JPH0371648U - - Google Patents
Info
- Publication number
- JPH0371648U JPH0371648U JP13324089U JP13324089U JPH0371648U JP H0371648 U JPH0371648 U JP H0371648U JP 13324089 U JP13324089 U JP 13324089U JP 13324089 U JP13324089 U JP 13324089U JP H0371648 U JPH0371648 U JP H0371648U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- protrusion
- semiconductor device
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａ及びｂはそれぞれ本考案の一実施例の
側面図及び底面図、第２図ａ及びｂはそれぞれ一
実施例の変形の側面図及び底面図、第３図ａ及び
ｂはそれぞれ従来例の側面図及び底面図である。
１……外部リード、２……封止樹脂、３Ａ１，
３Ａ２，３Ｂ１，３Ｂ２……突起。
Figures 1 a and b are a side view and a bottom view of an embodiment of the present invention, Figures 2 a and b are a side view and a bottom view of a modification of the embodiment, respectively, and Figures 3 a and b are respectively a conventional FIG. 3 is a side view and a bottom view of an example. 1... External lead, 2... Sealing resin, 3A1,
3A2, 3B1, 3B2...Protrusions.
Claims (1)
特徴とする表面実装用樹脂封止型半導体装置。 A resin-sealed semiconductor device for surface mounting, characterized in that a protrusion is provided on the bottom surface of the sealing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13324089U JPH0371648U (en) | 1989-11-15 | 1989-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13324089U JPH0371648U (en) | 1989-11-15 | 1989-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0371648U true JPH0371648U (en) | 1991-07-19 |
Family
ID=31680650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13324089U Pending JPH0371648U (en) | 1989-11-15 | 1989-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0371648U (en) |
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1989
- 1989-11-15 JP JP13324089U patent/JPH0371648U/ja active Pending