JPS6122342U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS6122342U JPS6122342U JP1984106293U JP10629384U JPS6122342U JP S6122342 U JPS6122342 U JP S6122342U JP 1984106293 U JP1984106293 U JP 1984106293U JP 10629384 U JP10629384 U JP 10629384U JP S6122342 U JPS6122342 U JP S6122342U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- chip
- semiconductor
- chip mounting
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【図面の簡単な説明】
第１図とリードフレームに半導体チップが実装された状
態を示す断面図、第２図ａ， ｂは、本考案の一実施例
に用いるリードフレーム平面図と断面図である。
１・・・・・・リードフレーム本体、１１・・・・・・
外部引出し用のリード、１２・・・・・・チップ搭載部
、１３・・・・・・凹部、１４・・・・・・半導体チッ
プ、１５・・・・・・樹脂。[Brief Description of the Drawings] Figure 1 and a cross-sectional view showing a state in which a semiconductor chip is mounted on a lead frame, and Figures 2 a and b are a plan view and a cross-sectional view of a lead frame used in an embodiment of the present invention. be. 1... Lead frame body, 11...
Lead for external drawer, 12... Chip mounting portion, 13... Recessed portion, 14... Semiconductor chip, 15... Resin.
Claims (1)
固着され、少なくともこの半導体チップおよび前記チッ
プ搭載部に樹脂封止が施こされた半導体装置において、
前記チップ搭載部の一表面に凹部を有し、その凹部内に
前記半導体チップが固着されていることを特徴とする半
導体装置。A semiconductor device in which a semiconductor chip is fixed to a chip mounting part through a part of a lead frame, and at least the semiconductor chip and the chip mounting part are sealed with resin,
A semiconductor device, wherein the chip mounting portion has a recessed portion on one surface, and the semiconductor chip is fixed within the recessed portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984106293U JPS6122342U (en) | 1984-07-12 | 1984-07-12 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984106293U JPS6122342U (en) | 1984-07-12 | 1984-07-12 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6122342U true JPS6122342U (en) | 1986-02-08 |
Family
ID=30665586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984106293U Pending JPS6122342U (en) | 1984-07-12 | 1984-07-12 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6122342U (en) |
-
1984
- 1984-07-12 JP JP1984106293U patent/JPS6122342U/en active Pending
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