JPS58147250U - package - Google Patents

package

Info

Publication number
JPS58147250U
JPS58147250U JP4418782U JP4418782U JPS58147250U JP S58147250 U JPS58147250 U JP S58147250U JP 4418782 U JP4418782 U JP 4418782U JP 4418782 U JP4418782 U JP 4418782U JP S58147250 U JPS58147250 U JP S58147250U
Authority
JP
Japan
Prior art keywords
package
bonded
abstract
ceramic substrate
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4418782U
Other languages
Japanese (ja)
Other versions
JPS6236288Y2 (en
Inventor
才田　敏和
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP4418782U priority Critical patent/JPS58147250U/en
Publication of JPS58147250U publication Critical patent/JPS58147250U/en
Application granted granted Critical
Publication of JPS6236288Y2 publication Critical patent/JPS6236288Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Packaging Frangible Articles (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のパッケージ構造を示す断面図、第２図は
この考案の一実施例を示すパッケージの断面図である。 図において、１はパッケージ本体、１１はその接着部、
２は蓋、３はセラミック基板、４はスペーサである。な
お、図中同一符号は同一または相当部分を示す。FIG. 1 is a sectional view showing a conventional package structure, and FIG. 2 is a sectional view of a package showing an embodiment of this invention. In the figure, 1 is the package body, 11 is its adhesive part,
2 is a lid, 3 is a ceramic substrate, and 4 is a spacer. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プラスチックにて構成されたパッケージ本体に、セラミ
ック基板を接着するよりしたものにおいて、セラミック
基板接着側の非接着部分にスペーサを介在させるように
したことを特長とするパッケージ。A package in which a ceramic substrate is bonded to a package body made of plastic, characterized in that a spacer is interposed in the non-bonded part on the side where the ceramic substrate is bonded.
JP4418782U 1982-03-26 1982-03-26 package Granted JPS58147250U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4418782U JPS58147250U (en) 1982-03-26 1982-03-26 package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4418782U JPS58147250U (en) 1982-03-26 1982-03-26 package

Publications (2)

Publication Number Publication Date
JPS58147250U true JPS58147250U (en) 1983-10-03
JPS6236288Y2 JPS6236288Y2 (en) 1987-09-16

Family

ID=30055253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4418782U Granted JPS58147250U (en) 1982-03-26 1982-03-26 package

Country Status (1)

Country Link
JP (1) JPS58147250U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03110874U (en) * 1990-02-28 1991-11-13

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365968A (en) * 1976-11-26 1978-06-12 Hitachi Ltd Method of clamping case for film hyb ic

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365968A (en) * 1976-11-26 1978-06-12 Hitachi Ltd Method of clamping case for film hyb ic

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03110874U (en) * 1990-02-28 1991-11-13

Also Published As

Publication number Publication date
JPS6236288Y2 (en) 1987-09-16

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