JPH0128954Y2 - - Google Patents
Info
- Publication number
- JPH0128954Y2 JPH0128954Y2 JP1983106570U JP10657083U JPH0128954Y2 JP H0128954 Y2 JPH0128954 Y2 JP H0128954Y2 JP 1983106570 U JP1983106570 U JP 1983106570U JP 10657083 U JP10657083 U JP 10657083U JP H0128954 Y2 JPH0128954 Y2 JP H0128954Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder paste
- weight
- solder
- resin
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 54
- 239000010410 layer Substances 0.000 claims description 10
- 239000011247 coating layer Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 12
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 9
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 8
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 8
- 239000000843 powder Substances 0.000 description 5
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- MMCPOSDMTGQNKG-UHFFFAOYSA-N anilinium chloride Chemical compound Cl.NC1=CC=CC=C1 MMCPOSDMTGQNKG-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 2
- 229960001826 dimethylphthalate Drugs 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 description 1
- BQACOLQNOUYJCE-FYZZASKESA-N Abietic acid Natural products CC(C)C1=CC2=CC[C@]3(C)[C@](C)(CCC[C@@]3(C)C(=O)O)[C@H]2CC1 BQACOLQNOUYJCE-FYZZASKESA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical class [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000036558 skin tension Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Packages (AREA)
- Closures For Containers (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
本考案は、はんだペーストを収容した包装体の
はんだペースト表面に設ける酸化防止層を改善し
たものに関する。[Detailed Description of the Invention] Industrial Application Field The present invention relates to an improved anti-oxidation layer provided on the surface of the solder paste of a package containing the solder paste.
従来の技術
はんだペーストは、プリント配線板に電気部品
をはんだ付けするときに使用されるものであつ
て、はんだ粉末を例えばロジン溶液に混合したも
のである。BACKGROUND OF THE INVENTION Solder paste is used when soldering electrical components to printed wiring boards, and is made by mixing solder powder with, for example, a rosin solution.
このはんだペーストは製造されてから直だちに
は使用されず、時間をおいて使用されるのが通常
であるので、その間容器に収容され保管される。
この場合はんだペーストを収容した容器の上部は
空間になつており、錫と鉛からなるはんだ粉末
は、特に鉛の粉末が空気と接触するところで酸化
される。 Since this solder paste is not used immediately after being manufactured, but is used after some time, it is stored in a container during that time.
In this case, the upper part of the container containing the solder paste is empty, and the solder powder consisting of tin and lead is oxidized, especially where the lead powder comes into contact with air.
この鉛の酸化物は、ロジンの成分であるアビエ
チン酸と反応生成物を生じ、これらの酸化物と反
応生成物がはんだペースト表面に層を形成する。
この層は導電性を有さず、不溶性であり、流動性
もないので、はんだペーストとしての本来の機能
を有さず、通常は取り除かれ、廃棄される。これ
は、はんだペーストの損失となり、不経済であ
る。 This lead oxide produces a reaction product with abietic acid, which is a component of rosin, and these oxides and reaction products form a layer on the surface of the solder paste.
Since this layer is non-conductive, insoluble, and non-flowable, it has no inherent function as a solder paste and is usually removed and discarded. This results in loss of solder paste and is uneconomical.
はんだペーストの酸化を防止することができる
包装体としては、実開昭52−118319号公報に記載
されているように、はんだペーストを少しづつ使
用する場合の便利を図つたものとして考案された
はんだペーストをチユーブに詰めたものが実質的
には同じ目的を達成できる。 As a package that can prevent the oxidation of solder paste, as described in Japanese Utility Model Application Publication No. 118319/1982, there is a solder which was devised for the convenience of using solder paste little by little. Tubes of paste can accomplish essentially the same purpose.
また、特開昭51−70157号公報に記載されてい
るように、アルミニウム鑞材の表面を製造直後に
不通気性フイルムで被包するその酸化防止法も知
られている。 Furthermore, as described in Japanese Patent Application Laid-Open No. 70157/1983, a method for preventing oxidation is known in which the surface of aluminum brazing material is covered with an impermeable film immediately after manufacture.
考案が解決しようとする課題
しかしながら、前者のものは、チユーブに詰め
るという煩わしい作業が必要であるのみならず、
大量に使用しようとした場合には不便である。Problems that the invention aims to solve However, the former method not only requires the troublesome work of stuffing it into a tube;
This is inconvenient if you try to use it in large quantities.
また、後者のものは、その実施例にも記載され
ているように、アルミニウム鑞材を真空処理を行
つてポリエチレンチユーブに熱封包装しており、
これも単に包装しただけでは空気が内包され、包
装物の酸化を避けられないことを示すもので、真
空処理を行うこととなれば、その特別な装置と煩
雑な作業を必要とする。 In the latter case, as described in the examples, the aluminum solder material is vacuum-treated and heat-sealed in a polyethylene tube.
This also shows that simply wrapping the package will trap air and oxidation of the package cannot be avoided, and vacuum treatment would require special equipment and complicated work.
課題を解決するための手段
本考案は、上記課題を解決するために、容器に
収容したはんだペーストの露出部表面に空気遮断
塗布層又は上記はんだペーストに添加したワツク
スを表面に析出させた空気遮断析出層を設けたこ
とを特徴とするはんだペースト包装体を提供する
ものである。Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides an air-blocking coating layer on the exposed surface of the solder paste housed in a container, or an air-blocking layer in which wax added to the solder paste is deposited on the surface. The present invention provides a solder paste package characterized by being provided with a deposited layer.
作 用
はんだペースの露出部表面に塗布層又は折出層
を設けたので、空気を遮断でき、しかも単なる塗
布作業又ははんだペーストにワツクスを混合する
作業でよい。Function: Since a coating layer or a deposited layer is provided on the surface of the exposed portion of the solder paste, air can be blocked, and a simple coating operation or an operation of mixing wax with the solder paste is sufficient.
実施例
次に本考案の実施例を図面に基づいて説明す
る。Embodiments Next, embodiments of the present invention will be described based on the drawings.
図中、１はプラスチツク製の容器本体、２はそ
の蓋体、３ははんだペースト、４はその表面に塗
布形成された塗布膜である。なお、はんだペース
トははんだ粉末（Sn63％，Pb37％）85重量％、
ビヒクル（ロジン70％、ブチルセロソルブ30％）
15重量％からなる約2000ポイズのペーストであ
る。 In the figure, 1 is a plastic container body, 2 is a lid thereof, 3 is a solder paste, and 4 is a coating film formed on the surface thereof. The solder paste contains 85% by weight of solder powder (Sn63%, Pb37%),
Vehicle (70% rosin, 30% butyl cellosolve)
It is a paste of approximately 2000 poise consisting of 15% by weight.
はんだペーストを包装するときは、まず容器本
体１にはんだペースト３を収容し、この表面に樹
脂溶液を塗布し、溶剤を揮発させて樹脂フイルム
からなる塗布膜３を生成させる。この樹脂として
は、ロジン、ロジン変性フエノール樹脂、マレイ
ン酸変性ロジン、フエノール樹脂、エポキシ樹
脂、キシレン樹脂などの熱可塑性樹脂が使用でき
る。 When packaging solder paste, first the solder paste 3 is placed in the container body 1, a resin solution is applied to the surface of the solder paste, and the solvent is evaporated to form a coating film 3 made of a resin film. As this resin, thermoplastic resins such as rosin, rosin-modified phenolic resin, maleic acid-modified rosin, phenol resin, epoxy resin, and xylene resin can be used.
これらの樹脂溶液の塗布方法としては、刷毛塗
り、流し込み、スプレー塗布のいずれも使用でき
る。 As a method for applying these resin solutions, any of brushing, pouring, and spraying can be used.
また、樹脂溶液は例えばポリエチレン樹脂のよ
うな樹脂溶融液でも良く、この場合はんだペース
ト表面に流し込み、冷却固化させればフイルムが
形成される。この樹脂の代わりにワツクスのよう
なものを用い、はんだペースト表面にワツクスの
層を形成するようにしても良い。 Further, the resin solution may be a resin melt such as polyethylene resin, and in this case, a film is formed by pouring it onto the surface of the solder paste and cooling and solidifying it. Instead of this resin, something like wax may be used to form a wax layer on the surface of the solder paste.
このように樹脂溶液等を塗布すると、はんだペ
ースト表面の凹凸に追従して塗布されるので、そ
の塗布膜もこの凹凸に追従して形成され、はんだ
ペースト表面との密着性を良くすることができ、
空気との遮断をよりよくすることができる。 When a resin solution or the like is applied in this way, the coating follows the irregularities on the surface of the solder paste, so the coating film also follows the irregularities and is able to improve its adhesion to the surface of the solder paste. ,
It can be better isolated from the air.
上記のようにして空気遮断塗布膜を形成された
はんだペーストは、長期保存されても酸化を防止
されるが、その使用に当たつてはこの塗布膜を棒
等で掻き出してからはんだペーストを使用しても
良く、少量であれば塗布膜の樹脂の混ざつたはん
だペーストを使用しても支障がない。 Solder paste with an air-blocking coating formed as described above will be prevented from oxidizing even if stored for a long time, but before using it, scrape off this coating with a stick etc. before using the solder paste. There is no problem even if a small amount of solder paste mixed with a coating film resin is used.
上記はいずれもはんだペースト表面に外部から
塗布膜を形成させたが、例えば軟化点50〜150℃
のワツクスをはんだペーストに微分散させ、この
ワツクスが時間の経過とともに、はんだペースト
表面に分離、析出してくる性質を利用し、内部的
にはんだペースト表面に空気遮断層を形成させて
も良い。この場合も、使用に当たつて表面のワツ
クスを内部のはんだペーストに混ぜて使用しても
良い。 In all of the above, a coating film was formed externally on the surface of the solder paste, but for example, the softening point was 50 to 150°C.
The wax may be finely dispersed in the solder paste, and by utilizing the property that this wax separates and precipitates on the solder paste surface over time, an air barrier layer may be formed internally on the solder paste surface. In this case as well, the surface wax may be mixed with the internal solder paste before use.
実験例 １
図に示す容器本体１に下記組成のはんだペース
トを収容し、はんだペースト３上にロジン30重量
％のベンゼン溶液をスプレーし、はんだペースト
表面をコーテイングする。この後蓋体２により密
封し、０℃，20℃，30℃で保管し、はんだペース
ト表面の皮張り状態をしらべた。この結果、０℃
で６月以上、20℃で３月、30℃で１月皮張りが見
られなかつた。Experimental Example 1 A solder paste having the following composition is placed in the container body 1 shown in the figure, and a benzene solution containing 30% by weight of rosin is sprayed onto the solder paste 3 to coat the surface of the solder paste. After that, it was sealed with the lid 2 and stored at 0°C, 20°C, and 30°C, and the state of skinning on the surface of the solder paste was examined. As a result, 0℃
No skinning was observed for more than six months at 20°C, in March at 30°C, and in January at 30°C.
はんだペースト表面をコーテイングしなかつた
場合についても同様の試験を行つたが、０℃で１
月、20℃で３日、30℃で１日で皮張りが見られ
た。 A similar test was conducted without coating the solder paste surface.
In January, skinning was observed after 3 days at 20℃ and 1 day at 30℃.
はんだ粉末
（Sn63％，Pb37％） 85重量％
ロジン ７重量％
ジメチルフタレート ３重量％
ブチルセロソルブ ４重量％
アニリン塩酸塩 １重量％
100重量％
実験例 ２
下記組成のはんだペーストを実験例１と同様に
試験し、はんだペースト表面の皮張り状態を調べ
た。 Solder powder (Sn63%, Pb37%) 85% by weight Rosin 7% by weight Dimethyl phthalate 3% by weight Butyl cellosolve 4% by weight Aniline hydrochloride 1% by weight 100% by weight Experimental example 2 Solder paste with the following composition was tested in the same manner as experimental example 1. The skin condition of the solder paste surface was then examined.
はんだ粉末
（Sn63％，Pb37％） 85重量％
アニリン塩酸塩 １重量％
ロジン ６重量％
ジメチルフタレート ３重量％
パラフインワツクス ２重量％
ブチルセロソルブ ３重量％
100重量％
この結果、０℃で６月、20℃で１月、30℃で10
日皮張が見られなかつた。 Solder powder (Sn63%, Pb37%) 85% by weight Aniline hydrochloride 1% by weight Rosin 6% by weight Dimethyl phthalate 3% by weight Parafine wax 2% by weight Butyl cellosolve 3% by weight 100% by weight January at ℃, 10 at 30℃
No skin tension was observed.
考案の効果
本考案によれば、はんだペーストの露出部表面
に塗布層又は析出層を形成したので、はんだペー
ストを空気から遮断してその酸化を防止すること
ができる。しかも、その方法も塗布又はワツクス
を単にはんだペーストに混合するだけでよいから
特別の装置を必要とせず、また、その作業性も良
く、さらにその使用に当たつても特別な面倒がな
い。Effects of the Invention According to the present invention, since a coating layer or a deposited layer is formed on the surface of the exposed portion of the solder paste, the solder paste can be shielded from air to prevent its oxidation. Moreover, since the method requires only coating or simply mixing the wax with the solder paste, no special equipment is required, the workability is good, and there is no particular trouble in its use.
図は本考案の一実施例のはんだペースト包装体
の断面図である。
図中、１は容器本体、２は蓋体、３ははんだペ
ースト、４は塗布膜である。
The figure is a sectional view of a solder paste package according to an embodiment of the present invention. In the figure, 1 is a container body, 2 is a lid, 3 is a solder paste, and 4 is a coating film.
Claims (1)
空気遮断塗布層又は上記はんだペーストに添加し
たワツクスを表面に析出させた空気遮断析出層を
設けたことを特徴とするはんだペースト包装体。 A solder paste package characterized in that an air-blocking coating layer or an air-blocking deposited layer in which wax added to the solder paste is deposited on the surface of an exposed portion of solder paste housed in a container is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10657083U JPS6015490U (en) | 1983-07-11 | 1983-07-11 | solder paste packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10657083U JPS6015490U (en) | 1983-07-11 | 1983-07-11 | solder paste packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6015490U JPS6015490U (en) | 1985-02-01 |
| JPH0128954Y2 true JPH0128954Y2 (en) | 1989-09-04 |
Family
ID=30249341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10657083U Granted JPS6015490U (en) | 1983-07-11 | 1983-07-11 | solder paste packaging |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6015490U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6311838B2 (en) * | 2015-05-29 | 2018-04-18 | 株式会社村田製作所 | Joining member and joining method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5170157A (en) * | 1974-12-17 | 1976-06-17 | Meiji Puranto Kogyo Kk | Aruminiumurozaino sankahimakuboshiho |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52118319U (en) * | 1976-03-05 | 1977-09-08 |
-
1983
- 1983-07-11 JP JP10657083U patent/JPS6015490U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5170157A (en) * | 1974-12-17 | 1976-06-17 | Meiji Puranto Kogyo Kk | Aruminiumurozaino sankahimakuboshiho |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6015490U (en) | 1985-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5088189A (en) | Electronic manufacturing process | |
| US4373974A (en) | Solder composition | |
| JP2003010997A (en) | Solder composition | |
| CA2221961A1 (en) | Epoxy-based, voc-free soldering flux | |
| WO2004101849A1 (en) | Surface treating agent for tin or tin alloy material | |
| JPS63220992A (en) | Method for soldering electronic parts to base plate | |
| JPH01113198A (en) | Soldering paste | |
| US4509994A (en) | Solder composition for high-density circuits | |
| JPH0128954Y2 (en) | ||
| US4215025A (en) | Water soluble adhesive coating for mounting components to printed wiring boards | |
| US4531986A (en) | Solder composition | |
| US4340167A (en) | Coated printed circuit wiring board and method of soldering | |
| JPH0358298B2 (en) | ||
| US4657589A (en) | Solder cream | |
| US2904459A (en) | Non-corrosive soldering flux for electrical application | |
| JPH03185754A (en) | Semiconductor device | |
| GB1569028A (en) | Solder-glass material filled with a granular filler | |
| JP3603399B2 (en) | Foam solder and method for attaching a small amount of substance to foam solder | |
| US4929284A (en) | Water removable solder stop | |
| US6921015B2 (en) | Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder | |
| JP2850405B2 (en) | How to store semiconductors or semiconductor components | |
| JP2525182B2 (en) | How to fix chip type electronic components | |
| JPH03184698A (en) | Solder powder for paste solder | |
| KR101168959B1 (en) | Solder Product, Surface Treatment Method of the Solder Product, and Solder Powder Surface Treated by Such a Method | |
| JPH115961A (en) | Conductive adhesive for packaging and packaging method using the same |