JPS6298237U - - Google Patents
Info
- Publication number
- JPS6298237U JPS6298237U JP18983585U JP18983585U JPS6298237U JP S6298237 U JPS6298237 U JP S6298237U JP 18983585 U JP18983585 U JP 18983585U JP 18983585 U JP18983585 U JP 18983585U JP S6298237 U JPS6298237 U JP S6298237U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- external lead
- semiconductor device
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の樹脂封止型半導体装置の透視
概略平面図、第２図は従来の樹脂封止型半導体装
置の透視概略平面図である。
１……封止樹脂、２……半導体チツプ、３……
外部リード、４……ワイヤー、５……外部リード
の貫通孔。
FIG. 1 is a perspective schematic plan view of a resin-sealed semiconductor device of the present invention, and FIG. 2 is a perspective schematic plan view of a conventional resin-sealed semiconductor device. 1... Sealing resin, 2... Semiconductor chip, 3...
External lead, 4... wire, 5... through hole for external lead.
Claims (1)
封止の境界部に同外部リードを貫通する孔を設け
たことを特徴とする樹脂封止型半導体装置。 1. A resin-sealed semiconductor device, characterized in that a hole passing through the external lead is provided at a boundary portion of the resin-sealed external lead led out from the resin-sealed part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18983585U JPS6298237U (en) | 1985-12-10 | 1985-12-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18983585U JPS6298237U (en) | 1985-12-10 | 1985-12-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6298237U true JPS6298237U (en) | 1987-06-23 |
Family
ID=31142489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18983585U Pending JPS6298237U (en) | 1985-12-10 | 1985-12-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6298237U (en) |
-
1985
- 1985-12-10 JP JP18983585U patent/JPS6298237U/ja active Pending