JPH0245646U - - Google Patents
Info
- Publication number
- JPH0245646U JPH0245646U JP12481188U JP12481188U JPH0245646U JP H0245646 U JPH0245646 U JP H0245646U JP 12481188 U JP12481188 U JP 12481188U JP 12481188 U JP12481188 U JP 12481188U JP H0245646 U JPH0245646 U JP H0245646U
- Authority
- JP
- Japan
- Prior art keywords
- bonding wire
- vicinity
- bonded
- resin
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
他の実施例の断面図である。
１……樹脂、２……ダイ、３……ボンデイング
ワイヤー、４……リードフレーム、５……樹脂と
ボンデイングワイヤー及びダイが密着しない空隙
、６……樹脂とダイが一部密着している部分。
FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is a sectional view of another embodiment. 1...Resin, 2...Die, 3...Bonding wire, 4...Lead frame, 5...Gap where resin and bonding wire and die do not come into close contact, 6...Part where resin and die are in close contact .
Claims (1)
ーとボンデイングワイヤーがリードフレームに接
着されている近傍とボンデイングワイヤーがダイ
に接着されている近傍が樹脂に密着しない空隙を
有する半導体装置。 A semiconductor device that has a bonding wire and a gap in the vicinity where the bonding wire is bonded to the lead frame and in the vicinity where the bonding wire is bonded to the die inside the resin package where the bonding wire does not adhere to the resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12481188U JPH0245646U (en) | 1988-09-22 | 1988-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12481188U JPH0245646U (en) | 1988-09-22 | 1988-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245646U true JPH0245646U (en) | 1990-03-29 |
Family
ID=31374866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12481188U Pending JPH0245646U (en) | 1988-09-22 | 1988-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245646U (en) |
-
1988
- 1988-09-22 JP JP12481188U patent/JPH0245646U/ja active Pending