JPH01241395A - Cream solder - Google Patents
Cream solderInfo
- Publication number
- JPH01241395A JPH01241395A JP63064741A JP6474188A JPH01241395A JP H01241395 A JPH01241395 A JP H01241395A JP 63064741 A JP63064741 A JP 63064741A JP 6474188 A JP6474188 A JP 6474188A JP H01241395 A JPH01241395 A JP H01241395A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- melting point
- alloy
- solder alloy
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 72
- 239000006071 cream Substances 0.000 title claims abstract description 16
- 238000002844 melting Methods 0.000 claims abstract description 38
- 230000008018 melting Effects 0.000 claims abstract description 38
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 32
- 239000000956 alloy Substances 0.000 claims abstract description 32
- 239000000843 powder Substances 0.000 claims abstract description 21
- 238000005476 soldering Methods 0.000 abstract description 13
- 230000004907 flux Effects 0.000 abstract description 10
- 239000006023 eutectic alloy Substances 0.000 abstract 1
- 239000000155 melt Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明はプリント基板に表面装着したチップ部品のはん
だ付けに使用されるクリームはんだの改良に関する。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to improvements in cream solder used for soldering chip components surface-mounted on printed circuit boards.
［従来の技術］
電子機器の小型化に伴い、プリント基板にチップ部品を
高密度で実装することが要求されてきた。このため、表
面実装されるチンブ部品の比率が高まってきた０表面実
装法においては、プリント基板に先ずクリームはんだを
印刷し、その−ヒにチップ部品の接合部を載置し、リフ
ロー炉に入れてはんだ付けする。[Background Art] With the miniaturization of electronic devices, there has been a demand for high-density mounting of chip components on printed circuit boards. For this reason, the proportion of chip components that are surface-mounted has increased.In the surface mount method, cream solder is first printed on a printed circuit board, the bonded parts of the chip components are placed on the printed circuit board, and the bonded parts are placed in a reflow oven. solder.
この表面実装法に使用されるクリーンはんだは大体２５
０〜５００メツシユのはんだ合金粉末とフラフクスを混
合したものである６フランクスはロジン又は変性ロジン
を主成分とし、それに溶剤、活性剤等が配合される。粉
末のはんだ合金としては、はんだ付は温度に応じた融点
を持つものが一種類だけ選ばれていた。例えば、高温は
んだ付は用には融点２２１℃（７） ９６ 、５ Ｓ
ｎ ７３ 、５Ａｇ、汎用プリント基板用には融点１８
３°Ｃの６３Ｓｎ／３７Ｐｂ（共晶）、低温はんだ付は
用には融点１６０℃の４２ Ｓ ｎ ／ ４２ Ｐ ｂ
／ １４ Ｂ ｉ／２Ａｇがそれぞれ単独で使用され
ていた。The clean solder used in this surface mounting method is approximately 25
6 Franx, which is a mixture of 0 to 500 mesh solder alloy powder and Fluffx, has rosin or modified rosin as its main component, and a solvent, an activator, etc. are mixed therein. Only one type of powdered solder alloy was selected for soldering, which had a melting point that depended on the temperature. For example, high temperature soldering requires a melting point of 221°C (7) 96, 5 S.
n73, 5Ag, melting point 18 for general purpose printed circuit boards
63Sn/37Pb (eutectic) at 3°C, 42Sn/42Pb with melting point of 160°C for low temperature soldering.
/14B i/2Ag were each used alone.
［発明が解決しようとする課題］
表面実装されたチップ部品をリフロー炉ではんだ付けし
たとき、第１図に示すように、チップ部品の片側がはん
だ付けされずに立上がるマンハッタン現象が発生する。[Problems to be Solved by the Invention] When surface-mounted chip components are soldered in a reflow oven, a Manhattan phenomenon occurs in which one side of the chip component stands up without being soldered, as shown in FIG.
はんだ付は温度に比較して融点の低いはんだ合金を使用
すると、マンハッタン現象は起こりにくいといわれてい
るが、完全には防止できない上に、はんだ接合部の耐熱
温度が低いという問題が発生する。リフローはんだ付け
の別の問題は短絡の原因となるはんだポールが発生しや
すいことである。本発明はこれらの問題を解決するため
になされたものであり、その目的とするところは、表面
実装プリント基板に使用されるクリームはんだであって
、マンハッタン現象やはんだポールの発生が少ないもの
を提供することにある。It is said that the Manhattan effect is less likely to occur when soldering uses a solder alloy with a low melting point compared to the soldering temperature, but it cannot be completely prevented and the problem arises that the heat resistance of the solder joint is low. Another problem with reflow soldering is that it is prone to solder poles that can cause short circuits. The present invention was made to solve these problems, and its purpose is to provide a cream solder for use in surface-mounted printed circuit boards that is less likely to generate Manhattan phenomenon or solder poles. It's about doing.
［課題を解決するだめの手段］
本願の発明者はマンハッタン現象の再現テストを繰返し
た結果、第１図に示すように、リフロー炉において、マ
ンハッタン現象はチップ部品の両側に印刷されたクリー
ムはんだの一方が溶けてチップ部品の電極をぬらし、そ
の溶けたはんだの表面張力が作用するときに、他方がチ
ップ部品の電極をぬらす程には溶けていない状態の極〈
短い時間に発生するものであり、このとき、溶けた側の
はんだの表面張力によって反対側が引き剥がされてはね
」二ることがわかった。そこでマンハッタン現象はチッ
プ部品の両側のはんだの一方だけが他方よりも早く完全
に溶けないようにすれば防止することができるが、双方
を均一に溶かすことは至難の技であるから、一方が溶け
て張力を持つ前に他方が少しでもぬれていればよいと考
え１種々のテストを繰返し、前記目的を達成し得る本発
明に到達した。[Means for Solving the Problem] The inventor of the present application repeatedly conducted tests to reproduce the Manhattan phenomenon, and as a result, as shown in FIG. One pole melts and wets the electrodes of the chip component, and when the surface tension of the melted solder acts, the other pole does not melt enough to wet the electrodes of the chip component.
It was found that this phenomenon occurs over a short period of time, and that at this time, the surface tension of the solder on the melted side causes the solder on the other side to be peeled off. Therefore, the Manhattan phenomenon can be prevented by preventing one side of the solder on both sides of the chip component from melting completely faster than the other, but it is extremely difficult to melt both sides uniformly, so one side melts. We thought that it would be sufficient if the other side was wet even a little before applying tension, and after repeating various tests, we arrived at the present invention that can achieve the above object.
本発明が採用した手段は、融点の異なる二種類以上のは
んだ合金粉末とフラックスを混合してクリームはんだと
したことにある。二種類のはんだ合金の場合、融点の高
いはんだ合金にははんだ利は温度に応するものを選び、
その割合は重量比で７０〜９７％とする。高い融点のは
んだ合金を５ｎ−Ｐｂ合金とし、５ｎ−Ｐｂ−Ｂｉ三三
元共合合金低い融点（９９，５°Ｃ）のはんだ合金とす
ることが望ましい。The means adopted by the present invention is to mix two or more types of solder alloy powders with different melting points and flux to form a cream solder. In the case of two types of solder alloys, the solder alloy with a high melting point should have a soldering profit that corresponds to the temperature.
The proportion is 70 to 97% by weight. It is desirable that the solder alloy with a high melting point is a 5n-Pb alloy, and the solder alloy with a low melting point (99.5° C.) is a 5n-Pb-Bi ternary conjugate alloy.
［作用コ
本発明のクリームはんだは、はんだ付は温度に対して低
目のはんだ合金を重量比で３〜３０％含んでいるから、
リフロー炉で加熱すると、先ず、この融点の低いはんだ
合金粉末が溶は出す、この場合、チップ部品の両側の一
方のものが先に完全に溶けても、全体としては半溶融状
態であり、又、その量は合金全体の３０％以下であるか
ら、表面張力は小さくチップ部品の反対側を引き剥す力
はない、しかし、融点の高いはんだ合金粉末が溶解する
前に、両側の低融点のはんだ合金粉末はすべて完全に溶
けるから、チップ部品は両側から付着して安定する。[Function] The cream solder of the present invention contains 3 to 30% by weight of a solder alloy that is low in soldering temperature.
When heated in a reflow oven, this solder alloy powder with a low melting point melts first. , since its amount is less than 30% of the entire alloy, the surface tension is small and there is no force to peel off the other side of the chip component. However, before the high melting point solder alloy powder melts, the low melting point solder on both sides All the alloy powder is completely melted, so the chip parts stick together from both sides and are stable.
はんだポールは、フラックスが溶解して流れ出したとぎ
に、はんだ粉末の一部がフラックスと共に流れ出し、そ
の流れ出たはんだ粉末が溶融後も元に戻らないために発
生するものである０本発明のはんだは低融点はんだが早
期に溶けて周囲の高融点はんだ粉末に付着し、溶解して
いない高融点はんだ粉末の一部がフラックスと共に流出
することを防止する。さらに、低融点はんだの融点をフ
ラックスのロジンよりも低くすると、フラックスよりも
先に低融点はんだが溶けて主成分の高融点はんだ粉末を
付着保持するから、はんだポールの発生は完全に防止す
ることができる。Solder poles occur because once the flux melts and flows out, some of the solder powder flows out with the flux, and the flowed out solder powder does not return to its original state even after melting. This prevents the low melting point solder from melting early and adhering to the surrounding high melting point solder powder, thereby preventing a portion of the unmelted high melting point solder powder from flowing out together with the flux. Furthermore, if the melting point of the low melting point solder is lower than the rosin of the flux, the low melting point solder melts before the flux and adheres and holds the main component, the high melting point solder powder, so the generation of solder poles can be completely prevented. Can be done.
チップ部品の両側の高融点はんだ合金粉末のいずれか一
方が先に完全に溶け、その溶けた側の表面張力が大きく
なっても、反対側には完全に溶融した低融点はんだ合金
の付着力が作用しているので、反対側を引き剥すことは
できない、このようにしてマンハッタン現象及びはんだ
ポールは共に防止される。Even if one of the high melting point solder alloy powders on both sides of the chip component melts completely first, and the surface tension on that melted side increases, the adhesive force of the completely melted low melting point solder alloy on the other side increases. Since it is working, it is not possible to pull off the other side, thus both Manhattan effect and solder poles are prevented.
［実施例］ 本発明のクリームはんだを実施例に基づいて説明する。[Example] The cream solder of the present invention will be explained based on examples.
実施例及び比較例のはんだ合金粉末の粒度はいずれも２
５０メツシユ（粒径的６４ｇｍ）であり、合金組成、融
点、混合比は次表のとおりである。The particle size of the solder alloy powder in both Examples and Comparative Examples is 2.
50 mesh (64 gm in particle size), and the alloy composition, melting point, and mixing ratio are as shown in the following table.
［以下余白］
番号１〜４のはんだ合金粉末に１０重量％のフラックス
を加えて汎用プリント基板用クリームはんだとし、番号
５〜８のはんだ合金粉末に１２重は％のフラックスを加
えて銀電極プリント基板用クリームはんだとした。これ
らのクリームはんだを別／、にプリント基板に印捺し、
各基板にチップ抵抗時のチンブ部品を装着した。ついで
、テスト炉に入れ、リフロー炉と同一の加熱温度プロフ
ィールではんだ付はテストをした。そのテストにおいて
、マンハッタン現象を起こしたチンブ部品の発生率を調
へた。はんだポールについては不良品と同定されるもの
の発生率を調べた。結果は表に示す通りであった。[Left below] 10% by weight of flux was added to the solder alloy powders numbered 1 to 4 to make cream solder for general-purpose printed circuit boards, and 12% flux was added to the solder alloy powders numbered 5 to 8 to print silver electrodes. It was used as cream solder for circuit boards. Separately, print these cream solders on the printed circuit board,
Chimbu parts for chip resistance were attached to each board. Next, it was placed in a test oven and the soldering was tested using the same heating temperature profile as the reflow oven. In this test, we investigated the incidence of chimpanic parts that caused the Manhattan phenomenon. Regarding solder poles, we investigated the incidence of those identified as defective products. The results were as shown in the table.
表を一見すれば１本発明実施例（番号１〜３゜５−７）
のクリームはんだは、従来比較例（番号４．８）のもの
に比べてマンハッタン現象と不良はんだポールの発生が
著しく小さいことがわかる。At a glance at the table, one example of the present invention (numbers 1 to 3゜5-7)
It can be seen that the Manhattan phenomenon and the occurrence of defective solder poles are significantly smaller in the cream solder shown in Figure 3, compared to the conventional comparative example (No. 4.8).
［発明の効果］
Ｌ記の通り、本発明のクリームはんだは、従来のはんだ
付は温度に適した一種類のはんだ合金粉末しか含有しな
いものとは異なり、はんだ付は温度に適したはんだ合金
粉末以外にそれよりも融点の低いはんだ合金粉末を含む
ため、リフロー炉内において、チップ部品の両側に印捺
されたクリームはんだの一方のみが完全に溶解していな
いという状態には短時間といえどもなることがない、し
たがって、先に溶けたはんだ合金の表面張力で反対側が
立上がるマンハッタン現象は大幅に減少する。又、先に
溶けた低融点はんだ合金は主成分の高融点はんだ合金粉
末に付着して高融点はんだ合金がフラックスと共に流出
することを防止すジから、はんだポールの発生を未然に
防止する。[Effects of the Invention] As described in L, the cream solder of the present invention differs from conventional soldering in that it contains only one type of solder alloy powder that is suitable for the temperature; In addition, it contains solder alloy powder with a lower melting point than that, so in the reflow oven, only one side of the cream solder printed on both sides of the chip component is not completely melted, even for a short time. Therefore, the Manhattan effect, in which the opposite side rises due to the surface tension of the solder alloy melted first, is greatly reduced. Further, the previously melted low melting point solder alloy adheres to the high melting point solder alloy powder, which is the main component, and prevents the high melting point solder alloy from flowing out together with the flux, thereby preventing the generation of solder poles.
第１図はマンハ・ンタン現象の発生を示す略図である。 FIG. 1 is a schematic diagram showing the occurrence of the Manha-Ntan phenomenon.
Claims (1)
てなるクリームはんだ。1) Cream solder made by mixing two or more types of solder alloy powders with different melting points.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63064741A JPH01241395A (en) | 1988-03-19 | 1988-03-19 | Cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63064741A JPH01241395A (en) | 1988-03-19 | 1988-03-19 | Cream solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01241395A true JPH01241395A (en) | 1989-09-26 |
Family
ID=13266882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63064741A Pending JPH01241395A (en) | 1988-03-19 | 1988-03-19 | Cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01241395A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0614721A1 (en) * | 1993-03-08 | 1994-09-14 | E.I. Du Pont De Nemours And Company | Kinetic solder paste composition |
| EP0673706A1 (en) * | 1994-03-22 | 1995-09-27 | AT&T Corp. | Solder paste mixture |
| US6648210B1 (en) * | 1999-02-16 | 2003-11-18 | Multicore Solders Limited | Lead-free solder alloy powder paste use in PCB production |
| WO2005084877A1 (en) * | 2004-03-09 | 2005-09-15 | Senju Metal Industry Co. Ltd. | Solder paste |
| JP2009283453A (en) * | 2008-04-23 | 2009-12-03 | Panasonic Corp | Conductive paste and mounting structure using the same |
-
1988
- 1988-03-19 JP JP63064741A patent/JPH01241395A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0614721A1 (en) * | 1993-03-08 | 1994-09-14 | E.I. Du Pont De Nemours And Company | Kinetic solder paste composition |
| EP0673706A1 (en) * | 1994-03-22 | 1995-09-27 | AT&T Corp. | Solder paste mixture |
| US6648210B1 (en) * | 1999-02-16 | 2003-11-18 | Multicore Solders Limited | Lead-free solder alloy powder paste use in PCB production |
| WO2005084877A1 (en) * | 2004-03-09 | 2005-09-15 | Senju Metal Industry Co. Ltd. | Solder paste |
| US8961709B1 (en) | 2004-03-09 | 2015-02-24 | Senju Metal Industry Co., Ltd. | Solder paste |
| JP2009283453A (en) * | 2008-04-23 | 2009-12-03 | Panasonic Corp | Conductive paste and mounting structure using the same |
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