JPH03184698A - Solder powder for paste solder - Google Patents
Solder powder for paste solderInfo
- Publication number
- JPH03184698A JPH03184698A JP1321123A JP32112389A JPH03184698A JP H03184698 A JPH03184698 A JP H03184698A JP 1321123 A JP1321123 A JP 1321123A JP 32112389 A JP32112389 A JP 32112389A JP H03184698 A JPH03184698 A JP H03184698A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder powder
- resin film
- paste
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 63
- 239000000843 powder Substances 0.000 title claims abstract description 46
- 239000011347 resin Substances 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 230000004907 flux Effects 0.000 claims abstract description 21
- 238000005476 soldering Methods 0.000 claims abstract description 8
- 239000002904 solvent Substances 0.000 claims abstract description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 6
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 claims description 4
- 240000000972 Agathis dammara Species 0.000 claims description 4
- 229920002871 Dammar gum Polymers 0.000 claims description 4
- 150000003505 terpenes Chemical class 0.000 claims description 4
- 235000007586 terpenes Nutrition 0.000 claims description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 230000001476 alcoholic effect Effects 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 235000011837 pasties Nutrition 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 239000005456 alcohol based solvent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000010985 glycerol esters of wood rosin Nutrition 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ペースト半田に用いられる半田粉の改良に関
するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to improvements in solder powder used in paste solders.
従来の技術
一般に、電子部品の表面実装にはペースト半田が最もよ
く用いられているが、そのペースト半田はＳｎ／Ｐｂ、
Ｓｎ／Ｐｂ／Ａｇ、Ｓｎ／Ａｇ等の半田粉とロジン乃至
は有機酸、溶剤、必要に応じて添加する活性剤等のフラ
ックス溶液から組成されている。Conventional technology In general, paste solder is most often used for surface mounting of electronic components.
It is composed of solder powder such as Sn/Pb/Ag or Sn/Ag, and a flux solution containing rosin or organic acid, a solvent, and an activator added as necessary.
発明が解決しようとする課題
ところで、半田粉は８．５〜８．９程度の密度を有し、
また、フラックス溶液は０．９程度の密度を有するもの
であり、その半田粉とフラックス溶液との密度差が大き
いところから半田粉が時間の経過に伴ってフラックス溶
液中で沈降して分離することを避は得ない、このため、
そのペースト半田をスクリーン印刷やデイスペンサ等で
塗布するときには半田粉がフラックス溶液中に均一に分
散するよう攪拌しなければ、好ましい組成比で塗布する
ことができない。Problem to be solved by the invention By the way, solder powder has a density of about 8.5 to 8.9,
Additionally, the flux solution has a density of about 0.9, and since the difference in density between the solder powder and the flux solution is large, the solder powder may settle and separate in the flux solution over time. It is unavoidable, for this reason,
When applying the paste solder by screen printing or a dispenser, it is impossible to apply the solder powder in a preferred composition ratio unless the flux solution is stirred so that the solder powder is uniformly dispersed in the flux solution.
ｎにおいて、本発明は半田粉がフラックス溶液中で沈降
するのを抑え、また、酸化するのを確実に防止できるよ
う改良したペースト半田用の半田粉を提供することを目
的とする。An object of the present invention is to provide a solder powder for paste solder which is improved so as to prevent the solder powder from settling in a flux solution and to reliably prevent it from oxidizing.
課題を解決するための手段
本発明に係るペースト半田用の半田粉においては、常温
時のペースト状ではフラックス成分と非相溶で、半田付
は温度ではフラックス成分と相溶性を有するｓ４脂皮膜
で半田粉を表面被覆することにより形成されている。そ
の樹脂皮膜は４０容積％以下に形成するとよく、また、
フラックス成分のアルコール系溶剤に対して非相溶性の
ロジン系、ダンマル、クマロン系、テルペン系、ビニル
系のいずれか一つまたはこれらの混合物で形成すること
ができる。Means for Solving the Problems The solder powder for paste solder according to the present invention has an S4 oil film that is incompatible with the flux component in the paste form at room temperature, and is compatible with the flux component at temperature for soldering. It is formed by coating the surface with solder powder. The resin film is preferably formed in an amount of 40% by volume or less, and
It can be formed from any one of rosin, dammar, coumaron, terpene, and vinyl, which are incompatible with the alcohol solvent of the flux component, or a mixture thereof.
作用
この半田粉では密度の小さな樹脂皮膜で半田粉の見掛は
密度を下げることができるからフラックス溶液中で沈降
する速度を抑えることができ、また、その樹脂皮膜で粉
全体が被包されているのでリフロー以前でも酸化するの
を確実に防止することができる。Function This solder powder has a low-density resin film that lowers the apparent density of the solder powder, which reduces the rate at which it settles in the flux solution.Also, the resin film encapsulates the entire powder. Therefore, oxidation can be reliably prevented even before reflow.
この半田粉は、樹脂皮膜を４０容積％以下で形成すると
球形を保持できることによりリフローに伴って生ずるブ
ラックス流れにスムースに追従できる。また、その半田
粉では樹脂皮膜をフラックス成分のアルコール系溶剤に
対して非相溶性のロジン系、ダンマル、クマロン系、テ
ルペン系。When this solder powder is formed with a resin film of 40% by volume or less, it can maintain a spherical shape and can smoothly follow the flow of black that occurs during reflow. In addition, the solder powder uses rosin, dammar, coumaron, and terpene-based resins that are incompatible with the alcohol-based solvent of the flux component.
ビニル系のいずれか一つまたはこれらの混合物で形成す
れば、樹脂皮膜がフラックス溶液中で溶融するのを防げ
しかも１８３℃程度の半田付は温度以下で溶解し相溶す
るところから半田粉を溶融させ得て電子部品の電極やリ
ード、導電パターン等に付着させることができるように
なる。If it is made of one of the vinyl types or a mixture of these, the resin film can be prevented from melting in the flux solution, and when soldering at a temperature of about 183°C, the solder powder can be melted since it melts and is compatible with the soldering temperature below the temperature. It becomes possible to attach it to electrodes, leads, conductive patterns, etc. of electronic components.
実施例
以下、添付図面を参照して説明すれば、次の通りである
。Embodiments will now be described with reference to the accompanying drawings.
このペースト半田用の半田粉は、第１図で示すように半
田粉１を樹脂皮１ｌＩ２で表面被覆することにより形成
されている。その半田粒１には主にＳ ｎ／ｐ ｂを用
いることができ、或いはＳｎ／Ｐｂ、／Ａｇ、Ｓｎ／Ａ
ｇ等を用いてもよい、この半田粉ｌは４０〜５０μ程度
の粒径を持つものであり、その容積に対して１１脂被覆
２は４０容積％以下で、好ましくは３０容積％程度に形
成するとよい、この樹脂皮膜２は、−殻内に用いられて
いるフラックス溶液のアルコール系溶剤に対して常温時
のペースト状では非相溶性を有し、半田付は温度では当
該溶剤と相溶する樹脂で形成されている。その樹脂とし
てはエステルガム、マレイン付加樹脂、水添ロジン、ロ
ジン等のロジン系、ダンマル、クマロン系、テルペンー
フェノール樹脂を含むテルペン系、ビニル系の合成樹脂
のうち、いずれか一つ或いはこれらの混合物を用いるこ
とができる。また、それらの樹脂は１８３℃程度の半田
溶融温度以下であっていずれも１００℃程度で溶融する
。この樹脂を用いては上述したいずれかの合成樹脂を適
宜な溶剤で溶融させて予め半田粉が充填された容器内に
徐々に注入し、その溶液から溶剤を飛散させつつ容器内
の容積を４０容積％以下に保って攪拌すれば所望な容積
比の樹脂皮膜２で半田粉１を表面被覆するようにできる
。This solder powder for paste solder is formed by coating the surface of solder powder 1 with a resin coating 1lI2, as shown in FIG. For the solder grains 1, mainly Sn/p b can be used, or Sn/Pb, /Ag, Sn/A
This solder powder l has a particle size of about 40 to 50μ, and the amount of the fat coating 2 in the solder powder 11 is formed to be less than 40% by volume, preferably about 30% by volume. Then, this resin film 2 is incompatible with the alcohol-based solvent of the flux solution used in the shell in paste form at room temperature, but is compatible with the solvent at soldering temperature. Made of resin. The resin may be any one of ester gum, maleic resin, hydrogenated rosin, rosin type such as rosin, terpene type including dammar, coumaron type, terpene-phenol resin, and vinyl type synthetic resin. Mixtures can be used. Further, these resins are below the solder melting temperature of about 183°C, and all melt at about 100°C. To use this resin, one of the synthetic resins mentioned above is melted with an appropriate solvent and gradually poured into a container filled with solder powder, and while the solvent is scattered from the solution, the volume inside the container is increased to 40%. By stirring while maintaining the volume % or less, the surface of the solder powder 1 can be coated with a desired volume ratio of the resin film 2.
この表面被覆された半田粉では第２図で示すように半田
粉１の粒径：５０μｍ（Ｄ）、半田粉の容積：樹脂皮膜
の容積−６０： ３０に設定すると、樹脂皮膜２の厚み
（ｘ）は、
式（４）、Ｘ−０，１４４７Ｘ２５
ｘ＝３．６１７８μｍとなる。With this surface-coated solder powder, as shown in Fig. 2, if the particle size of solder powder 1 is set to 50 μm (D), the volume of solder powder: volume of resin film - 60: 30, the thickness of resin film 2 ( x) is Equation (4), X-0,1447X25 x=3.6178 μm.
そのため、外径は１４．４７％程度大きくなる。Therefore, the outer diameter increases by about 14.47%.
また、この表面被覆された半田粉の見掛は密度ｐ ｓ
＋Ｒ（ｇ ／ｃｍ’）は半田粉１の密度：ａ、９ｇ／Ｃ
１，樹脂皮膜２の密度：１．１ｇ／ｃｍ’と、すると、
３０ｘ１． １＋６０ｘ８． ９
９０
＝６．３ｇ／ｃｍ’
で２９．２１％も小さくなる。Also, the apparent density of the solder powder coated on the surface is ps
+R (g/cm') is the density of solder powder 1: a, 9g/C
1. Density of resin film 2: 1.1 g/cm', then 30x1. 1+60x8. 9 90 = 6.3 g/cm', which is 29.21% smaller.
そのことから、この半田粉では沈降速度の因子として半
田粉の密度： ８．９ ｇ／ｃｔｉ” 、フラックス溶
液の密度： ０ 、９ ｇ ／ ｃｍ’を考えれば、通
常は８．９−０．９冨８．Ｏであるのに対して６．３−
０．９＝５．４と３２．５％も小さくなることが判る。Therefore, considering the density of the solder powder: 8.9 g/cti'' and the density of the flux solution: 0.9 g/cm' as factors for the settling rate of this solder powder, it is normally 8.9-0. 9 to 8.O while 6.3-
It can be seen that 0.9=5.4, which is 32.5% smaller.
従って、この表面被覆された半田粉ではフラックス溶液
中で沈降を遅くできるから、ペースト半田として半田粉
を長時間に亘って均一に分散させた状態に安定よく保て
、また、半田粉１が酸化するのも樹脂皮膜２で確実に防
止できるようになる。Therefore, since this surface-coated solder powder can slow down the settling in the flux solution, the solder powder can be stably maintained in a uniformly dispersed state for a long time as a paste solder, and the solder powder 1 can be oxidized. This can also be reliably prevented with the resin film 2.
発明の効果
以上の如く、本発明に係るペースト半田用の半田粉に依
ればペースト半田の組成状態を長時間に亘って安定よく
保て、しかもその半田粉が酸化するのも抑えられるから
電子部品を表面実装する等に好適なペースト半田を得る
ことを可能にするものである。As described above, the solder powder for paste solder according to the present invention can maintain the composition of the paste solder stably for a long period of time, and also prevent the solder powder from oxidizing. This makes it possible to obtain paste solder suitable for surface mounting components.
第１図は本発明に係るペースト半田用造粒半田粉の内部
構造を示す説明図、第２図は同半田粉の粒径を示す説明
図である。
１：半田粉、２：樹脂皮膜
特 許 出 願 人 ティーデイ−ケイ株式会社第
図FIG. 1 is an explanatory diagram showing the internal structure of the granulated solder powder for paste solder according to the present invention, and FIG. 2 is an explanatory diagram showing the particle size of the solder powder. 1: Solder powder, 2: Resin film Patent applicant: TDC Co., Ltd.
Claims (3)
で、半田付け温度ではフラックス成分と相溶性を有する
樹脂皮膜（２）で半田粉（１）を表面被覆したことを特
徴とするペースト半田用の半田粉。(1) A paste solder characterized in that the surface of the solder powder (1) is coated with a resin film (2) that is incompatible with the flux component in paste form at room temperature but compatible with the flux component at the soldering temperature. Solder powder for.
ことを特徴とする請求項１記載の半田粉。(2) The solder powder according to claim 1, wherein the resin film (2) is formed in an amount of 40% by volume or less.
ル系溶剤に対して非相溶性のロジン系、ダンマル、クマ
ロン系、テルペン系、ビニル系のいずれか一つまたはこ
れらの混合物で形成したことを特徴とする請求項１記載
の半田粉。(3) The above resin film (2) is made of one of rosin, dammar, coumaron, terpene, and vinyl, or a mixture thereof, which is incompatible with the alcohol solvent of the flux component. The solder powder according to claim 1, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1321123A JPH03184698A (en) | 1989-12-11 | 1989-12-11 | Solder powder for paste solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1321123A JPH03184698A (en) | 1989-12-11 | 1989-12-11 | Solder powder for paste solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03184698A true JPH03184698A (en) | 1991-08-12 |
Family
ID=18129070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1321123A Pending JPH03184698A (en) | 1989-12-11 | 1989-12-11 | Solder powder for paste solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03184698A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6881278B2 (en) | 1998-06-10 | 2005-04-19 | Showa Denko K.K. | Flux for solder paste |
| CN102618130A (en) * | 2012-03-26 | 2012-08-01 | 江门市苏比化工有限公司 | Chlorine-free environment-friendly polyethylene plastic coating accelerator |
| CN108500501A (en) * | 2018-04-09 | 2018-09-07 | 苏州科技大学 | A kind of epoxy tin cream |
-
1989
- 1989-12-11 JP JP1321123A patent/JPH03184698A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6881278B2 (en) | 1998-06-10 | 2005-04-19 | Showa Denko K.K. | Flux for solder paste |
| CN102618130A (en) * | 2012-03-26 | 2012-08-01 | 江门市苏比化工有限公司 | Chlorine-free environment-friendly polyethylene plastic coating accelerator |
| CN108500501A (en) * | 2018-04-09 | 2018-09-07 | 苏州科技大学 | A kind of epoxy tin cream |
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