JPH02146456U - - Google Patents
Info
- Publication number
- JPH02146456U JPH02146456U JP5695689U JP5695689U JPH02146456U JP H02146456 U JPH02146456 U JP H02146456U JP 5695689 U JP5695689 U JP 5695689U JP 5695689 U JP5695689 U JP 5695689U JP H02146456 U JPH02146456 U JP H02146456U
- Authority
- JP
- Japan
- Prior art keywords
- package
- frame
- corner
- view
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂはこの考案の一実施例によるＩＣ
の角部分の拡大部分平面図および拡大部分正面図
、第２図ａ，ｂはこの考案の他の実施例を示す同
じく拡大部分平面図および拡大部分正面図、第３
図はＱＦＰタイプの従来のＩＣ平面図、第４図ａ
，ｂは従来のＩＣの角部分の拡大部分平面図およ
び拡大部分正面図である。
図において、１はＩＣパツケージ、２はリード
、２ａはＩＣパツケージ１の角部分に位置するリ
ード、２ｂはリード２のＩＣパツケージ１に封止
された部分、２ｃはＩＣパツケージ１の境界部分
、２ｄはタイバを切除したリード部分である。な
お、図中、同一符号は同一、又は相当部分を示す
。
Figures 1a and 1b show an IC according to an embodiment of this invention.
An enlarged partial plan view and an enlarged partial front view of the corner portion of FIG.
The figure is a plan view of a conventional QFP type IC, Figure 4a
, b are an enlarged partial plan view and an enlarged partial front view of a corner portion of a conventional IC. In the figure, 1 is an IC package, 2 is a lead, 2a is a lead located at a corner of the IC package 1, 2b is a portion of the lead 2 sealed in the IC package 1, 2c is a boundary portion of the IC package 1, and 2d is the lead part with the tie bar removed. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
角に最も近いリードフレームにおいて、前記ＩＣ
パツケージとの境界部分の幅を広くしたことを特
徴とするＩＣフレーム。 In the IC frame shape, in the lead frame closest to the corner of the IC package, the IC
An IC frame characterized by a wider border between the package and the package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5695689U JPH02146456U (en) | 1989-05-16 | 1989-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5695689U JPH02146456U (en) | 1989-05-16 | 1989-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146456U true JPH02146456U (en) | 1990-12-12 |
Family
ID=31581242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5695689U Pending JPH02146456U (en) | 1989-05-16 | 1989-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146456U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05129501A (en) * | 1991-10-31 | 1993-05-25 | Nec Kyushu Ltd | Package for ic |
| JPH06181274A (en) * | 1992-12-11 | 1994-06-28 | Nec Corp | Lead frame for semiconductor part |
-
1989
- 1989-05-16 JP JP5695689U patent/JPH02146456U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05129501A (en) * | 1991-10-31 | 1993-05-25 | Nec Kyushu Ltd | Package for ic |
| JPH06181274A (en) * | 1992-12-11 | 1994-06-28 | Nec Corp | Lead frame for semiconductor part |
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