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第１図は本考案の一実施例を示す外形図である 。
FIG. 1 is an outline drawing showing an embodiment of the present invention.
Claims (1)
【実用新案登録請求の範囲】[Scope of utility model registration request] 樹脂で封止された容器の４方向から外部リード が導出されている半導体装置において、前記外部 導出リードのすべてがまつすぐ下方にのびている ことを特徴とする半導体装置。 A semiconductor device in which external leads are led out from four directions of a container sealed with resin, characterized in that all of the external leads extend directly downward.