JPH0371651U - - Google Patents
Info
- Publication number
- JPH0371651U JPH0371651U JP13324189U JP13324189U JPH0371651U JP H0371651 U JPH0371651 U JP H0371651U JP 13324189 U JP13324189 U JP 13324189U JP 13324189 U JP13324189 U JP 13324189U JP H0371651 U JPH0371651 U JP H0371651U
- Authority
- JP
- Japan
- Prior art keywords
- view
- die bonding
- frame
- resin
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000009977 dual effect Effects 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の樹脂封止半導体装置の平面図
、第２図は第１図の横断面図、第３図は第２図の
ダイボンデイングリード部の拡大図、第４図は第
３図のダイボンデイングリード部が歪んだ場合の
状態を示す断面図、第５図は本考案の他の実施例
のデユアル・インライン・パツケージＩＣの横断
面図、第６図は第５図のダイボンデイングリード
部が歪んだ場合の状態図、第７図は従来の樹脂封
止半導体装置の平面図、第８図は第７図の横断面
図、第９図は第８図のダイボンデイングリード部
の拡大図、第１０図は第９図のダイボンデイング
リード部が歪んだ場合の状態を示す断面図である
。
１……樹脂封止半導体装置本体、２……ダイボ
ンデイングリード部、３……羽状の突起、４……
結線用金属細線ボンデイングリード部、５……半
導体チツプ、６……封止樹脂、７……放熱板、８
……ダイボンデイング部、９……デユアル・イン
ライン・パツケージＩＣ本体。
FIG. 1 is a plan view of the resin-sealed semiconductor device of the present invention, FIG. 2 is a cross-sectional view of FIG. 1, FIG. 3 is an enlarged view of the die bonding lead part of FIG. 2, and FIG. FIG. 5 is a cross-sectional view of a dual in-line package IC according to another embodiment of the present invention, and FIG. 6 is a cross-sectional view of the die bonding lead shown in FIG. 7 is a plan view of a conventional resin-sealed semiconductor device, FIG. 8 is a cross-sectional view of FIG. 7, and FIG. 9 is a diagram of the die bonding lead portion of FIG. 8. The enlarged view, FIG. 10, is a sectional view showing a state in which the die bonding lead portion of FIG. 9 is distorted. DESCRIPTION OF SYMBOLS 1...Resin-sealed semiconductor device main body, 2...Die bonding lead portion, 3...Feathered protrusion, 4...
Fine metal wire bonding lead part for connection, 5... Semiconductor chip, 6... Sealing resin, 7... Heat sink, 8
...Die bonding section, 9...Dual inline package IC body.
Claims (1)
使用される半導体装置用リードフレームにおいて
、樹脂中のフレーム側面に羽状の突起が付いてい
ることを特徴とする半導体装置用リードフレーム
。 A lead frame for a semiconductor device in which a die bonding part of the frame is used as a heat sink, characterized in that a wing-like projection is attached to the side surface of the frame in a resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13324189U JPH0371651U (en) | 1989-11-15 | 1989-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13324189U JPH0371651U (en) | 1989-11-15 | 1989-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0371651U true JPH0371651U (en) | 1991-07-19 |
Family
ID=31680651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13324189U Pending JPH0371651U (en) | 1989-11-15 | 1989-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0371651U (en) |
-
1989
- 1989-11-15 JP JP13324189U patent/JPH0371651U/ja active Pending