JPS6015490U - solder paste packaging - Google Patents

solder paste packaging

Info

Publication number
JPS6015490U
JPS6015490U JP10657083U JP10657083U JPS6015490U JP S6015490 U JPS6015490 U JP S6015490U JP 10657083 U JP10657083 U JP 10657083U JP 10657083 U JP10657083 U JP 10657083U JP S6015490 U JPS6015490 U JP S6015490U
Authority
JP
Japan
Prior art keywords
solder paste
paste packaging
space
packaging
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10657083U
Other languages
Japanese (ja)
Other versions
JPH0128954Y2 (en
Inventor
石井　銀弥
奥谷　健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP10657083U priority Critical patent/JPS6015490U/en
Publication of JPS6015490U publication Critical patent/JPS6015490U/en
Application granted granted Critical
Publication of JPH0128954Y2 publication Critical patent/JPH0128954Y2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

図は本考案の一実施例のはんだペースト包装体の断面図
である。 図中、１は容器本体、２は、蓋体、３ははんだペースト
、４は空気遮断層としての空気遮断用フィルムである。The figure is a sectional view of a solder paste package according to an embodiment of the present invention. In the figure, 1 is a container body, 2 is a lid, 3 is a solder paste, and 4 is an air-blocking film as an air-blocking layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 容器本体と蓋体とからなる容器にはんだペーストを空間
を残して収容し、はんだペーストと空間との界面に空気
遮断層を設けたことを特徴とするはんだペースト包装体
。A solder paste package, characterized in that solder paste is housed in a container consisting of a container body and a lid, leaving a space, and an air blocking layer is provided at the interface between the solder paste and the space.
JP10657083U 1983-07-11 1983-07-11 solder paste packaging Granted JPS6015490U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10657083U JPS6015490U (en) 1983-07-11 1983-07-11 solder paste packaging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10657083U JPS6015490U (en) 1983-07-11 1983-07-11 solder paste packaging

Publications (2)

Publication Number Publication Date
JPS6015490U true JPS6015490U (en) 1985-02-01
JPH0128954Y2 JPH0128954Y2 (en) 1989-09-04

Family

ID=30249341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10657083U Granted JPS6015490U (en) 1983-07-11 1983-07-11 solder paste packaging

Country Status (1)

Country Link
JP (1) JPS6015490U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016194434A1 (en) * 2015-05-29 2016-12-08 株式会社村田製作所 Bonding member and bonding method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5170157A (en) * 1974-12-17 1976-06-17 Meiji Puranto Kogyo Kk Aruminiumurozaino sankahimakuboshiho
JPS52118319U (en) * 1976-03-05 1977-09-08

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5170157A (en) * 1974-12-17 1976-06-17 Meiji Puranto Kogyo Kk Aruminiumurozaino sankahimakuboshiho
JPS52118319U (en) * 1976-03-05 1977-09-08

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016194434A1 (en) * 2015-05-29 2016-12-08 株式会社村田製作所 Bonding member and bonding method
JPWO2016194434A1 (en) * 2015-05-29 2018-02-08 株式会社村田製作所 Joining member and joining method
US11819915B2 (en) 2015-05-29 2023-11-21 Murata Manufacturing Co., Ltd. Bonding member and bonding method

Also Published As

Publication number Publication date
JPH0128954Y2 (en) 1989-09-04

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