Semiconductor device container cap

Publications (1)

Publication Number Publication Date
JPS5920637U true JPS5920637U (en) 1984-02-08

Family

ID=30267690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11605782U Pending JPS5920637U (en) 1982-07-30 1982-07-30 Semiconductor device container cap

Country Status (1)

Country Link
JP (1) JPS5920637U (en)

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