JPS625644U - - Google Patents
Info
- Publication number
- JPS625644U JPS625644U JP9716385U JP9716385U JPS625644U JP S625644 U JPS625644 U JP S625644U JP 9716385 U JP9716385 U JP 9716385U JP 9716385 U JP9716385 U JP 9716385U JP S625644 U JPS625644 U JP S625644U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- element mounting
- sealed
- mounting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例を示す樹脂封止型半導
体装置の縦断面図、第２図は従来の樹脂封止型半
導体装置の縦断面図、第３図は第１図の一部切欠
き平面図である。
２１……リードフレーム、２１ａ……素子搭載
部、２１ｂ……外部リード、２１ｃ……開口部、
２１ｄ……突起部、２２……半導体素子、２３…
…ボンデイングワイヤ、２４……樹脂。
FIG. 1 is a longitudinal sectional view of a resin-encapsulated semiconductor device showing an embodiment of the present invention, FIG. 2 is a longitudinal sectional view of a conventional resin-encapsulated semiconductor device, and FIG. 3 is a partial cutaway of FIG. 1. FIG. 21...Lead frame, 21a...Element mounting part, 21b...External lead, 21c...Opening part,
21d...Protrusion, 22...Semiconductor element, 23...
...Bonding wire, 24...Resin.
Claims (1)
載されて樹脂封止された樹脂封止型半導体装置に
おいて、 前記素子搭載部に、封止用樹脂が充填される開
口部を形成すると共に、該素子搭載部の反対面に
突起部を形成したことを特徴とする樹脂封止型半
導体装置。[Claims for Utility Model Registration] In a resin-sealed semiconductor device in which a semiconductor element is mounted on an element mounting part of a lead frame and sealed with resin, an opening in which the element mounting part is filled with a sealing resin. What is claimed is: 1. A resin-sealed semiconductor device comprising: a resin-sealed semiconductor device; and a protrusion formed on a surface opposite to the element mounting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9716385U JPS625644U (en) | 1985-06-26 | 1985-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9716385U JPS625644U (en) | 1985-06-26 | 1985-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS625644U true JPS625644U (en) | 1987-01-14 |
Family
ID=30963823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9716385U Pending JPS625644U (en) | 1985-06-26 | 1985-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS625644U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03269260A (en) * | 1990-03-19 | 1991-11-29 | Horiba Ltd | Analyzer with recorder |
-
1985
- 1985-06-26 JP JP9716385U patent/JPS625644U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03269260A (en) * | 1990-03-19 | 1991-11-29 | Horiba Ltd | Analyzer with recorder |