JPS62163963U - - Google Patents
Info
- Publication number
- JPS62163963U JPS62163963U JP5173286U JP5173286U JPS62163963U JP S62163963 U JPS62163963 U JP S62163963U JP 5173286 U JP5173286 U JP 5173286U JP 5173286 U JP5173286 U JP 5173286U JP S62163963 U JPS62163963 U JP S62163963U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- frame
- connecting portion
- metal sections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図、第２図は本考案に係る集積回路装置用
リードフレームの第１実施例を示すそれぞれ平面
図、樹脂封止後の平面図、第３図は本考案に係る
集積回路装置用リードフレームの第２実施例を示
す平面図、第４図は本考案に係る集積回路装置用
リードフレームの平面図、第５図乃至第７図は従
来の集積回路装置用リードフレームを示し、第５
図は平面図、第６図は樹脂封止後の平面図、第７
図は第６図の側面図である。
１，１１，２１…枠、２，７，１２，１７，２
２，２３，２４，３２，３３，３４…素子載置部
、３，８，１３，１８，２５，３５…外部リード
片、５，６，１５，１６，３０，４０…金属区分
、７０，８０…連結部、７０ａ，７０ｂ，８０ａ
，８０ｂ…スリツト。
1 and 2 are plan views showing a first embodiment of a lead frame for an integrated circuit device according to the present invention, and a plan view after resin sealing, and FIG. 3 is a plan view showing a lead frame for an integrated circuit device according to the present invention. A plan view showing a second embodiment of the frame, FIG. 4 is a plan view of a lead frame for an integrated circuit device according to the present invention, FIGS. 5 to 7 show conventional lead frames for an integrated circuit device, and FIG.
The figure is a plan view, Fig. 6 is a plan view after resin sealing, and Fig. 7 is a plan view after resin sealing.
The figure is a side view of FIG. 6. 1, 11, 21...frame, 2, 7, 12, 17, 2
2, 23, 24, 32, 33, 34... Element mounting portion, 3, 8, 13, 18, 25, 35... External lead piece, 5, 6, 15, 16, 30, 40... Metal section, 70, 80...Connection part, 70a, 70b, 80a
,80b...slit.
Claims (1)
ド片とからなる金属区分を複数個形成してなる集
積回路装置用リードフレームにおいて、隣接する
前記金属区分のそれぞれの外部リード片を連結す
る連結部を設けると共に、前記連結部内にスリツ
トを形成したことを特徴とする集積回路装置用リ
ードフレーム。 In a lead frame for an integrated circuit device comprising a plurality of metal sections formed within a frame, each of which includes at least an element mounting section and a plurality of external lead pieces, a connecting portion connects each external lead piece of the adjacent metal sections. 1. A lead frame for an integrated circuit device, characterized in that a slit is formed in the connecting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5173286U JPS62163963U (en) | 1986-04-07 | 1986-04-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5173286U JPS62163963U (en) | 1986-04-07 | 1986-04-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62163963U true JPS62163963U (en) | 1987-10-17 |
Family
ID=30876263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5173286U Pending JPS62163963U (en) | 1986-04-07 | 1986-04-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62163963U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02203544A (en) * | 1989-02-01 | 1990-08-13 | Hitachi Ltd | Manufacture of semiconductor device, lead frame to be used therefor and molding device |
-
1986
- 1986-04-07 JP JP5173286U patent/JPS62163963U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02203544A (en) * | 1989-02-01 | 1990-08-13 | Hitachi Ltd | Manufacture of semiconductor device, lead frame to be used therefor and molding device |