JPS6122685A - Conductive paste - Google Patents
Conductive pasteInfo
- Publication number
- JPS6122685A JPS6122685A JP13861484A JP13861484A JPS6122685A JP S6122685 A JPS6122685 A JP S6122685A JP 13861484 A JP13861484 A JP 13861484A JP 13861484 A JP13861484 A JP 13861484A JP S6122685 A JPS6122685 A JP S6122685A
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- adhesion
- powder
- ceramic substrate
- binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は導電性ペーストの改良に関する。特に、導電性
ペーストがプリント配線用絶縁性基板等のセラミック基
板上に塗布され焼成されて導電体層に転換された後、こ
の転換された導電体層と上記のセラミック基板との密着
性が良好であるようになす改良に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to improvements in conductive pastes. In particular, after a conductive paste is coated on a ceramic substrate such as an insulating substrate for printed wiring and converted into a conductive layer by firing, the adhesion between the converted conductive layer and the above-mentioned ceramic substrate is good. Relates to improvements made so that
導電性ペーストは、プリント配線形成用等に使用される
材料であり、銅粉等の導電体粉と、ガラス粉等の無機質
バインダと、アクリル樹脂等の有機質バインダと、躾ま
しくは二酸化ビスマス等の密着性強化剤と、メチルエチ
ルケトン等の溶媒との混合物よりなる。使用にあたって
は、プリント配線用絶縁性基板等の配線形成領域上にス
クリーン印刷法等を使用して選択的に塗布した後焼成し
て、有機質バインダは分解気化させ、一方、無機質バイ
ンダは溶融の後基板との界面に固化させてバインダとし
ての機能を発揮させる。このとき、密着性強化剤の効果
も加わりバインダとしての機能がすぐれたものになる。Conductive paste is a material used for forming printed wiring, etc., and includes conductive powder such as copper powder, inorganic binder such as glass powder, organic binder such as acrylic resin, and bismuth dioxide, etc. and a solvent such as methyl ethyl ketone. In use, the organic binder is selectively coated onto the wiring formation area of an insulating substrate for printed wiring using a screen printing method, etc., and then baked. The organic binder is decomposed and vaporized, while the inorganic binder is melted and then applied. It solidifies at the interface with the substrate and functions as a binder. At this time, the effect of the adhesion enhancer is also added, and the function as a binder becomes excellent.
スクリーン印刷法等極めて簡易な手法をもって配線形成
が可能であるので、プリント配線形成用等に広く使用さ
れている。Since wiring can be formed using extremely simple methods such as screen printing, it is widely used for forming printed wiring.
たゾ、導電性ペーストから転換形成された導電体層と基
板との密着性は必ずしもすぐれているとは云い難く、導
電体層が剥離するおそれがあり、信頼性に欠けるという
欠点があった。さらに、導電体層はプリント配線等とし
て利用されるのであるから、電気抵抗が小さく、半田と
なじみがよくいわゆる半田濡れ性が良好であることは当
然に必須であり、基板との密着性が良好で半田濡れ性が
良好でしかも電気抵抗の小さい導電体層に転換されうる
導電性ペーストの開発が望まれていた。However, the adhesion between the conductive layer formed from the conductive paste and the substrate is not necessarily excellent, and there is a risk that the conductive layer may peel off, resulting in a lack of reliability. Furthermore, since the conductive layer is used for printed wiring, etc., it is naturally essential that it has low electrical resistance, is compatible with solder, and has good solder wettability, and has good adhesion to the board. Therefore, it has been desired to develop a conductive paste that can be converted into a conductive layer with good solder wettability and low electrical resistance.
本発明は、上記の要請に応え、導電性ペーストが焼成さ
れて導電体層に転換されたとき、その導電体層と基板と
の密着性が良好であり、その導電体層の半田濡れ性が良
好である導電性ペーストを提供することにあり、その手
段は、セラミック基板」―に塗布された後焼成されて導
電体に転換される導電性ペーストにおいて、前記セラミ
ック基板と同一組成の粉状体を含有してなることを特徴
とする導電性ペーストによってなされる。In response to the above-mentioned needs, the present invention provides that when a conductive paste is fired and converted into a conductive layer, the adhesion between the conductive layer and the substrate is good, and the solder wettability of the conductive layer is improved. The purpose of the present invention is to provide a conductive paste that has good conductivity, and the means for this purpose is to provide a conductive paste that is applied to a ceramic substrate and then fired to convert it into a conductor, in which a powder having the same composition as the ceramic substrate is used. It is made using a conductive paste characterized by containing.
本発明に係る導電性ペーストは、その導電性ペーストが
アプライされるセラミック基板と同一の組成の粉状体を
含有しているので、その導電性ペーストが焼成されると
、この粉状体が無機質バインダとともに溶融してセラミ
ック基板との間に移動してここで固化してバインダとし
て機能するが、このセラミック基板の材料と極めて近似
した組成のバインダはセラミック基板ともまた導電体層
とも極めてなじみやすく、導電体層とセラミック基板ど
を強固に密着することになる。しかも。The conductive paste according to the present invention contains powder having the same composition as the ceramic substrate to which the conductive paste is applied, so when the conductive paste is fired, the powder becomes inorganic. It melts together with the binder and moves between it and the ceramic substrate, where it solidifies and functions as a binder, but the binder, which has a composition very similar to the material of the ceramic substrate, is extremely compatible with both the ceramic substrate and the conductor layer. The conductor layer and the ceramic substrate are firmly adhered to each other. Moreover.
導電体層の半田濡れ性も良好であることが実験的に認め
られており、極めてすぐれた導電性ペーストとして機能
することが確認されている。It has been experimentally confirmed that the conductive layer has good solder wettability, and it has been confirmed that it functions as an extremely excellent conductive paste.
以下本発明の一実施例に係る導電性ペーストについてさ
らに詳細に説明する。The conductive paste according to one embodiment of the present invention will be described in more detail below.
粒子径が４＃ＬＬ１程度である球形銅粉末１００ ｇと
、粒子径が４ｇｔａ程度であるガラス粉末（コーニング
社製第７７４０号）２ｇと、粒子径が４ＩＬ１１程度で
あるアルミナ粉末（アルコア社製第Ａ −１４号）２ｇ
と粒子径が８ＩＬ１１程度であり密着性強化剤として機
能する二酸化ビスマス粉末５ｇと、有機質バインダとし
て機能するアクリル樹脂粉１０ｇと溶媒として機能する
メチルエチルケトン １００ｇとを、ボールミルを使用
して４８時間程度十分に混合した後、さらに、テルピオ
ール３０ｇを加えた後らいかい機を使用して２時間混練
して゛溶媒を完全（こ気化させて銅ペーストを製作した
。100 g of spherical copper powder with a particle size of about 4#LL1, 2 g of glass powder (No. 7740 manufactured by Corning Inc.) with a particle size of about 4 gta, and alumina powder (No. 7740 manufactured by Alcoa Inc.) with a particle size of about 4IL11. A-14) 2g
Using a ball mill, 5 g of bismuth dioxide powder having a particle size of about 8IL11 and functioning as an adhesion enhancer, 10 g of acrylic resin powder functioning as an organic binder, and 100 g of methyl ethyl ketone functioning as a solvent were mixed for about 48 hours using a ball mill. After mixing, 30 g of terpiol was added and kneaded for 2 hours using a shaker to completely vaporize the solvent and prepare a copper paste.
ガラス（コーニング社製第７７４０号）５０部とアルミ
ナ（アルコア社製第Ａ−１４号）５０部とよりなるガラ
ス−セラミック基板上に、スクリーン印刷法を使用して
、線幅１００ＩＬ１１程度の画像を描画し、乾燥後、
９８０°Ｃ程度の窒素雰囲気中において１０分間焼成し
て、銅よりなる配線を形成した。An image with a line width of about 100 IL11 was printed on a glass-ceramic substrate made of 50 parts of glass (No. 7740 manufactured by Corning Corporation) and 50 parts of alumina (No. A-14 manufactured by Alcoa Corporation) using a screen printing method. After drawing and drying,
It was fired for 10 minutes in a nitrogen atmosphere at about 980° C. to form copper wiring.
その銅配線とガラス−セラミック板との密着強度と半田
濡れ性とを試験せるところ、密着強度は０．４Ｋｇ／ａ
ｍ２であり従来技術における平均的な値（０，２５Ｋｇ
／ｍ履２）より大幅に改良されており、一方、半田濡れ
性は従来技術における場合と同程度であり、配線用とし
て十分使用可能であった。When testing the adhesion strength and solder wettability between the copper wiring and the glass-ceramic board, the adhesion strength was 0.4 kg/a.
m2, which is the average value in the conventional technology (0.25Kg
/m2), while the solder wettability was on the same level as in the prior art and could be used satisfactorily for wiring.
なお、本発明の完成に至る経過に附言すると、まず、密
着性向上の目的をもって、無機質バインダ（一般にはガ
ラス）の分量を種々に代えて実験を繰り返した結果、ガ
ラスの分量を増加すると密着性は向上するが、ある程度
以上ガラスを添加すると半田濡れ性が低下する傾向のあ
ることが認められた。そこで、半田濡れ性を低下させず
に密着性を向上するために、ガラスに代えてアルミナ等
無機質材料を増量したところ、半田濡れ性は低下せずに
密着性は向上する場合のあることが認められ、その条件
を整理した結果、Ｓ機質バインダとして、基板を構成す
るセラミック材と同一の材料を使用すると上記の目的（
半田濡れ性を阻害せずに密着性を向上すること）が達成
されることが明らかになったものである。To add to the progress that led to the completion of the present invention, first, with the aim of improving adhesion, we repeated experiments with various amounts of inorganic binder (generally glass). Although the solderability improved, it was found that adding more than a certain amount of glass tended to reduce the solder wettability. Therefore, in order to improve adhesion without reducing solder wettability, we increased the amount of inorganic material such as alumina instead of glass, and it was found that adhesion may improve without reducing solder wettability. As a result of arranging the conditions, it was found that using the same material as the ceramic material constituting the substrate as the S-organic binder can achieve the above purpose (
It has been revealed that the improvement of adhesion without inhibiting solder wettability can be achieved.
さらに、基板を構成するセラミック材と同一の材料より
なる一種の無機質バインダの量と導電材に転換される銅
粉末の量との比についての最適条件はセラミック材の種
類により変動することが実験的に確認されており一般的
に特定することは困難である。Furthermore, it has been experimentally shown that the optimal conditions for the ratio of the amount of an inorganic binder made of the same material as the ceramic material constituting the substrate and the amount of copper powder converted into a conductive material vary depending on the type of ceramic material. It has been confirmed in many cases that it is difficult to identify in general.
また、密着性強化剤は、三酸化ビスマスの他、酸化カド
ミウム、酸化銅、酸化ニッケル、酸化鉛等も使用しうる
が、従来技術において知られている以りの特筆すべき特
徴は認めない。In addition to bismuth trioxide, cadmium oxide, copper oxide, nickel oxide, lead oxide, etc. may also be used as adhesion enhancers, but these do not have any noteworthy characteristics beyond those known in the prior art.
Claims (1)
換される導電性ペーストにおいて、前記セラミック基板
と同一組成の粉状体を含有してなることを特徴とする導
電性ペースト。1. A conductive paste that is coated on a ceramic substrate and then fired to be converted into a conductor, the paste comprising a powder having the same composition as the ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13861484A JPS6122685A (en) | 1984-07-04 | 1984-07-04 | Conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13861484A JPS6122685A (en) | 1984-07-04 | 1984-07-04 | Conductive paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6122685A true JPS6122685A (en) | 1986-01-31 |
| JPH0420280B2 JPH0420280B2 (en) | 1992-04-02 |
Family
ID=15226198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13861484A Granted JPS6122685A (en) | 1984-07-04 | 1984-07-04 | Conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6122685A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003023233A (en) * | 2001-07-05 | 2003-01-24 | Sumitomo Metal Electronics Devices Inc | Low temperature fired ceramic circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5484270A (en) * | 1977-12-16 | 1979-07-05 | Fujitsu Ltd | Method of making ceramic multiilayer circuit base board |
| JPS5868918A (en) * | 1981-10-20 | 1983-04-25 | 三菱鉱業セメント株式会社 | Electronic part with electrode layer and method of producing same |
-
1984
- 1984-07-04 JP JP13861484A patent/JPS6122685A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5484270A (en) * | 1977-12-16 | 1979-07-05 | Fujitsu Ltd | Method of making ceramic multiilayer circuit base board |
| JPS5868918A (en) * | 1981-10-20 | 1983-04-25 | 三菱鉱業セメント株式会社 | Electronic part with electrode layer and method of producing same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003023233A (en) * | 2001-07-05 | 2003-01-24 | Sumitomo Metal Electronics Devices Inc | Low temperature fired ceramic circuit board |
| JP4711158B2 (en) * | 2001-07-05 | 2011-06-29 | 株式会社村田製作所 | Low temperature fired ceramic circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0420280B2 (en) | 1992-04-02 |
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