JPH0341942U - - Google Patents
Info
- Publication number
- JPH0341942U JPH0341942U JP10251789U JP10251789U JPH0341942U JP H0341942 U JPH0341942 U JP H0341942U JP 10251789 U JP10251789 U JP 10251789U JP 10251789 U JP10251789 U JP 10251789U JP H0341942 U JPH0341942 U JP H0341942U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead frame
- semiconductor chip
- surround
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案実施例のリードフレームの平面
図、第２図は同リードフレームの要部斜視図、第
３図は通常のリードフレームを示す図、第４図は
通常の半導体装置を示す図である。
１……リードフレーム、２……半導体チツプ、
３……ワイヤ、４……封止材料、１１……ダイパ
ツト、１２……インナーリード、１３……タイバ
ー、１４……アウターリード、１５，１６……サ
イドバー、１７……サポートバー、２２……凹部
、Ｐ……パツケージライン。
Fig. 1 is a plan view of a lead frame according to an embodiment of the present invention, Fig. 2 is a perspective view of the main parts of the lead frame, Fig. 3 is a diagram showing a normal lead frame, and Fig. 4 is a diagram showing a normal semiconductor device. It is a diagram. 1...Lead frame, 2...Semiconductor chip,
3... Wire, 4... Sealing material, 11... Die pad, 12... Inner lead, 13... Tie bar, 14... Outer lead, 15, 16... Side bar, 17... Support bar, 22... ...Concavity, P...Package line.
Claims (1)
に形成された複数のインナーリードと、 各インナーリードに連設せしめられるアウター
リードとを備えたリードフレームにおいて、 前記複数のインナーリードのパツケージ領域の
内側に少なくとも１つの凹部を形成したことを特
徴とするリードフレーム。[Claims for Utility Model Registration] A lead frame including a plurality of inner leads formed radially so as to surround a semiconductor chip mounting portion, and an outer lead connected to each inner lead, comprising: A lead frame characterized in that at least one recess is formed inside the package area of the lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10251789U JPH0341942U (en) | 1989-08-31 | 1989-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10251789U JPH0341942U (en) | 1989-08-31 | 1989-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0341942U true JPH0341942U (en) | 1991-04-22 |
Family
ID=31651412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10251789U Pending JPH0341942U (en) | 1989-08-31 | 1989-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341942U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03106170U (en) * | 1990-02-16 | 1991-11-01 |
-
1989
- 1989-08-31 JP JP10251789U patent/JPH0341942U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03106170U (en) * | 1990-02-16 | 1991-11-01 |