JPS58191645U - Semiconductor device package - Google Patents
Semiconductor device packageInfo
- Publication number
- JPS58191645U JPS58191645U JP9059682U JP9059682U JPS58191645U JP S58191645 U JPS58191645 U JP S58191645U JP 9059682 U JP9059682 U JP 9059682U JP 9059682 U JP9059682 U JP 9059682U JP S58191645 U JPS58191645 U JP S58191645U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- device package
- lid
- adhesive
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のふたの接着剤のあり付は状態を示す斜視
図、第２図はふた付けされたパッケージ本体の断面図、
第３図は本考案のふたの接着剤ののり付は状態を示す斜
視図、第４図は従来のふた付けをしそのふたをはずした
状態で接着部に空洞のできた状態を示す平面図である。
図において、１・・・ふた本体、２・・・接着剤、３・
・・パッケージ本体、４・・・半導体素子、５・・・金
属細線、６・・・パッケージリードであ名。図中、同一
符号は同一、又は相当部分を示す。Figure 1 is a perspective view showing the state of the conventional lid with adhesive, Figure 2 is a sectional view of the package body with the lid attached,
Fig. 3 is a perspective view showing how the adhesive of the present invention is applied to the lid, and Fig. 4 is a plan view showing the state in which the conventional lid is attached and the lid is removed, with a cavity formed in the adhesive part. be. In the figure, 1... Lid body, 2... Adhesive, 3...
...Package body, 4...Semiconductor element, 5...Metal thin wire, 6...Package lead. In the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
れる接着剤をふた全周の少なくとも一部のみを切り離す
か、薄く塗布されている事を特徴とする半導体装置のパ
ッケージ。1. A semiconductor device package in which a semiconductor device is mounted, characterized in that an adhesive attached to the lid is removed or thinly applied to at least a portion of the entire circumference of the lid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9059682U JPS58191645U (en) | 1982-06-15 | 1982-06-15 | Semiconductor device package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9059682U JPS58191645U (en) | 1982-06-15 | 1982-06-15 | Semiconductor device package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58191645U true JPS58191645U (en) | 1983-12-20 |
Family
ID=30099087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9059682U Pending JPS58191645U (en) | 1982-06-15 | 1982-06-15 | Semiconductor device package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58191645U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6316454U (en) * | 1986-01-14 | 1988-02-03 | ||
| JPS63224345A (en) * | 1987-03-13 | 1988-09-19 | Nec Corp | Manufacture of semiconductor device |
-
1982
- 1982-06-15 JP JP9059682U patent/JPS58191645U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6316454U (en) * | 1986-01-14 | 1988-02-03 | ||
| JPS63224345A (en) * | 1987-03-13 | 1988-09-19 | Nec Corp | Manufacture of semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS596839U (en) | semiconductor equipment | |
| JPS58191645U (en) | Semiconductor device package | |
| JPS60139750U (en) | blister packaging | |
| JPS60121650U (en) | Chippukiyariya | |
| JPS614430U (en) | semiconductor equipment | |
| JPS59164241U (en) | Ceramic package | |
| JPS59159565U (en) | Mounting structure between cushioning material and packaging box | |
| JPS6068654U (en) | semiconductor equipment | |
| JPS5835040U (en) | gear device | |
| JPH03101524U (en) | ||
| JPS60153543U (en) | Lead frame for semiconductor devices | |
| JPS5895051U (en) | Ceramic package type semiconductor device | |
| JPS5887353U (en) | Semiconductor package lid | |
| JPS6122342U (en) | semiconductor equipment | |
| JPS59109149U (en) | Package for semiconductors | |
| JPS60101756U (en) | Lead frame for semiconductor devices | |
| JPS58147250U (en) | package | |
| JPS58111929U (en) | Film-clad capacitor | |
| JPS5834740U (en) | semiconductor equipment | |
| JPS6015490U (en) | solder paste packaging | |
| JPS6142852U (en) | Resin-encapsulated semiconductor device | |
| JPS5857702U (en) | tape measure | |
| JPS605582U (en) | Electronic equipment with printer | |
| JPS60125738U (en) | Hybrid integrated circuit device | |
| JPS6140618U (en) | sensor mounting device |