JPS5895051U - Ceramic package type semiconductor device - Google Patents

Ceramic package type semiconductor device

Info

Publication number
JPS5895051U
JPS5895051U JP1981189648U JP18964881U JPS5895051U JP S5895051 U JPS5895051 U JP S5895051U JP 1981189648 U JP1981189648 U JP 1981189648U JP 18964881 U JP18964881 U JP 18964881U JP S5895051 U JPS5895051 U JP S5895051U
Authority
JP
Japan
Prior art keywords
ceramic package
semiconductor device
type semiconductor
package type
brazing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981189648U
Other languages
Japanese (ja)
Inventor
上野　澄男
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP1981189648U priority Critical patent/JPS5895051U/en
Publication of JPS5895051U publication Critical patent/JPS5895051U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ、　　ｂは従来のセラミックパッケージ形半導
体装置の一例を示す断面図、平面図、第２図ａ、　　ｂ
はセラミックパッケージの蓋の一例を示す内面側平面図
、その断面図、第３図ａ、　　ｂはこの考案によるセラ
ミックパッケージ形半導体装置の一例を説明するための
蓋の内面側平面図、その断面図である。 １・・・・・・セラミックパッケージ、２・・・・・・
半導体ダイス、３・・・・・・金属細線、４・・・・・
・蓋付は用メタライズ面、５・・・・・−ピンリード、
６・・・・・・蓋、７・・・・・・蓋付は用ロー材、８
・・・・・・はみ出したロー材、９・・・・・・ロー材
温り溝。Figures 1a and b are a cross-sectional view and a plan view showing an example of a conventional ceramic package type semiconductor device, and Figures 2a and b are
3A and 3B are an inner plan view and a cross-sectional view of an example of a lid of a ceramic package, respectively, and FIGS. It is. 1...Ceramic package, 2...
Semiconductor dice, 3...Thin metal wire, 4...
・With lid, metallized surface, 5...-pin lead,
6...Lid, 7...With lid is brazing material, 8
...Protruded brazing material, 9... Brazing material warming groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 内部に半導体ダイスが接着配置されかつ開口周辺部にメ
タライズ面が被着形成されたセラミックパッケージと、
上記セラミックパッケージの開口部を閉塞する蓋とをロ
ー材を介して封着させたセラミックパッケージ形半導体
装置において、上記蓋のロー材付着部近傍にロー材の溜
り溝を設けたことを特徴とするセラミックパッケージ形
半導体装置。A ceramic package in which a semiconductor die is adhered and arranged and a metallized surface is formed around the opening;
A ceramic package type semiconductor device in which a lid for closing an opening of the ceramic package is sealed via a brazing material, characterized in that a brazing material reservoir groove is provided in the vicinity of a brazing material adhering portion of the lid. Ceramic package type semiconductor device.
JP1981189648U 1981-12-18 1981-12-18 Ceramic package type semiconductor device Pending JPS5895051U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981189648U JPS5895051U (en) 1981-12-18 1981-12-18 Ceramic package type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981189648U JPS5895051U (en) 1981-12-18 1981-12-18 Ceramic package type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5895051U true JPS5895051U (en) 1983-06-28

Family

ID=30103471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981189648U Pending JPS5895051U (en) 1981-12-18 1981-12-18 Ceramic package type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5895051U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5637159U (en) * 1979-08-23 1981-04-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5637159U (en) * 1979-08-23 1981-04-09

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