JPH02117794A - Cream solder - Google Patents
Cream solderInfo
- Publication number
- JPH02117794A JPH02117794A JP26992488A JP26992488A JPH02117794A JP H02117794 A JPH02117794 A JP H02117794A JP 26992488 A JP26992488 A JP 26992488A JP 26992488 A JP26992488 A JP 26992488A JP H02117794 A JPH02117794 A JP H02117794A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- temperature
- melted
- kinds
- cream solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 46
- 239000006071 cream Substances 0.000 title claims abstract description 17
- 230000005496 eutectics Effects 0.000 claims abstract description 8
- 230000008018 melting Effects 0.000 claims abstract description 6
- 238000002844 melting Methods 0.000 claims abstract description 6
- 229910045601 alloy Inorganic materials 0.000 claims abstract 4
- 239000000956 alloy Substances 0.000 claims abstract 4
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000011889 copper foil Substances 0.000 abstract description 6
- 238000007650 screen-printing Methods 0.000 abstract 1
- 239000006104 solid solution Substances 0.000 abstract 1
- 239000000155 melt Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明はコンピュータ等の情報機器や、ビデオ。[Detailed description of the invention] Industrial applications The present invention is applicable to information equipment such as computers and videos.
オーデ、イオ機器の半導体集積回路（以下ＩＣと呼ぶ）
の実装に用いられるクリーム半田に関するものである。Semiconductor integrated circuits (hereinafter referred to as ICs) for audio and audio equipment
This relates to cream solder used for mounting.
従来の技術
一般に半導体集積回路の実装においては、プリント基板
の上にクリーム半田をヌクリーン印刷又はディヌペンサ
で塗布し、その上にＩＣをのせ、赤外線等のりフロー炉
に入れ、クリーム半田を融かしていた。クリーム半田は
Ｓｎ：Ｐｂの比率が６３：３７重−量比の共晶半田のた
め１８３°Ｃ以上で融け、半田の流れもよく、部品に対
し濡れ性が良かった。Conventional technology In general, when mounting semiconductor integrated circuits, cream solder is applied onto a printed circuit board using Nuclean printing or Dinupensa, an IC is placed on top of the solder, and the cream solder is melted by placing the IC in a glue flow furnace such as infrared rays. Ta. The cream solder was a eutectic solder with a Sn:Pb ratio of 63:37 by weight, so it melted at 183°C or higher, had good solder flow, and had good wettability to the parts.
発明が解決しようとする課題
しかしクリーム半田が融けると、共晶半田のため急激に
融け、濡れ性が良いため、Ｉ ＣＩＪ−ドに沿−て半田
が上がる。するとプリント基板上の銅箔パターンにある
半田がリードの方に上がり、リードと銅箔パターン間に
隙間が発生しオープン不良となることがあった。Problems to be Solved by the Invention However, when the cream solder melts, it melts rapidly because it is a eutectic solder and has good wettability, so the solder rises along the ICIJ-de. As a result, the solder on the copper foil pattern on the printed circuit board rises toward the leads, creating a gap between the leads and the copper foil pattern, resulting in an open defect.
本発明はこの種の欠点を除去したクリーム半田を提供す
ることを目的とするものである。The object of the present invention is to provide a cream solder that eliminates this type of drawback.
課題を解決するための手段
本発明は共晶でない成分の半田を一部添加し、濡れ性を
抑えたクリーム半田を構成するものである。Means for Solving the Problems The present invention constitutes a cream solder with suppressed wettability by adding a portion of solder that is not a eutectic component.
実施例
一般に半田成分のＰｂ１００％やＳｎ：Ｐｂの重量比率
１ｏ：ｅｏ迄の半田は２６３〜３２７℃で融ける、又Ｓ
ｎ：Ｐｂの８ｎの増やした半田は２００〜２３２℃で融
ける。また１８３°Ｃからそれらの温度の間では固融状
態であり、流動性は悪い。リフロー温度を２３０°Ｃ前
後にするとＳｎの多い成分の半田が融け、ｐｂの多い半
田は融けず、このためＩＣリードの上へは上がらない。Examples Generally, solder with a solder component of 100% Pb or a Sn:Pb weight ratio of 1o:eo melts at 263 to 327°C, and S
n: Pb 8n increased solder melts at 200-232°C. Moreover, it is in a solid state at temperatures between 183°C and those temperatures, and its fluidity is poor. When the reflow temperature is set to around 230° C., the solder containing a large amount of Sn melts, while the solder containing a large amount of PB does not melt, and therefore does not rise above the IC leads.
ここでクリーム半田の粒子成分を２種類用意する。ｔず
一つの半田成分は８ｎ：Ｐｂを７ｗｔ％：９３ｗｔ％、
もう一方の半田成分をＳｎ：ムｇ９６．５ ｗｔ％：３
，５ｗｔ％とし、２種類の半田が完全に融けた時、Ｓｎ
：Ｐｂ共晶点の溶融温度付近になるように、２種類を配
合する。このクリーム半田をプリント基板の銅箔の上に
７クリーン印刷又はデイスペンサーにて塗布し、この上
にフラ・フトバ、１ケージタイプのＩＣをのせ、赤外線
やペーパーのりフロー炉に入れる。Here, two types of cream solder particle components are prepared. Each solder component is 8n:Pb, 7wt%:93wt%,
The other solder component is Sn: 96.5 wt%: 3
, 5wt%, and when the two types of solder are completely melted, Sn
: The two types are blended so that the melting temperature is near the Pb eutectic point. This cream solder is applied onto the copper foil of the printed circuit board using 7Clean printing or a dispenser, a Fura-Futoba, 1-cage type IC is placed on top of this, and the product is placed in an infrared ray or paper glue flow furnace.
この時、リフロー炉の温度は２３０°Ｃ前後であシ、ま
ずＳｎの多い半田成分が融けだし、もう−方のｐｂの多
い半田は融けず固融状態である、このため半田の濡れ性
が抑えられ、ＩＣリードへの半田の上がりが抑えられる
。At this time, the temperature of the reflow oven is around 230°C, and the solder component with a high amount of Sn melts first, while the other solder component with a high amount of PB does not melt and remains in a solid state, so the wettability of the solder decreases. This prevents solder from rising to the IC leads.
発明の効果
クリーム半田の粒子成分を２種類にして、一方を高融点
にすることにより、共晶半田−成分のように一度に液状
にならず、液状とザラ目状とが混在するため液状の半田
の流動性をおさえることができ、ＩＣリードへの半田吸
い上がシによるＩＣリードと銅箔のオーブン不良が防が
れ、その効果は大きい。また銀が入っているため、銀電
極を用いた厚膜回路やチップ部品の電極に銀電極を用い
たものに対し、半田付けによって銀食われ現象が起こり
、接続不良や、オープン不良を防止することができる。Effects of the Invention By using two types of cream solder particle components, one of which has a high melting point, it does not become liquid all at once like the eutectic solder component, but because liquid and grainy particles are mixed, it becomes liquid. The fluidity of the solder can be suppressed, and oven failure of the IC lead and copper foil due to solder wicking onto the IC lead can be prevented, which is highly effective. In addition, since it contains silver, thick film circuits that use silver electrodes and chip components that use silver electrodes can be eaten away by soldering, which prevents connection failures and open failures. be able to.
Claims (2)
高い温度で溶融する特性を有する２種以上の合金より構
成され、共晶点半田に近い温度で溶融することを特徴と
するクリーム半田。(1) A cream solder consisting of two or more alloys, each of which has the property of melting at a temperature higher than the reflow temperature, and melting at a temperature close to the eutectic point of the solder.
なることを特徴とする特許請求の範囲第１項記載のクリ
ーム半田。(2) The cream solder according to claim 1, wherein one of the metals and alloys is silver and an alloy containing silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26992488A JP2512108B2 (en) | 1988-10-26 | 1988-10-26 | Cream Handa |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26992488A JP2512108B2 (en) | 1988-10-26 | 1988-10-26 | Cream Handa |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02117794A true JPH02117794A (en) | 1990-05-02 |
| JP2512108B2 JP2512108B2 (en) | 1996-07-03 |
Family
ID=17479100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26992488A Expired - Fee Related JP2512108B2 (en) | 1988-10-26 | 1988-10-26 | Cream Handa |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2512108B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0503015A1 (en) * | 1990-09-24 | 1992-09-16 | Ase Americas, Inc. | Photovoltaic cells with improved thermal stability |
| JPH05185278A (en) * | 1991-11-07 | 1993-07-27 | Senju Metal Ind Co Ltd | Cream solder |
| JPH07276076A (en) * | 1994-04-08 | 1995-10-24 | Matsushita Electric Ind Co Ltd | Cream solder |
| JPH0899189A (en) * | 1994-08-02 | 1996-04-16 | Showa Denko Kk | Cream solder |
| CN1052179C (en) * | 1994-08-02 | 2000-05-10 | 昭和电工株式会社 | Solder paste for ball grid array |
-
1988
- 1988-10-26 JP JP26992488A patent/JP2512108B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0503015A1 (en) * | 1990-09-24 | 1992-09-16 | Ase Americas, Inc. | Photovoltaic cells with improved thermal stability |
| JPH05185278A (en) * | 1991-11-07 | 1993-07-27 | Senju Metal Ind Co Ltd | Cream solder |
| JPH07276076A (en) * | 1994-04-08 | 1995-10-24 | Matsushita Electric Ind Co Ltd | Cream solder |
| JPH0899189A (en) * | 1994-08-02 | 1996-04-16 | Showa Denko Kk | Cream solder |
| CN1052179C (en) * | 1994-08-02 | 2000-05-10 | 昭和电工株式会社 | Solder paste for ball grid array |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2512108B2 (en) | 1996-07-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |