JPS64341U - - Google Patents

Info

Publication number
JPS64341U
JPS64341U JP9412587U JP9412587U JPS64341U JP S64341 U JPS64341 U JP S64341U JP 9412587 U JP9412587 U JP 9412587U JP 9412587 U JP9412587 U JP 9412587U JP S64341 U JPS64341 U JP S64341U
Authority
JP
Japan
Prior art keywords
resin
sealed
island portion
semiconductor device
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9412587U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9412587U priority Critical patent/JPS64341U/ja
Publication of JPS64341U publication Critical patent/JPS64341U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の断面図、第2図は
その斜視図、第3図は第2の実施例の部分平面図
である。 1a……アイランド部、1b……リード部、2
……半導体素子、3……ボンデイングワイヤ、4
……樹脂、5a……アイランド部、5b……アイ
ランドの側壁。
FIG. 1 is a sectional view of one embodiment of the present invention, FIG. 2 is a perspective view thereof, and FIG. 3 is a partial plan view of the second embodiment. 1a...Island part, 1b...Lead part, 2
... Semiconductor element, 3 ... Bonding wire, 4
...Resin, 5a...Island part, 5b...Side wall of island.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を搭載するアイランド部と、一端が
アイランド部に近接し他端が樹脂封止されたパケ
ージの外部に飛び出したリード部を有する樹脂封
止型半導体装置において、前記アイランド部の半
導体素子との接着平面の周縁部に側壁を有するこ
とを特徴とする樹脂封止型半導体装置。
In a resin-sealed semiconductor device having an island portion on which a semiconductor element is mounted and a lead portion protruding from the package, one end of which is close to the island portion and the other end of which is resin-sealed, the connection between the island portion and the semiconductor element is A resin-sealed semiconductor device characterized by having a side wall at the periphery of an adhesive plane.
JP9412587U 1987-06-19 1987-06-19 Pending JPS64341U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9412587U JPS64341U (en) 1987-06-19 1987-06-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9412587U JPS64341U (en) 1987-06-19 1987-06-19

Publications (1)

Publication Number Publication Date
JPS64341U true JPS64341U (en) 1989-01-05

Family

ID=30957283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9412587U Pending JPS64341U (en) 1987-06-19 1987-06-19

Country Status (1)

Country Link
JP (1) JPS64341U (en)

Similar Documents

Publication Publication Date Title
JPH0258345U (en)
JPS64341U (en)
JPS6422046U (en)
JPH024258U (en)
JPH0467346U (en)
JPH0313754U (en)
JPH01140843U (en)
JPS63200355U (en)
JPS61151350U (en)
JPS63201345U (en)
JPH01120367U (en)
JPH0298649U (en)
JPH0252452U (en)
JPS6430854U (en)
JPH0256439U (en)
JPH01112053U (en)
JPH0474463U (en)
JPH01113356U (en)
JPH0245646U (en)
JPS63134548U (en)
JPS6172857U (en)
JPS6370160U (en)
JPH0356151U (en)
JPS6242247U (en)
JPH0265354U (en)