JPH0330433U - - Google Patents
Info
- Publication number
- JPH0330433U JPH0330433U JP1989089956U JP8995689U JPH0330433U JP H0330433 U JPH0330433 U JP H0330433U JP 1989089956 U JP1989089956 U JP 1989089956U JP 8995689 U JP8995689 U JP 8995689U JP H0330433 U JPH0330433 U JP H0330433U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- inner lead
- tip
- bonding pad
- same plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000006073 displacement reaction Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案に係る半導体装置の要部図、第
２図は同半導体装置用リードフレームを示す図、
第３図は同リードフレームの要部を示す図、第４
図は、本考案の半導体装置に用いられるリードフ
レームの変形例を示す図、第５図は従来の半導体
装置のリードフレームの一例を示す平面図、第６
図はワイヤボンデイングの説明図、第７図は従来
のダイレクトボンデイングの説明図である。
１……インナーリード、２……タイバー、３…
…アウターリード、４……枠体、１０……ダイパ
ツド、１１ａ……バンプ、１１……肉薄のパター
ン、１２……変形部、２０……チツプ、３２……
曲折部、ボンデイングパツド、ｐ……バンプ。
FIG. 1 is a diagram showing the main parts of a semiconductor device according to the present invention, FIG. 2 is a diagram showing a lead frame for the semiconductor device,
Figure 3 shows the main parts of the lead frame, Figure 4 shows the main parts of the lead frame.
5 is a plan view showing an example of a lead frame of a conventional semiconductor device; FIG.
The figure is an explanatory diagram of wire bonding, and FIG. 7 is an explanatory diagram of conventional direct bonding. 1...Inner lead, 2...Tie bar, 3...
... Outer lead, 4 ... Frame body, 10 ... Die pad, 11a ... Bump, 11 ... Thin pattern, 12 ... Deformed part, 20 ... Chip, 32 ...
Bends, bonding pads, p...bumps.
Claims (1)
ードの先端が直接接続されたダイレクトボンド型
の半導体装置において、 前記ボンデイングパツドに接続されるインナー
リードは、その先端近傍でインナーリードの幅よ
りも大きく変位して同一平面内に伸びる変形部を
具備してなることを特徴とする半導体装置。[Claim for Utility Model Registration] In a direct bond type semiconductor device in which the tip of an inner lead is directly connected to a bonding pad of a semiconductor element, the inner lead connected to the bonding pad has an inner lead near the tip. 1. A semiconductor device comprising a deformed portion extending within the same plane with a displacement larger than the width of the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989089956U JPH0330433U (en) | 1989-07-31 | 1989-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989089956U JPH0330433U (en) | 1989-07-31 | 1989-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330433U true JPH0330433U (en) | 1991-03-26 |
Family
ID=31639505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989089956U Pending JPH0330433U (en) | 1989-07-31 | 1989-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330433U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007285720A (en) * | 2006-04-12 | 2007-11-01 | Chugoku Electric Power Co Inc:The | Measuring instrument |
-
1989
- 1989-07-31 JP JP1989089956U patent/JPH0330433U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007285720A (en) * | 2006-04-12 | 2007-11-01 | Chugoku Electric Power Co Inc:The | Measuring instrument |