JPH08141780A - Solder paste - Google Patents
Solder pasteInfo
- Publication number
- JPH08141780A JPH08141780A JP6287777A JP28777794A JPH08141780A JP H08141780 A JPH08141780 A JP H08141780A JP 6287777 A JP6287777 A JP 6287777A JP 28777794 A JP28777794 A JP 28777794A JP H08141780 A JPH08141780 A JP H08141780A
- Authority
- JP
- Japan
- Prior art keywords
- solder paste
- solder
- conductive particles
- flux
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
- H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、はんだ付けに使用する
主にはんだ粉末とフラックスよりなるソルダーペースト
に関し、はんだ付け強度を向上するソルダーペーストに
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder paste mainly composed of solder powder and flux used for soldering, and more particularly to a solder paste for improving soldering strength.
【０００２】[0002]
【従来の技術】従来よりテレビジョン受像機やラジオ受
信機或いはカセットテープレコーダー等の各種電子機器
には多くのプリント回路板が組み込まれている。そし
て、上記プリント回路板には、数多くの電子部品等が実
装されている。2. Description of the Related Art Conventionally, many printed circuit boards are incorporated in various electronic devices such as a television receiver, a radio receiver, a cassette tape recorder and the like. And many electronic parts etc. are mounted in the said printed circuit board.
【０００３】上記プリント回路板を形成するプリント配
線板に電子部品を実装するにあたっては、電子部品の電
極をプリント配線板の配線回路パターンのランド部に対
してはんだ付けしており、これにはペースト状のフラッ
クスをはんだ粉末と混練し、分散させたソルダーペース
トを使用している。When mounting an electronic component on a printed wiring board forming the printed circuit board, electrodes of the electronic component are soldered to lands of a wiring circuit pattern of the printed wiring board, and paste is applied to this. A flux-like flux is kneaded with solder powder and dispersed to use a solder paste.
【０００４】[0004]
【発明が解決しようとする課題】ところで、上記のよう
なプリント回路板においては、電子部品等の小型化が進
み、１６０８サイズ（１．６ｍｍ×０．８ｍｍ角サイズ
のチップ部品）といったものに代わって１００５サイズ
のような小型のチップ部品が使用されるようになってき
ている。By the way, in the printed circuit board as described above, electronic parts and the like have been downsized, and have been replaced by 1608 size (1.6 mm × 0.8 mm square size chip parts). As a result, small chip parts such as 1005 size are being used.
【０００５】しかしながら、上記のような小型の電子部
品をソルダーペーストを使用したはんだ付けにより実装
すると、十分なはんだ付け強度が得られないといった不
都合が生じている。However, when the above-mentioned small electronic component is mounted by soldering using a solder paste, there is a disadvantage that sufficient soldering strength cannot be obtained.
【０００６】これは、実装する電子部品が小型化すれ
ば、当然のことながら、電子部品の電極とランド部が対
向する接合部分の面積が小さくなってしまい、接合部分
に配されるソルダーペーストの量が少なくなり、この部
分に配されるはんだの量も少なくなってしまうためであ
る。[0006] This is because if the electronic component to be mounted is miniaturized, the area of the joint portion where the electrode of the electronic component and the land portion are opposed to each other is naturally reduced, so that the solder paste disposed on the joint portion becomes smaller. This is because the amount becomes smaller and the amount of solder arranged in this portion also becomes smaller.
【０００７】これに対し、電子部品の電極とランド部の
対向面間にある程度の間隙を積極的に形成し、接合部分
のソルダーペーストの量を確保することが好ましいとさ
れている。On the other hand, it is said that it is preferable to positively form a certain amount of gap between the facing surfaces of the electrode and the land portion of the electronic component to secure the amount of the solder paste at the joint portion.
【０００８】しかしながら、現在使用されているソルダ
ーペーストを電子部品の電極とランド部間に配し、この
状態で溶融凝固（いわゆる、リフロー）させた場合、電
極とランド部間の間隙を積極的に形成し、接合部分のソ
ルダーペーストの厚みを規制して該ソルダーペーストの
量を規制することは困難である。However, when the currently used solder paste is placed between the electrode and the land portion of the electronic component and melted and solidified (so-called reflow) in this state, the gap between the electrode and the land portion is positively set. It is difficult to control the thickness of the solder paste formed and to control the amount of the solder paste by controlling the thickness of the solder paste.
【０００９】また、このように接合部分のソルダーペー
ストの量の規制が困難であることから、はんだ付け強度
のばらつきも生じ、製造歩留りの低下等の要因となって
いる。Further, since it is difficult to control the amount of the solder paste in the joint portion as described above, variations in soldering strength also occur, which causes a reduction in manufacturing yield.
【００１０】そこで本発明は、従来の実情に鑑みて提案
されたものであり、リフローした場合のソルダーペース
トの量の規制を可能とし、該ソルダーペースト中のはん
だの量も規制してはんだ付け強度の向上を可能とするソ
ルダーペーストを提供することを目的とする。Therefore, the present invention has been proposed in view of the conventional circumstances, and makes it possible to regulate the amount of the solder paste in the case of reflow, and also regulate the amount of solder in the solder paste to thereby improve the soldering strength. It is an object of the present invention to provide a solder paste that can improve
【００１１】[0011]
【課題を解決するための手段】上述の目的を達成するた
めに本発明のソルダーペーストは、フラックスとはんだ
粉末と導電性粒子が混合分散されてなることを特徴とす
るものである。In order to achieve the above-mentioned object, the solder paste of the present invention is characterized in that a flux, a solder powder and conductive particles are mixed and dispersed.
【００１２】また、本発明のソルダーペーストにおいて
は、導電性粒子が金属であることが好ましく、銅，鉄等
が例示される。Further, in the solder paste of the present invention, the conductive particles are preferably metal, and examples thereof include copper and iron.
【００１３】さらに、本発明のソルダーペーストにおい
ては、導電性粒子の粒径が０．１ｍｍ〜０．３ｍｍであ
ることが好ましい。上記導電性粒子の粒径が、０．１ｍ
ｍよりも小径であると、一般的なはんだ粉末の大きさと
あまり変わらなくなり、電子部品の電極とランド部間の
間隙を接合強度の十分確保し得る程度にとれず、０．３
ｍｍよりも大径であると、電子部品の電極とランド部間
の間隙が大きくなり過ぎて導電性が低下してしまう等の
不都合が生じる。Further, in the solder paste of the present invention, it is preferable that the conductive particles have a particle size of 0.1 mm to 0.3 mm. The diameter of the conductive particles is 0.1 m
If the diameter is smaller than m, the size is not much different from the size of a general solder powder, and the gap between the electrode and the land portion of the electronic component cannot be sufficiently secured to have a bonding strength of 0.3.
If the diameter is larger than mm, the gap between the electrode and the land portion of the electronic component becomes too large, and the electrical conductivity is lowered, and other inconveniences occur.
【００１４】さらにまた、本発明のソルダーペーストに
おいては、導電性粒子の含有量が、フラックスとはんだ
粉末の混合物１００重量部に対して、１重量部〜５重量
部であることが好ましい。上記導電性粒子の含有量が、
１重量部未満であると、電子部品の電極とランド部間の
間隙を形成する効果が小さく、５重量部よりも多いと上
記間隙中のソルダーペースト中に含まれるはんだの量が
少なくなってしまい、接合強度を向上させることができ
なくなる。Furthermore, in the solder paste of the present invention, the content of the conductive particles is preferably 1 part by weight to 5 parts by weight with respect to 100 parts by weight of the mixture of the flux and the solder powder. The content of the conductive particles,
If it is less than 1 part by weight, the effect of forming a gap between the electrode and the land of the electronic component is small, and if it is more than 5 parts by weight, the amount of solder contained in the solder paste in the gap becomes small. However, it becomes impossible to improve the bonding strength.
【００１５】[0015]
【作用】本発明のソルダーペーストは、フラックスとは
んだ粉末と導電性粒子が混合分散されてなるため、上記
ソルダーペーストを電子部品の電極とランド部間に配
し、この状態でリフローさせた場合、上記導電性粒子が
電極とランド部間の間隙を積極的に形成し、接合部分の
ソルダーペーストの厚みを規制してソルダーペーストの
量と該ソルダーペースト中のはんだの量を規制する。In the solder paste of the present invention, the flux, the solder powder and the conductive particles are mixed and dispersed. Therefore, when the solder paste is placed between the electrode and the land portion of the electronic component and reflowed in this state, The conductive particles positively form a gap between the electrode and the land portion, and regulate the thickness of the solder paste at the joint portion to regulate the amount of solder paste and the amount of solder in the solder paste.
【００１６】また、上記導電性粒子を金属とすれば、原
料の入手も容易で製造も容易である。When the conductive particles are made of metal, the raw materials are easily available and the production is easy.
【００１７】さらに、上記導電性粒子の粒径を０．１ｍ
ｍ〜０．３ｍｍとすれば、上記電極とランド部間に好適
な大きさの間隙が形成される。Further, the particle size of the conductive particles is 0.1 m.
If it is m to 0.3 mm, a gap of a suitable size is formed between the electrode and the land portion.
【００１８】さらにまた、上記導電性粒子の含有量を、
フラックスとはんだ粉末の混合物１００重量部に対し
て、１重量部〜５重量部とすれば、上記電極とランド部
間に好適な大きさの間隙が形成されるとともに、上記間
隙中に十分な量のはんだが配されることとなる。Furthermore, the content of the conductive particles is
When 1 part by weight to 5 parts by weight is used with respect to 100 parts by weight of the mixture of the flux and the solder powder, a gap of a suitable size is formed between the electrode and the land portion, and a sufficient amount is present in the gap. Will be placed.
【００１９】[0019]
【実施例】以下、本発明の好適な実施例について実験結
果に基づいて説明する。EXAMPLES Preferred examples of the present invention will be described below based on experimental results.
【００２０】本実験例においては、導電性粒子の含有量
の異なるソルダーペーストを用意し、これを使用して配
線回路パターンのランド部に対して１６０８サイズの抵
抗部品をはんだ付けした場合の抵抗部品の電極とランド
部の対向面間の間隙中に配されるソルダーペーストの厚
さを比較するものとした。In this experimental example, a solder paste having different conductive particle contents was prepared, and a 1608 size resistor component was soldered to the land portion of the wiring circuit pattern using the solder paste. The thickness of the solder paste placed in the gap between the electrode and the facing surface of the land portion was compared.
【００２１】先ず、ソルダーペーストとして共晶はんだ
粉末とフラックスの混合物１００重量部に対して、平均
粒径０．３ｍｍの銅粒子を１重量部添加し、混合分散さ
せたものを実験例１として用意した。そして、銅粒子を
３重量部とした以外は実験例１と同様の実験例２を用意
した。さらに、銅粒子を５重量部とした以外は実験例１
と同様の実験例３も用意した。First, as a solder paste, 100 parts by weight of a mixture of eutectic solder powder and flux was added with 1 part by weight of copper particles having an average particle diameter of 0.3 mm and mixed and dispersed. did. Then, an experimental example 2 similar to the experimental example 1 was prepared except that the copper particles were 3 parts by weight. Further, Experimental Example 1 except that the copper particles were 5 parts by weight.
An experimental example 3 similar to the above was also prepared.
【００２２】上記実験例１〜３は、共晶はんだ粉末とフ
ラックスの混合物を秤量した後、銅粒子を秤量し、これ
らをへら等を用いてよく攪はんして得るものとし、上記
混合物は同一配合のものを使用することとした。このと
き、例えば実験例３においては、図１に模式的に示すよ
うに、銅粒子１は共晶はんだ粉末２中に均一に分散して
おり、実験例１，２においても同様であった。In the above Experimental Examples 1 to 3, the mixture of the eutectic solder powder and the flux was weighed, the copper particles were weighed, and these were well stirred by using a spatula or the like. We decided to use the same formulation. At this time, for example, in Experimental Example 3, as schematically shown in FIG. 1, the copper particles 1 were uniformly dispersed in the eutectic solder powder 2, and the same was true in Experimental Examples 1 and 2.
【００２３】なお、比較のため、実験例１〜３で用いた
混合物と同一配合の共晶はんだ粉末とフラックスの混合
物であり、従来のソルダーペーストと同様の比較実験例
も用意した。For comparison, a comparative experimental example, which is a mixture of eutectic solder powder and flux having the same composition as the mixture used in Experimental Examples 1 to 3, and similar to the conventional solder paste was also prepared.
【００２４】次に、上記各ソルダーペーストを配線回路
パターンのランド部上に印刷により塗布し、この上に１
６０８サイズの抵抗部品を配し、これらをリフローして
それぞれはんだ付けを行った。なお、実験例１〜３及び
比較実験例を用いてはんだ付けしたものを、便宜上、そ
れぞれ実験例１〜３及び比較実験例と称する。Next, each of the solder pastes described above is applied by printing onto the land portion of the wiring circuit pattern, and 1 is applied onto the land portion.
608 size resistance parts were arranged, these were reflowed and soldered respectively. In addition, what was soldered using Experimental Examples 1 to 3 and Comparative Experimental Example is referred to as Experimental Examples 1 to 3 and Comparative Experimental Example, respectively, for convenience.
【００２５】そして、抵抗部品の電極とランド部の対向
面間に配されるソルダーペーストの厚さを比較した。そ
の結果、実験例１〜３においては、図２に模式的に示す
ように抵抗部品１１の電極１２の対向面１２ａと絶縁基
板１３上のランド部１４の対向面１４ａ間に配されるソ
ルダーペースト１５の厚さｔ1 は銅粒子１の直径よりも
大きかった。すなわち、上記実験例１〜３においては、
ソルダーペースト１５の厚さｔ1 が銅粒子１の直径以上
の厚さとして規制されており、ソルダーペースト１５の
量と該ソルダーペースト１５中のはんだの量も規制され
ていることが確認された。Then, the thicknesses of the solder pastes arranged between the electrodes of the resistance component and the facing surfaces of the lands were compared. As a result, in Experimental Examples 1 to 3, as schematically shown in FIG. 2, the solder paste disposed between the facing surface 12a of the electrode 12 of the resistance component 11 and the facing surface 14a of the land portion 14 on the insulating substrate 13. The thickness t 1 of 15 was larger than the diameter of the copper particles 1. That is, in Experimental Examples 1 to 3,
It was confirmed that the thickness t 1 of the solder paste 15 is regulated as a thickness equal to or larger than the diameter of the copper particles 1, and the amount of the solder paste 15 and the amount of solder in the solder paste 15 are also regulated.
【００２６】一方、比較実験例においては、図３に模式
的に示すように抵抗部品２１の電極２２の対向面２２ａ
と絶縁基板２３上のランド部２４の対向面２４ａ間に配
されるソルダーペースト２５の厚さｔ2 は厚さｔ1 より
も薄かった。すなわち、上記比較実験例においては、ソ
ルダーペースト２５の厚さｔ2 が規制されていないこと
が確認された。On the other hand, in the comparative experiment example, as shown schematically in FIG. 3, the facing surface 22a of the electrode 22 of the resistance component 21 is shown.
The thickness t 2 of the solder paste 25 arranged between the facing surfaces 24a of the lands 24 on the insulating substrate 23 was smaller than the thickness t 1 . That is, in the above comparative experiment example, it was confirmed that the thickness t 2 of the solder paste 25 was not regulated.
【００２７】また、実験例３の断面を拡大して観察した
ところ、図４に示すように、ソルダーペースト１５中の
銅粒子１のうちの幾つかがランド部１４にのめり込む形
で確認された。Further, when the cross section of Experimental Example 3 was enlarged and observed, as shown in FIG. 4, some of the copper particles 1 in the solder paste 15 were confirmed to be embedded in the land portion 14.
【００２８】従って、実験例１〜３のように、はんだ粉
末とフラックスと導電性粒子である銅粒子が混合分散さ
れてなり、上記銅粒子の粒径が０．１ｍｍ〜０．３ｍｍ
の範囲内で、銅粒子の含有量が、フラックスとはんだ粉
末の混合物１００重量部に対して、１重量部〜５重量部
であるソルダーペーストを用いてはんだ付けを行えば、
ソルダーペースト中の銅粒子が電極とランド部間の間隙
を積極的に形成し、接合部分のソルダーペーストの厚み
を規制してソルダーペーストの量と該ソルダーペースト
中のはんだ粉末の量を規制するため、はんだ付け強度が
向上される。Therefore, as in Experimental Examples 1 to 3, the solder powder, the flux, and the copper particles as the conductive particles are mixed and dispersed, and the particle diameter of the copper particles is 0.1 mm to 0.3 mm.
Within the range, if the content of the copper particles is 1 part by weight to 5 parts by weight with respect to 100 parts by weight of the mixture of the flux and the solder powder, soldering is performed,
The copper particles in the solder paste positively form the gap between the electrode and the land portion, and regulate the thickness of the solder paste at the joint portion to regulate the amount of solder paste and the amount of solder powder in the solder paste. , The soldering strength is improved.
【００２９】なお、このように接合部分のソルダーペー
ストの厚みの規制が行われれば、はんだ付け強度のばら
つきも生じ難くなり、製造歩留りが向上する。If the thickness of the solder paste at the joint is regulated in this way, variations in soldering strength are less likely to occur, and the manufacturing yield is improved.
【００３０】[0030]
【発明の効果】以上の説明からも明らかなように、本発
明のソルダーペーストは、フラックスとはんだ粉末と導
電性粒子が混合分散されてなるため、上記ソルダーペー
ストを電子部品の電極とランド部間に配し、この状態で
リフローさせた場合、上記導電性粒子が電極とランド部
間の間隙を積極的に形成し、接合部分のソルダーペース
トの厚みを規制してソルダーペーストの量と該ソルダー
ペースト中のはんだ粉末の量を規制し、そのはんだ付け
強度が向上される。As is apparent from the above description, since the solder paste of the present invention is a mixture of the flux, the solder powder and the conductive particles, the solder paste is used between the electrode and the land portion of the electronic component. When the conductive particles are reflowed in this state, the conductive particles positively form a gap between the electrode and the land portion and regulate the thickness of the solder paste at the joint portion to control the amount of the solder paste and the solder paste. The amount of solder powder contained therein is regulated, and the soldering strength thereof is improved.
【００３１】また、上記導電性粒子を金属とすれば、原
料の入手も容易で製造も容易である。If the conductive particles are made of metal, the raw materials are easily available and the production is easy.
【００３２】さらに、上記導電性粒子の粒径を０．１ｍ
ｍ〜０．３ｍｍとすれば、上記電極とランド部間に好適
な大きさの間隙が形成され、はんだ付け強度がさらに向
上される。Further, the particle size of the conductive particles is 0.1 m.
If it is m to 0.3 mm, a gap having a suitable size is formed between the electrode and the land portion, and the soldering strength is further improved.
【００３３】さらにまた、上記導電性粒子の含有量を、
フラックスとはんだ粉末の混合物１００重量部に対し
て、１重量部〜５重量部とすれば、上記電極とランド部
間に好適な大きさの間隙が形成されるとともに、上記間
隙中に十分な量のはんだ粉末が配され、はんだ付け強度
がさらに向上される。Furthermore, the content of the conductive particles is
When 1 part by weight to 5 parts by weight is used with respect to 100 parts by weight of the mixture of the flux and the solder powder, a gap of a suitable size is formed between the electrode and the land portion, and a sufficient amount is present in the gap. Solder powder is distributed to further improve the soldering strength.
【図１】銅粒子と共晶はんだ粉末の様子を示す模式図で
ある。FIG. 1 is a schematic view showing a state of copper particles and eutectic solder powder.
【図２】本発明を適用したソルダーペーストを用いては
んだ付けした場合の電極とランド部の対向部分を拡大し
て示す模式図である。FIG. 2 is an enlarged schematic view showing a facing portion of an electrode and a land portion when soldering is performed using a solder paste to which the present invention is applied.
【図３】従来のソルダーペーストを用いてはんだ付けし
た場合の電極とランド部の対向部分を拡大して示す模式
図である。FIG. 3 is an enlarged schematic view showing a facing portion of an electrode and a land portion when soldering is performed using a conventional solder paste.
【図４】本発明を適用したソルダーペーストを用いては
んだ付けした場合のソルダーペーストとランド部を拡大
して示す模式図である。FIG. 4 is a schematic view showing an enlarged solder paste and land when soldering is performed using the solder paste to which the present invention is applied.
１ 銅粒子 ２ 共晶はんだ粉末 1 Copper particles 2 Eutectic solder powder
Claims (4)
混合分散されてなることを特徴とするソルダーペース
ト。1. A solder paste comprising a flux, a solder powder, and conductive particles mixed and dispersed.
る請求項１記載のソルダーペースト。2. The solder paste according to claim 1, wherein the conductive particles are metal.
ｍｍであることを特徴とする請求項１記載のソルダーペ
ースト。3. The particle size of the conductive particles is 0.1 mm to 0.3.
The solder paste according to claim 1, which has a size of mm.
んだ粉末の混合物１００重量部に対して、１重量部〜５
重量部であることを特徴とする請求項１又は３記載のソ
ルダーペースト。4. The content of the conductive particles is 1 part by weight to 5 parts by weight with respect to 100 parts by weight of the mixture of the flux and the solder powder.
It is a weight part, The solder paste of Claim 1 or 3 characterized by the above-mentioned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6287777A JPH08141780A (en) | 1994-11-22 | 1994-11-22 | Solder paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6287777A JPH08141780A (en) | 1994-11-22 | 1994-11-22 | Solder paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08141780A true JPH08141780A (en) | 1996-06-04 |
Family
ID=17721620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6287777A Withdrawn JPH08141780A (en) | 1994-11-22 | 1994-11-22 | Solder paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08141780A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006075459A1 (en) * | 2005-01-11 | 2006-07-20 | Murata Manufacturing Co., Ltd | Solder paste and electronic device |
| KR100724031B1 (en) * | 2000-06-12 | 2007-06-04 | 가부시키가이샤 히타치세이사쿠쇼 | Lead-free connecting material |
| WO2007125861A1 (en) * | 2006-04-26 | 2007-11-08 | Senju Metal Industry Co., Ltd. | Solder paste |
| JP2008161881A (en) * | 2006-12-27 | 2008-07-17 | Matsushita Electric Ind Co Ltd | Joining material and module structure |
| JP2008168330A (en) * | 2007-01-15 | 2008-07-24 | Matsushita Electric Ind Co Ltd | Bonding material and electronic device using the same |
-
1994
- 1994-11-22 JP JP6287777A patent/JPH08141780A/en not_active Withdrawn
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100724031B1 (en) * | 2000-06-12 | 2007-06-04 | 가부시키가이샤 히타치세이사쿠쇼 | Lead-free connecting material |
| KR100867871B1 (en) * | 2005-01-11 | 2008-11-07 | 가부시키가이샤 무라타 세이사쿠쇼 | Solder paste and electronic device |
| JPWO2006075459A1 (en) * | 2005-01-11 | 2008-06-12 | 株式会社村田製作所 | Solder paste and electronic device |
| WO2006075459A1 (en) * | 2005-01-11 | 2006-07-20 | Murata Manufacturing Co., Ltd | Solder paste and electronic device |
| JP4753090B2 (en) * | 2005-01-11 | 2011-08-17 | 株式会社村田製作所 | Solder paste and electronic device |
| US8920580B2 (en) | 2005-01-11 | 2014-12-30 | Murata Manufacturing Co., Ltd. | Solder paste and electronic device |
| WO2007125861A1 (en) * | 2006-04-26 | 2007-11-08 | Senju Metal Industry Co., Ltd. | Solder paste |
| JPWO2007125861A1 (en) * | 2006-04-26 | 2009-09-10 | 千住金属工業株式会社 | Solder paste |
| JP4826630B2 (en) * | 2006-04-26 | 2011-11-30 | 千住金属工業株式会社 | Solder paste |
| US8388724B2 (en) | 2006-04-26 | 2013-03-05 | Senju Metal Industry Co., Ltd. | Solder paste |
| JP2008161881A (en) * | 2006-12-27 | 2008-07-17 | Matsushita Electric Ind Co Ltd | Joining material and module structure |
| JP4692479B2 (en) * | 2006-12-27 | 2011-06-01 | パナソニック株式会社 | Bonding materials and modular structures |
| JP2008168330A (en) * | 2007-01-15 | 2008-07-24 | Matsushita Electric Ind Co Ltd | Bonding material and electronic device using the same |
| JP4692491B2 (en) * | 2007-01-15 | 2011-06-01 | パナソニック株式会社 | Bonding material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20020205 |