JPH03101524U - - Google Patents
Info
- Publication number
- JPH03101524U JPH03101524U JP1990009192U JP919290U JPH03101524U JP H03101524 U JPH03101524 U JP H03101524U JP 1990009192 U JP1990009192 U JP 1990009192U JP 919290 U JP919290 U JP 919290U JP H03101524 U JPH03101524 U JP H03101524U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- thin
- view
- semiconductor device
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はこの考案に係る半導体装置の一実施例
を示す表面実装型ミニフラツトパツケージの斜視
図、第２図は第１図の断面図、第３図は従来の表
面実装型ミニフラツトパツケージの斜視図、第４
図は第３図の断面図である。
１……半導体素子、２……ダイパツド部、４…
…リード、５……金属細線、６……封止樹脂、１
１……半導体素子の薄い部分。なお、図中、同一
符号は同一、または相当部分を示す。
Fig. 1 is a perspective view of a surface mount type mini-flat package showing an embodiment of the semiconductor device according to this invention, Fig. 2 is a sectional view of Fig. 1, and Fig. 3 is a conventional surface mount type mini-flat package. Perspective view of package, 4th
The figure is a sectional view of FIG. 3. 1... Semiconductor element, 2... Die pad portion, 4...
...Lead, 5...Metal thin wire, 6...Sealing resin, 1
1...Thin part of a semiconductor element. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
いて、前記半導体素子の周辺部を他の部分より薄
くし、かつ、この薄い部分に電極を形成したこと
を特徴とする半導体装置。 1. A thin semiconductor device in which a semiconductor element is sealed with resin, characterized in that a peripheral part of the semiconductor element is made thinner than other parts, and an electrode is formed in this thin part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990009192U JPH03101524U (en) | 1990-02-01 | 1990-02-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990009192U JPH03101524U (en) | 1990-02-01 | 1990-02-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101524U true JPH03101524U (en) | 1991-10-23 |
Family
ID=31512796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990009192U Pending JPH03101524U (en) | 1990-02-01 | 1990-02-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101524U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102758399A (en) * | 2012-07-19 | 2012-10-31 | 西安建筑科技大学 | Attached opening-closing protective cover of urban bridge |
-
1990
- 1990-02-01 JP JP1990009192U patent/JPH03101524U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102758399A (en) * | 2012-07-19 | 2012-10-31 | 西安建筑科技大学 | Attached opening-closing protective cover of urban bridge |