JPH0160547U - - Google Patents
Info
- Publication number
- JPH0160547U JPH0160547U JP15640187U JP15640187U JPH0160547U JP H0160547 U JPH0160547 U JP H0160547U JP 15640187 U JP15640187 U JP 15640187U JP 15640187 U JP15640187 U JP 15640187U JP H0160547 U JPH0160547 U JP H0160547U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- lead frame
- lead
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図および第２図はそれぞれ本考案の一実施
例のリードフレームを用いた集積回路装置の断面
図および封止樹脂を透視した部分平面図、第３図
は本考案の他の実施例を用いた集積回路装置の部
分断面図、第４図および第５図は従来のリードフ
レームを用いた樹脂封止集積回路装置の断面図お
よび封止樹脂を透視した平面図である。
１……集積回路チツプマウント部、２，３，４
……リード部、２ａ，３ａ……リードの鍔状凸起
、３ｂ……リードの凹み、６……集積回路チツプ
、７……Ａｕ線、８……封止樹脂。
1 and 2 are a sectional view and a partial plan view of an integrated circuit device using a lead frame according to an embodiment of the present invention, respectively, and a partial plan view seen through the sealing resin, and FIG. 3 is a diagram showing another embodiment of the present invention. FIGS. 4 and 5 are a partial cross-sectional view of the integrated circuit device used, and are a cross-sectional view of a resin-sealed integrated circuit device using a conventional lead frame and a plan view looking through the sealing resin. 1... Integrated circuit chip mount section, 2, 3, 4
...Lead portion, 2a, 3a... Flange-like protrusion of lead, 3b... Recess of lead, 6... Integrated circuit chip, 7... Au wire, 8... Sealing resin.
Claims (1)
て、そのリード部の前記封止樹脂に包まれる部分
の長さ方向に沿つた複数箇所に、垂直方向にかつ
全周に突出した凸起が設けられていることを特徴
とする集積回路装置用リードフレーム。 In a lead frame for a resin-sealed integrated circuit device, protrusions that protrude vertically and around the entire circumference are provided at multiple locations along the length of the portion of the lead portion that is wrapped in the sealing resin. A lead frame for an integrated circuit device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15640187U JPH0160547U (en) | 1987-10-12 | 1987-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15640187U JPH0160547U (en) | 1987-10-12 | 1987-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0160547U true JPH0160547U (en) | 1989-04-17 |
Family
ID=31434907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15640187U Pending JPH0160547U (en) | 1987-10-12 | 1987-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0160547U (en) |
-
1987
- 1987-10-12 JP JP15640187U patent/JPH0160547U/ja active Pending