JPH02739U - - Google Patents
Info
- Publication number
- JPH02739U JPH02739U JP1988078455U JP7845588U JPH02739U JP H02739 U JPH02739 U JP H02739U JP 1988078455 U JP1988078455 U JP 1988078455U JP 7845588 U JP7845588 U JP 7845588U JP H02739 U JPH02739 U JP H02739U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- heat
- brought
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はこの考案の一実施例によるＱＦＰ半導
体装置を示す外形図、第２図はこの考案の一実施
例によるＱＦＰ半導体装置を示す断面図、第３図
は従来のＱＦＰ半導体装置を示す外形図、第４図
は従来のＱＦＰ半導体装置を示す断面図である。
図中、１はパツケージ、２はリードフレーム、
３はワイヤ、４はチツプ、５はダイパツド、６は
放熱器、７は接着剤、８は接合材。尚、図中、同
一符号は同一又は相当部分を示す。
FIG. 1 is an outline diagram showing a QFP semiconductor device according to an embodiment of this invention, FIG. 2 is a sectional view showing a QFP semiconductor device according to an embodiment of this invention, and FIG. 3 is an outline diagram showing a conventional QFP semiconductor device. 4 are cross-sectional views showing a conventional QFP semiconductor device. In the figure, 1 is a package, 2 is a lead frame,
3 is a wire, 4 is a chip, 5 is a die pad, 6 is a heat sink, 7 is an adhesive, and 8 is a bonding material. In the drawings, the same reference numerals indicate the same or corresponding parts.
Claims (1)
に接触させたことを特徴とする半導体装置。 A semiconductor device that generates heat, characterized in that a heat sink is brought into direct contact with a heat generating part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988078455U JPH02739U (en) | 1988-06-14 | 1988-06-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988078455U JPH02739U (en) | 1988-06-14 | 1988-06-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02739U true JPH02739U (en) | 1990-01-05 |
Family
ID=31303379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988078455U Pending JPH02739U (en) | 1988-06-14 | 1988-06-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02739U (en) |
-
1988
- 1988-06-14 JP JP1988078455U patent/JPH02739U/ja active Pending