JPH01140843U - - Google Patents
Info
- Publication number
- JPH01140843U JPH01140843U JP3648088U JP3648088U JPH01140843U JP H01140843 U JPH01140843 U JP H01140843U JP 3648088 U JP3648088 U JP 3648088U JP 3648088 U JP3648088 U JP 3648088U JP H01140843 U JPH01140843 U JP H01140843U
- Authority
- JP
- Japan
- Prior art keywords
- stem
- resin
- lead
- semiconductor element
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図および第２図はそれぞれ本考案の一実施
例および他の実施例の樹脂封止前の斜視図、第３
図は従来の樹脂封止半導体装置の樹脂封止前の斜
視図である。
１……ステム、１ａ……ステムリード、２，３
，４……外部リード、２ａ，３ａ……ボンデング
部、２ｂ，３ｂ……曲がり部、５……半導体素子
、６……ボンデング線。
FIG. 1 and FIG. 2 are perspective views of one embodiment and another embodiment of the present invention before resin sealing, respectively, and FIG.
The figure is a perspective view of a conventional resin-sealed semiconductor device before resin-sealing. 1...Stem, 1a...Stem lead, 2,3
, 4... External lead, 2a, 3a... Bonding part, 2b, 3b... Bent part, 5... Semiconductor element, 6... Bonding line.
Claims (1)
一端から外方に伸びているステムリードをはさん
でその両側に配置されている外部リードとを有す
るリードフレームの前記ステムに半導体素子を搭
載し、この半導体素子の電極パツドと前記外部リ
ードのボンデング部との間をボンデング線で接続
し樹脂封止した樹脂封止半導体装置において、前
記リードフレームの外部リードのボンデング部の
ステムから離れている側の端部が曲げられている
ことを特徴とする樹脂封止半導体装置。 The semiconductor element is mounted on the stem of a lead frame, which has a stem on which the semiconductor element is mounted, and external leads arranged on both sides of the stem lead extending outward from one end of the stem. In a resin-sealed semiconductor device in which an electrode pad of a semiconductor element and a bonding part of the external lead are connected by a bonding wire and sealed with resin, the end of the bonding part of the external lead of the lead frame on the side away from the stem. A resin-sealed semiconductor device characterized in that a portion thereof is bent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3648088U JPH01140843U (en) | 1988-03-18 | 1988-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3648088U JPH01140843U (en) | 1988-03-18 | 1988-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140843U true JPH01140843U (en) | 1989-09-27 |
Family
ID=31263082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3648088U Pending JPH01140843U (en) | 1988-03-18 | 1988-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140843U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017039298A (en) * | 2015-08-21 | 2017-02-23 | 日立オートモティブシステムズ株式会社 | Resin molding |
-
1988
- 1988-03-18 JP JP3648088U patent/JPH01140843U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017039298A (en) * | 2015-08-21 | 2017-02-23 | 日立オートモティブシステムズ株式会社 | Resin molding |